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name:-0.0057611465454102
name:-0.0017879009246826
Kumeta; Shohei Patent Filings

Kumeta; Shohei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kumeta; Shohei.The latest application filed is for "bonding method, method for manufacturing structure, and structure".

Company Profile
1.4.4
  • Kumeta; Shohei - Tokyo JP
  • Kumeta; Shohei - Sakura JP
  • Kumeta; Shohei - Sakura-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Bonding structure on gold thin film
Grant 10,668,696 - Kumeta , et al.
2020-06-02
Light guide device, manufacturing method, and laser diode module
Grant 10,379,291 - Sakamoto , et al. A
2019-08-13
Light guiding device, manufacturing method, and LD module
Grant 9,864,142 - Sakamoto , et al. January 9, 2
2018-01-09
Light guiding device, method for producing same, and LD module
Grant 9,645,389 - Kumeta , et al. May 9, 2
2017-05-09
Bonding Method, Method For Manufacturing Structure, And Structure
App 20170100917 - Kumeta; Shohei ;   et al.
2017-04-13
Light Guiding Device, Manufacturing Method, And Ld Module
App 20170010417 - Sakamoto; Shinichi ;   et al.
2017-01-12
Light Guide Device, Manufacturing Method, And Laser Diode Module
App 20160252679 - Sakamoto; Shinichi ;   et al.
2016-09-01
Light Guiding Device, Method For Producing Same, And Ld Module
App 20150219890 - Kumeta; Shohei ;   et al.
2015-08-06

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