KUNG; Cheng-Yuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for KUNG; Cheng-Yuan.The latest application filed is for "semiconductor package structure and method for manufacturing the same".
- KUNG; Cheng-Yuan - Kaohsiung TW
| Patent | Date |
|---|---|
| Semiconductor Package Structure And Method For Manufacturing The Same App 20220293538 - KUNG; Cheng-Yuan ; et al. | 2022-09-15 |
| Semiconductor Package Structure And Method For Manufacturing The Same App 20220181268 - KUNG; Cheng-Yuan ; et al. | 2022-06-09 |
| Semiconductor Package Structure And Method For Manufacturing The Same App 20220181267 - KUNG; Cheng-Yuan ; et al. | 2022-06-09 |
| Semiconductor package structure and method for manufacturing the same Grant 11,348,885 - Kung , et al. May 31, 2 | 2022-05-31 |
| Semiconductor Package Structure And Method For Manufacturing The Same App 20220157709 - Shih; Hsu-Chiang ; et al. | 2022-05-19 |
| Assembly Structure And Package Structure App 20220148974 - KUNG; Cheng-Yuan ; et al. | 2022-05-12 |
| Semiconductor device packages and methods of manufacturing the same Grant 11,296,043 - Kung , et al. April 5, 2 | 2022-04-05 |
| Assembly structure and package structure Grant 11,233,010 - Kung , et al. January 25, 2 | 2022-01-25 |
| Semiconductor package and semiconductor process Grant 11,201,125 - Hsieh , et al. December 14, 2 | 2021-12-14 |
| Device assembly structure and method of manufacturing the same Grant 11,189,604 - Hung , et al. November 30, 2 | 2021-11-30 |
| Semiconductor Device Package And Method Of Manufacturing The Same App 20210280744 - CHEN; Tang-Yuan ; et al. | 2021-09-09 |
| Semiconductor Package Structure And Method For Manufacturing The Same App 20210202409 - KUNG; Cheng-Yuan ; et al. | 2021-07-01 |
| Assembly Structure And Package Structure App 20210202392 - KUNG; Cheng-Yuan ; et al. | 2021-07-01 |
| Semiconductor package structure and method of manufacturing the same Grant 11,037,846 - Chen , et al. June 15, 2 | 2021-06-15 |
| Semiconductor Device Packages And Methods Of Manufacturing The Same App 20210175189 - KUNG; Cheng-Yuan ; et al. | 2021-06-10 |
| System Comprising Packaged Optical Devices App 20210167856 - LIN; Chang-Yu ; et al. | 2021-06-03 |
| Device Assembly Structure And Method Of Manufacturing The Same App 20210111165 - HUNG; Chao-Kai ; et al. | 2021-04-15 |
| Semiconductor Package Structure And Method Of Manufacturing The Same App 20210090965 - CHEN; Chien-Hua ; et al. | 2021-03-25 |
| System comprising packaged optical devices Grant 10,903,907 - Lin , et al. January 26, 2 | 2021-01-26 |
| Package Structure And Method For Manufacturing The Same App 20200035654 - CHEN; Chien-Hua ; et al. | 2020-01-30 |
| Capacitor Bank Structure, Semiconductor Package Structure And Method For Manufacturing The Same App 20190393297 - KUNG; Cheng-Yuan ; et al. | 2019-12-26 |
| Electrical device Grant 10,490,341 - Kung , et al. Nov | 2019-11-26 |
| Semiconductor device package Grant 10,475,734 - Chen , et al. Nov | 2019-11-12 |
| MEMS device package and method for manufacturing the same Grant 10,472,228 - Chen , et al. Nov | 2019-11-12 |
| Semiconductor device package comprising a dielectric layer with built-in inductor Grant 10,475,718 - Chen , et al. Nov | 2019-11-12 |
| Semiconductor Device Package App 20190181082 - CHEN; Chien-Hua ; et al. | 2019-06-13 |
| Electrical Device App 20190057809 - KUNG; Cheng-Yuan ; et al. | 2019-02-21 |
| Mems Device Package And Method For Manufacturing The Same App 20190055118 - CHEN; Chien-Hua ; et al. | 2019-02-21 |
| Semiconductor device package Grant 10,211,137 - Chen , et al. Feb | 2019-02-19 |
| Semiconductor Device Package App 20180358291 - CHEN; Chien-Hua ; et al. | 2018-12-13 |
| Semiconductor Device Package App 20180337164 - CHEN; Chien-Hua ; et al. | 2018-11-22 |
| Semiconductor Package And Semiconductor Process App 20180247904 - HSIEH; Sheng-Chi ; et al. | 2018-08-30 |
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