Kunishi; Tatsuo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kunishi; Tatsuo.The latest application filed is for "method for manufacturing ceramic electronic component and ceramic electronic component".

Company Profile

1.22.21

Kunishi; Tatsuo - Nagaokakyo JP
KUNISHI; Tatsuo - Nagaokakyo-shi JP
KUNISHI; Tatsuo - Moriyama-shi JP
Kunishi; Tatsuo - Moriyama N/A JP
Kunishi; Tatsuo - Shiga-ken JP
Kunishi; Tatsuo - Takefu JP
Kunishi, Tatsuo - Takefu-shi JP
Kunishi; Tatsuo - Omihachiman JP
Kunishi; Tatsuo - Kyoto JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing ceramic electronic component and ceramic electronic component Grant 10,971,305 - Tsutsumi , et al. April 6, 2	2021-04-06
Method For Manufacturing Ceramic Electronic Component And Ceramic Electronic Component App 20200066449 - TSUTSUMI; Masaki ; et al.	2020-02-27
Method For Selectively Coating Electronic Component With Coating Material, And Method For Manufacturing Electronic Component App 20190304684 - YOSHIDA; YASUSHI ; et al.	2019-10-03
Method for producing ceramic electronic component Grant 9,704,649 - Saito , et al. July 11, 2	2017-07-11
Method for producing ceramic electronic component Grant 9,490,066 - Saito , et al. November 8, 2	2016-11-08
Method And Apparatus For Producing A Ceramic Electronic Component App 20130152351 - OGAWA; Makoto ; et al.	2013-06-20
Method For Producing Ceramic Electronic Component App 20130141836 - SAITO; Junichi ; et al.	2013-06-06
Method for producing ceramic body Grant 8,448,313 - Kunishi , et al. May 28, 2	2013-05-28
Ceramic Body And Method For Producing The Same App 20130076203 - SAITO; Junichi ; et al.	2013-03-28
Method and apparatus for producing a ceramic electronic component Grant 8,400,754 - Ogawa , et al. March 19, 2	2013-03-19
Method for manufacturing laminated electronic component Grant 8,341,815 - Kunishi , et al. January 1, 2	2013-01-01
Laminated electronic component Grant 8,154,849 - Kunishi , et al. April 10, 2	2012-04-10
Monolithic ceramic electronic component and method of manufacturing monolithic ceramic electronic component Grant 8,102,640 - Ogawa , et al. January 24, 2	2012-01-24
Method For Producing Ceramic Electronic Component App 20110287176 - SAITO; Junichi ; et al.	2011-11-24
Method For Producing Ceramic Body App 20110252629 - KUNISHI; Tatsuo ; et al.	2011-10-20
Capacitor And Method For Manufacturing The Same App 20110020603 - KUNISHI; Tatsuo ; et al.	2011-01-27
Laminated Electronic Component And Method For Manufacturing The Same App 20100243133 - KUNISHI; Tatsuo ; et al.	2010-09-30
Method for manufacturing ceramic electronic component and planting bath Grant 7,765,661 - Motoki , et al. August 3, 2	2010-08-03
Method And Apparatus For Producing A Ceramic Electronic Component App 20100149724 - OGAWA; Makoto ; et al.	2010-06-17
Laminated electronic component and method for manufacturing the same Grant 7,719,819 - Motoki , et al. May 18, 2	2010-05-18
Monolithic Ceramic Electronic Component And Method Of Manufacturing Monolithic Ceramic Electronic Component App 20090303656 - OGAWA; Makoto ; et al.	2009-12-10
Laminated electronic component and method for manufacturing the same Grant 7,589,951 - Kunishi , et al. September 15, 2	2009-09-15
Multilayer electronic device and method for manufacturing the same Grant 7,589,952 - Motoki , et al. September 15, 2	2009-09-15
Method For Manufacturing Ceramic Electronic Component And Planting Bath App 20090049679 - Motoki; Akihiro ; et al.	2009-02-26
Multilayer Electronic Device And Method For Manufacturing The Same App 20080225462 - MOTOKI; Akihiro ; et al.	2008-09-18
Laminated Electronic Component And Method For Manufacturing The Same App 20080151470 - MOTOKI; Akihiro ; et al.	2008-06-26
Method Of Manufacturing Multilayer Electronic Component App 20080145551 - KUNISHI; Tatsuo ; et al.	2008-06-19
Laminated Electronic Component And Method For Manufacturing The Same App 20080123248 - Kunishi; Tatsuo ; et al.	2008-05-29
Laminated Electronic Component And Method For Manufacturing The Same App 20080123249 - Kunishi; Tatsuo ; et al.	2008-05-29
Method of manufacturing electronic part, electronic part and electroless plating method Grant 6,780,456 - Kunishi , et al. August 24, 2	2004-08-24
Process for manufacturing electronic part Grant 6,769,160 - Higuchi , et al. August 3, 2	2004-08-03
Electroless copper plating bath, electroless copper plating method and electronic part Grant 6,660,071 - Yoshida , et al. December 9, 2	2003-12-09
Method of manufacturing electronic part, electronic part and electroless plating method App 20030138571 - Kunishi, Tatsuo ; et al.	2003-07-24
Electronic part and method for manufacturing the same App 20030134050 - Kunishi, Tatsuo ; et al.	2003-07-17
Electronic parts, and process for manufacturing electronic parts App 20020135972 - Higuchi, Shoichi ; et al.	2002-09-26
Electroless copper plating bath, electroless copper plating method and electronic part App 20020011176 - Yoshida, Yasushi ; et al.	2002-01-31
Electronic component having a tin alloy plating film Grant 6,195,248 - Kunishi , et al. February 27, 2	2001-02-27
Thin power supply unit Grant 5,367,431 - Kunishi , et al. November 22, 1	1994-11-22
Method of fabricating flat type electrochemical device Grant 5,279,623 - Watanabe , et al. January 18, 1	1994-01-18
Stacked electric double layer capacitor Grant 5,227,960 - Kunishi , et al. July 13, 1	1993-07-13

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