Kung; Hsien-Chin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kung; Hsien-Chin.The latest application filed is for "method for manufacturing flip-chip light emitting diode package".
- Kung; Hsien-Chin - Taoyuan City TW
- Kung; Hsien-Chin - Junghe Taipei 235 TW
- Kung, Hsien-Chin - Junghe City TW
| Patent | Date |
|---|---|
| Method For Manufacturing Flip-chip Light Emitting Diode Package App 20090121252 - Hsu; Hung-Tsung ; et al. | 2009-05-14 |
| Method For Manufacturing Light Emitting Diode Package App 20090023234 - HSU; Hung-Tsung ; et al. | 2009-01-22 |
| Embedded multimedia speaker structure Grant 6,910,549 - Kung June 28, 2 | 2005-06-28 |
| Embedded multimedia speaker structure App 20040251078 - Kung, Hsien-Chin | 2004-12-16 |
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