Kung; Yao-Hsiung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kung; Yao-Hsiung.The latest application filed is for "device used for detecting clamping force of processed object and method thereof".

Company Profile

0.4.5

Kung; Yao-Hsiung - Tao Yuan Hsien TW
Kung; Yao-Hsiung - Hsien TW
Kung, Yao-Hsiung - Lu Chu Hsiang TW
Kung; Yao-Hsiung - Taoyuan TW
Kung, Yao-Hsiung - Pingtung Hsien TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer cleaning apparatus with multiple wash-heads Grant 7,252,099 - Chen , et al. August 7, 2	2007-08-07
Method and apparatus for detecting wafer flaw Grant 6,941,811 - Chen , et al. September 13, 2	2005-09-13
Device used for detecting clamping force of processed object and method thereof Grant 6,920,796 - Chen , et al. July 26, 2	2005-07-26
Device Used For Detecting Clamping Force Of Processed Object And Method Thereof App 20050103121 - Chen, Chih-Kun ; et al.	2005-05-19
Wafer cleaning apparatus with multiple wash-heads App 20050051200 - Chen, Chih-Kun ; et al.	2005-03-10
Method and apparatus for detecting wafer flaw App 20050028594 - Chen, Chih-Kun ; et al.	2005-02-10
Humidity sensor and fabrication method thereof Grant 6,834,547 - Chen , et al. December 28, 2	2004-12-28
Humidity sensor and fabrication method thereof App 20040040378 - Chen, Chih-Kun ; et al.	2004-03-04
Polishing pad showing intrinsic abrasion and fabrication method thereof App 20040038631 - Chen, Chih-Kun ; et al.	2004-02-26

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