loadpatents
Patent applications and USPTO patent grants for Kung; Chang-Hung.The latest application filed is for "via structure and method of forming the same".
Patent | Date |
---|---|
Method for manufacturing semiconductor device and device manufactured by the same Grant 9,384,996 - Huang , et al. July 5, 2 | 2016-07-05 |
Via Structure And Method Of Forming The Same App 20160013100 - Li; Kun-Ju ;   et al. | 2016-01-14 |
Method For Manufacturing Semiconductor Device And Device Manufactured By The Same App 20150325574 - Huang; Po-Cheng ;   et al. | 2015-11-12 |
Manufacturing method for a shallow trench isolation Grant 9,012,300 - Sie , et al. April 21, 2 | 2015-04-21 |
Method Of Forming Semiconductor Structure App 20150079780 - Liu; Yl-Liang ;   et al. | 2015-03-19 |
Method for fabricating semiconductor device Grant 8,940,600 - Hsu , et al. January 27, 2 | 2015-01-27 |
Method For Fabricating Semiconductor Device App 20140273371 - Hsu; Chun-Wei ;   et al. | 2014-09-18 |
Semiconductor device Grant 8,779,526 - Hsu , et al. July 15, 2 | 2014-07-15 |
Semiconductor process Grant 8,765,588 - Huang , et al. July 1, 2 | 2014-07-01 |
Semiconductor Device Having Metal Gate And Manufacturing Method Thereof App 20140106558 - Hsu; Chun-Wei ;   et al. | 2014-04-17 |
Manufacturing Method For A Shallow Trench Isolation App 20140094017 - Sie; Wu-Sian ;   et al. | 2014-04-03 |
Semiconductor process Grant 8,647,986 - Huang , et al. February 11, 2 | 2014-02-11 |
Semiconductor device having metal gate and manufacturing method thereof Grant 8,643,069 - Hsu , et al. February 4, 2 | 2014-02-04 |
Poly opening polish process Grant 8,513,128 - Hsu , et al. August 20, 2 | 2013-08-20 |
Semiconductor Device App 20130105912 - Hsu; Chun-Wei ;   et al. | 2013-05-02 |
Semiconductor Process App 20130078792 - Huang; Pong-Wey ;   et al. | 2013-03-28 |
Semiconductor Process App 20130052825 - Huang; Po-Cheng ;   et al. | 2013-02-28 |
Semiconductor Device Having Metal Gate And Manufacturing Method Thereof App 20130015524 - Hsu; Chun-Wei ;   et al. | 2013-01-17 |
Poly Opening Polish Process App 20120322265 - HSU; Chun-Wei ;   et al. | 2012-12-20 |
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