Kummerl; Steven
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kummerl; Steven.The latest application filed is for "floating die package".
- Kummerl; Steven - Carrollton TX
- - Carrollton TX US
| Patent | Date |
|---|---|
| Floating Die Package App 20210091012 - Cook; Benjamin Stassen ; et al. | 2021-03-25 |
| Integrated Circuit Chip With A Vertical Connector App 20210028093 - Castro; Abram M. ; et al. | 2021-01-28 |
| Standoff connector for electrical devices Grant 10,887,993 - Kummerl January 5, 2 | 2021-01-05 |
| Floating die package Grant 10,861,796 - Cook , et al. December 8, 2 | 2020-12-08 |
| Integrated circuit chip with a vertical connector Grant 10,804,185 - Castro , et al. October 13, 2 | 2020-10-13 |
| Custom Leadframe From Standard Plus Printed Leadframe Portion App 20200083147 - BITO; JO ; et al. | 2020-03-12 |
| Method For Improving Transistor Performance App 20200035833A1 - | 2020-01-30 |
| Interposer with extruded feed-through vias Grant 10,535,594 - Kummerl Ja | 2020-01-14 |
| Method for improving transistor performance Grant 10,431,684 - Kummerl , et al. O | 2019-10-01 |
| Thermoelectric Device Embedded In A Printed Circuit Board App 20180323361 - Edwards; Henry L. ; et al. | 2018-11-08 |
| Floating Die Package App 20170330841 - Cook; Benjamin Stassen ; et al. | 2017-11-16 |
| Method For Improving Transistor Performance App 20170309748 - Kummerl; Steven ; et al. | 2017-10-26 |
| Standoff Connector For Electrical Devices App 20170196090 - KUMMERL; Steven | 2017-07-06 |
| Integrated Circuit Chip With A Vertical Connector App 20170194233 - Castro; Abram M. ; et al. | 2017-07-06 |
| Transfer Mold Compound Mixture For Fabricating An Electronic Circuit App 20160268023 - Kummerl; Steven ; et al. | 2016-09-15 |
| Method of fabricating an electronic circuit Grant 9,378,882 - Kummerl , et al. June 28, 2 | 2016-06-28 |
| Interposer With Extruded Feed-through Vias App 20160163630 - KUMMERL; STEVEN | 2016-06-09 |
| Interposer with extruded feed-through vias Grant 9,241,405 - Kummerl January 19, 2 | 2016-01-19 |
| Interposer With Extruded Feed-through Vias App 20130233609 - KUMMERL; STEVEN | 2013-09-12 |
| Thermoelectric Device Embedded In A Printed Circuit Board App 20130192655 - Edwards; Henry L. ; et al. | 2013-08-01 |
| Electronic Device And Method Of Making App 20130154148 - Kummerl; Steven ; et al. | 2013-06-20 |
| Integrated Shunt Resistor With External Contact In A Semiconductor Package App 20120199951 - Udompanyavit; Ubol ; et al. | 2012-08-09 |
| Manufacturing method for integrating a shunt resistor into a semiconductor package Grant 8,129,228 - Udompanyavit , et al. March 6, 2 | 2012-03-06 |
| Manufacturing Method for Integrating a Shunt Resistor into a Semiconductor Package App 20110033985 - Udompanyavit; Ubol ; et al. | 2011-02-10 |
| Manufacturing method for integrating a shunt resistor into a semiconductor package Grant 7,847,391 - Udompanyavit , et al. December 7, 2 | 2010-12-07 |
| Leadframe and mold compound interlock in packaged semiconductor device Grant 7,741,704 - Lange , et al. June 22, 2 | 2010-06-22 |
| Manufacturing Method For Integrating A Shunt Resistor Into A Semiconductor Package App 20100001382 - Udompanyavit; Ubol ; et al. | 2010-01-07 |
| Leadframe And Mold Compound Interlock In Packaged Semiconductor Device App 20080093715 - Lange; Bernhard ; et al. | 2008-04-24 |
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