KUMMERL; Steven Alfred
Patent Applications and Registrations
Patent applications and USPTO patent grants for KUMMERL; Steven Alfred.The latest application filed is for "film covers for sensor packages".
Company Profile
11.12.25
- KUMMERL; Steven Alfred - Carrollton TX
- Kummerl; Steven Alfred - Carrolton TX
- Kummerl; Steven Alfred - Plano TX
Patent Activity
| Patent | Date |
|---|---|
| Film Covers For Sensor Packages App 20220181224 - KODURI; Sreenivasan Kalyani ; et al. | 2022-06-09 |
| Semiconductor devices and methods and apparatus to produce such semiconductor devices Grant 11,296,016 - Neidorff , et al. April 5, 2 | 2022-04-05 |
| Integrated inductor with magnetic mold compound Grant 11,270,937 - Hou , et al. March 8, 2 | 2022-03-08 |
| Mechanical Couplings Designed To Resolve Process Constraints App 20210375640 - CHIEN; Yuh-Harng ; et al. | 2021-12-02 |
| Shape Memory Polymer For Use In Semiconductor Device Fabrication App 20210313241 - KUMMERL; Steven Alfred ; et al. | 2021-10-07 |
| Electronic device with three dimensional thermal pad Grant 11,081,428 - Chou , et al. August 3, 2 | 2021-08-03 |
| Exposed Heat-generating Devices App 20210118779 - CHOU; Hung-Yu ; et al. | 2021-04-22 |
| Integrated Filter Optical Package App 20210050459 - Kummerl; Steven Alfred ; et al. | 2021-02-18 |
| Electronic Device With Three Dimensional Thermal Pad App 20210043548 - Chou; Stanley ; et al. | 2021-02-11 |
| Integrated Inductor With Magnetic Mold Compound App 20200211959 - HOU; Dongbin ; et al. | 2020-07-02 |
| Self-assembly of semiconductor die onto a leadframe using magnetic fields Grant 10,553,573 - Revier , et al. Fe | 2020-02-04 |
| Packages With Multiple Exposed Pads App 20190355652 - CHOU; Hung-Yu ; et al. | 2019-11-21 |
| Mechanical Couplings Designed To Resolve Process Constraints App 20190326131 - CHIEN; Yuh-Harng ; et al. | 2019-10-24 |
| Mechanical Couplings Designed To Resolve Process Constraints App 20190206699 - CHIEN; Yuh-Harng ; et al. | 2019-07-04 |
| Mechanical couplings designed to resolve process constraints Grant 10,340,152 - Chien , et al. | 2019-07-02 |
| Semiconductor Devices And Methods And Apparatus To Produce Such Semiconductor Devices App 20190139868 - Neidorff; Robert Allan ; et al. | 2019-05-09 |
| Self-assembly of Semiconductor Die onto a Leadframe Using Magnetic Fields App 20190074270 - Revier; Daniel Lee ; et al. | 2019-03-07 |
| Printed interconnects for semiconductor packages Grant 9,679,864 - Cook , et al. June 13, 2 | 2017-06-13 |
| Semiconductor package with printed sensor Grant 9,646,906 - Cook , et al. May 9, 2 | 2017-05-09 |
| Printed Interconnects For Semiconductor Packages App 20170033072 - Cook; Benjamin Stassen ; et al. | 2017-02-02 |
| Printed interconnects for semiconductor packages Grant 9,496,171 - Cook , et al. November 15, 2 | 2016-11-15 |
| Printed Interconnects For Semiconductor Packages App 20160093525 - COOK; BENJAMIN STASSEN ; et al. | 2016-03-31 |
| Semiconductor Package With Printed Sensor App 20160093548 - COOK; BENJAMIN STASSEN ; et al. | 2016-03-31 |
| Heart Pulse Monitor Including A Fluxgate Sensor App 20150105630 - KUMMERL; STEVEN ALFRED ; et al. | 2015-04-16 |
| Leadframe Having Delamination Resistant Die Pad App 20110012243 - SAHASRABUDHE; Kapil Heramb ; et al. | 2011-01-20 |
| Leadframe having delamination resistant die pad Grant 7,821,113 - Sahasrabudhe , et al. October 26, 2 | 2010-10-26 |
| Leadframe Having Delamination Resistant Die Pad App 20090294932 - Sahasrabudhe; Kapil Heramb ; et al. | 2009-12-03 |
| Plastic semiconductor packages having improved metal land-locking features Grant 7,504,713 - Holloway , et al. March 17, 2 | 2009-03-17 |
| Plastic Semiconductor Packages Having Improved Metal Land-locking Features App 20080169554 - Holloway; Jeffrey Gail ; et al. | 2008-07-17 |
| Semiconductor dies and methods and apparatus to mold lock a semiconductor die App 20080073757 - Kummerl; Steven Alfred ; et al. | 2008-03-27 |
| Method for Manufacturing Transparent Windows in Molded Semiconductor Packages App 20070292982 - Holloway; Jeffery Gail ; et al. | 2007-12-20 |
| Integrated Circuit Chip Packaging Assembly App 20070259484 - Kummerl; Steven Alfred ; et al. | 2007-11-08 |
| Integrated circuit chip packaging assembly Grant 7,256,482 - Kummerl , et al. August 14, 2 | 2007-08-14 |
| Bond Capillary Design for Ribbon Wire Bonding App 20070181652 - Lange; Bernhard P. ; et al. | 2007-08-09 |
| Bond capillary design for ribbon wire bonding Grant 7,216,794 - Lange , et al. May 15, 2 | 2007-05-15 |
| Magnetic assist manufacturing to reduce mold flash and assist with heat slug assembly App 20060255479 - Kummerl; Steven Alfred ; et al. | 2006-11-16 |
| Integrated circuit chip packaging assembly App 20060033185 - Kummerl; Steven Alfred ; et al. | 2006-02-16 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 