KUNO; Takaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for KUNO; Takaki.The latest application filed is for "method of evaluating adhesion property, low-adhesion material, and mold for molding resin".

Company Profile

0.7.11

KUNO; Takaki - Kyoto-shi JP
Kuno; Takaki - Kyoto JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin App 20120076886 - KUNO; Takaki ; et al.	2012-03-29
Low-adhesion material, resin molding die, and soil resistant material Grant 7,901,797 - Kuno , et al. March 8, 2	2011-03-08
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin App 20110042857 - KUNO; Takaki ; et al.	2011-02-24
Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material Grant 7,784,764 - Kuno , et al. August 31, 2	2010-08-31
Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material Grant 7,732,037 - Kuno , et al. June 8, 2	2010-06-08
Method Of Evaluating Adhesion Property, Low-adhesion Material, And Mold For Molding Resin App 20100012816 - Kuno; Takaki ; et al.	2010-01-21
Method of evaluating adhesion property, low-adhesion material, and mold for molding resin Grant 7,614,293 - Kuno , et al. November 10, 2	2009-11-10
Low-Adhesion Material, Resin Molding Die, and Soil Resistant Material App 20090107361 - Kuno; Takaki ; et al.	2009-04-30
Low Adhesion Material, Resin Molding Die, and Soil Resistant Material App 20080296532 - Kuno; Takaki ; et al.	2008-12-04
Method of Evaluating Adhesion Property, Low-Adhesion Material, and Mold for Molding Resin App 20080254286 - Kuno; Takaki ; et al.	2008-10-16
Composite material and resin mold Grant 7,407,146 - Kuno , et al. August 5, 2	2008-08-05
Resin mold material and resin mold Grant 7,287,975 - Bandoh , et al. October 30, 2	2007-10-30
Conductive porous material, resin molding die employing the same, and method of preparing conductive porous material App 20060286346 - Kuno; Takaki ; et al.	2006-12-21
Resin casting mold and method of casting resin App 20060131780 - Kuno; Takaki ; et al.	2006-06-22
Low-adhesion material and mold for molding resin using the same App 20060093693 - Kuno; Takaki ; et al.	2006-05-04
Composite material and resin mold App 20050154113 - Kuno, Takaki ; et al.	2005-07-14
Resin mold material and resin mold App 20040253334 - Bandoh, Kazuhiko ; et al.	2004-12-16
Method of sealing electronic parts with molded resin and mold employed therefor Grant 5,753,538 - Kuno , et al. May 19, 1	1998-05-19

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