Kunstmann; Thomas
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kunstmann; Thomas.The latest application filed is for "method for processing a workpiece".
- Kunstmann; Thomas - Laaber DE
| Patent | Date |
|---|---|
| Method for processing a workpiece by forming a pourous metal layer Grant 9,362,127 - Krenzer , et al. June 7, 2 | 2016-06-07 |
| Electronic device and method for fabricating an electronic device Grant 9,355,984 - Escher-Poeppel , et al. May 31, 2 | 2016-05-31 |
| Method For Processing A Workpiece App 20150031203 - KRENZER; Michael ; et al. | 2015-01-29 |
| Electronic Device And Method For Fabricating An Electronic Device App 20150021792 - Escher-Poeppel; Irmgard ; et al. | 2015-01-22 |
| Porous metal etching Grant 8,932,476 - Kunstmann , et al. January 13, 2 | 2015-01-13 |
| Porous Metal Coating App 20140242374 - Strasser; Johann ; et al. | 2014-08-28 |
| Through substrate via semiconductor components and methods of formation thereof Grant 8,815,743 - Birner , et al. August 26, 2 | 2014-08-26 |
| Porous Metal Etching App 20140217062 - Kunstmann; Thomas ; et al. | 2014-08-07 |
| Through Substrate Via Semiconductor Components And Methods of Formation Thereof App 20130267093 - Birner; Albert ; et al. | 2013-10-10 |
| Through substrate via semiconductor components Grant 8,399,936 - Birner , et al. March 19, 2 | 2013-03-19 |
| Method for processing a semiconductor wafer or die, and particle deposition device Grant 8,338,317 - Engelhardt , et al. December 25, 2 | 2012-12-25 |
| Method For Processing A Semiconductor Wafer Or Die, And Particle Deposition Device App 20120256323 - Engelhardt; Manfred ; et al. | 2012-10-11 |
| Semiconductor device and method for making same Grant 8,101,517 - Frank , et al. January 24, 2 | 2012-01-24 |
| Semiconductor Device And Method For Making Same App 20110074040 - Frank; Manfred ; et al. | 2011-03-31 |
| Through Substrate Via Semiconductor Components App 20100230818 - Birner; Albert ; et al. | 2010-09-16 |
| Through substrate via semiconductor components Grant 7,772,123 - Birner , et al. August 10, 2 | 2010-08-10 |
| Through Substrate Via Semiconductor Components App 20090302480 - Birner; Albert ; et al. | 2009-12-10 |
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