Kumbhat; Nitesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kumbhat; Nitesh.The latest application filed is for "printed circuit board with cavity".

Company Profile

2.14.17

Kumbhat; Nitesh - San Jose CA
Kumbhat; Nitesh - Atlanta GA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printed circuit board with cavity Grant 10,827,617 - Zhang , et al. November 3, 2	2020-11-03
Printed Circuit Board With Cavity App 20200245465 - Kind Code	2020-07-30
Module with embedded side shield structures and method of fabricating the same Grant 10,163,808 - Kumbhat , et al. Dec	2018-12-25
Circuit package with segmented external shield to provide internal shielding between electronic components Grant 10,134,682 - Kumbhat , et al. November 20, 2	2018-11-20
Module with internal wire fence shielding Grant 10,021,790 - Jeong , et al. July 10, 2	2018-07-10
Module with external shield and back-spill barrier for protecting contact pads Grant 9,974,181 - Haney , et al. May 15, 2	2018-05-15
Printed Circuit Board (pcb) And Pcb Assembly Having An Encapsulating Mold Material On A Bottom Surface Thereof And Methods For Molding An Encapsulating Mold Material On A Bottom Surface Of A Pcb App 20180063951 - Kumbhat; Nitesh ; et al.	2018-03-01
Printed circuit board (PCB) and PCB assembly having an encapsulating mold material on a bottom surface thereof and methods for molding an encapsulating mold material on a bottom surface of a PCB Grant 9,907,169 - Kumbhat , et al. February 27, 2	2018-02-27
Module With External Shield And Back-spill Barrier For Protecting Contact Pads App 20170280561 - Haney; Sarah ; et al.	2017-09-28
Module With Internal Wire Fence Shielding App 20170251576 - Jeong; Jin ; et al.	2017-08-31
Method Of Forming Solder Bumps On Solid State Module Including Printed Cirucuit Board App 20170213785 - Kumbhat; Nitesh	2017-07-27
Circuit Package With Bond Wires To Provide Internal Shielding Between Electronic Components App 20170118877 - Kumbhat; Nitesh ; et al.	2017-04-27
Circuit Package With Segmented External Shield To Provide Internal Shielding Between Electronic Components App 20170117230 - Kumbhat; Nitesh ; et al.	2017-04-27
Circuit Package With Trench Features To Provide Internal Shielding Between Electronic Components App 20170117229 - Kumbhat; Nitesh ; et al.	2017-04-27
Module With Embedded Side Shield Structures And Method Of Fabricating The Same App 20170118875 - Kumbhat; Nitesh ; et al.	2017-04-27
Semiconductor Chip Module App 20170062352 - Choi; Deog-Soon ; et al.	2017-03-02
Interconnect structures and methods of making the same Grant 9,173,282 - Raj , et al. October 27, 2	2015-10-27
Stress relieving second level interconnect structures and methods of making the same Grant 8,970,036 - Raj , et al. March 3, 2	2015-03-03
Magnetic Device Utilizing Nanocomposite Films Layered With Adhesives App 20140347157 - Pulugurtha; Markondeya Raj ; et al.	2014-11-27
Interconnect assemblies and methods of making and using same Grant 8,633,601 - Kumbhat , et al. January 21, 2	2014-01-21
Second Level Interconnect Structures and Methods of Making the Same App 20130270695 - Raj; Pulugurtha Markondeya ; et al.	2013-10-17
Chip-last embedded interconnect structures Grant 8,536,695 - Liu , et al. September 17, 2	2013-09-17
Interconnect Structures And Methods Of Making The Same App 20130107485 - Raj; Pulugurtha Markondeya ; et al.	2013-05-02
Chip-last Embedded Interconnect Structures And Methods Of Making The Same App 20120228754 - LIU; FUHAN ; et al.	2012-09-13
Interconnect Assemblies And Methods Of Making And Using Same App 20120104603 - Kumbhat; Nitesh ; et al.	2012-05-03

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