loadpatents
name:-0.018473148345947
name:-0.020414113998413
name:-0.001600980758667
Kumazawa; Kentaro Patent Filings

Kumazawa; Kentaro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kumazawa; Kentaro.The latest application filed is for "ink jet device".

Company Profile
1.20.15
  • Kumazawa; Kentaro - Osaka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Ink jet device
Grant 11,279,133 - Yoshida , et al. March 22, 2
2022-03-22
Ink Jet Device
App 20210094293 - YOSHIDA; Hidehiro ;   et al.
2021-04-01
Ink jet printing method printing a test substrate and a printing target
Grant 10,369,783 - Kumazawa , et al.
2019-08-06
Ink-jet Printing Method
App 20180222180 - KUMAZAWA; KENTARO ;   et al.
2018-08-09
Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
Grant 8,895,359 - Tomura , et al. November 25, 2
2014-11-25
Method of manufacturing mounting structure and mounting structure
Grant 8,436,253 - Higuchi , et al. May 7, 2
2013-05-07
Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
Grant 8,426,965 - Iwase , et al. April 23, 2
2013-04-23
Semiconductor device having stable signal transmission at high speed and high frequency
Grant 8,415,794 - Kumazawa , et al. April 9, 2
2013-04-09
Resin sealing structure for electronic component and resin sealing method for electronic component
Grant 8,358,018 - Imanishi , et al. January 22, 2
2013-01-22
Semiconductor Device Mounted Structure And Its Manufacturing Method, Semiconductor Device Mounting Method, And Pressing Tool
App 20120298310 - IWASE; Teppei ;   et al.
2012-11-29
Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
Grant 8,264,079 - Iwase , et al. September 11, 2
2012-09-11
Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus
Grant 8,163,599 - Tomura , et al. April 24, 2
2012-04-24
Mounting structure and mounting method
Grant 8,080,884 - Nakamura , et al. December 20, 2
2011-12-20
Semiconductor device
Grant 8,050,049 - Iwase , et al. November 1, 2
2011-11-01
Semiconductor chip assembly and fabrication method therefor
Grant 8,035,225 - Nakamura , et al. October 11, 2
2011-10-11
Semiconductor chip and semiconductor device
Grant 7,994,638 - Tomura , et al. August 9, 2
2011-08-09
Electrode junction structure and manufacturing method thereof
Grant 7,985,078 - Kumazawa , et al. July 26, 2
2011-07-26
Semiconductor Device, Flip-chip Mounting Method And Flip-chip Mounting Apparatus
App 20110175237 - Tomura; Yoshihiro ;   et al.
2011-07-21
Electronic circuit device and method for manufacturing same
Grant 7,910,406 - Kumazawa , et al. March 22, 2
2011-03-22
Method Of Manufacturing Mounting Structure And Mounting Structure
App 20110061913 - Higuchi; Takayuki ;   et al.
2011-03-17
Semiconductor Device And Method For Manufacturing Same
App 20110042808 - Kumazawa; Kentaro ;   et al.
2011-02-24
Flip-chip Mounting Method, Flip-chip Mounting Apparatus And Tool Protection Sheet Used In Flip-chip Mounting Apparatus
App 20110020983 - Tomura; Yoshihiro ;   et al.
2011-01-27
Semiconductor Device
App 20100265683 - IWASE; Teppei ;   et al.
2010-10-21
Semiconductor Device Mounted Structure And Its Manufacturing Method, Semiconductor Device Mounting Method, And Pressing Tool
App 20100181667 - Iwase; Teppei ;   et al.
2010-07-22
Electrode Junction Structure And Manufacturing Method Thereof
App 20100167597 - KUMAZAWA; Kentaro ;   et al.
2010-07-01
Semiconductor Chip And Semiconductor Device
App 20100032832 - Tomura; Yoshihiro ;   et al.
2010-02-11
Mounting Structure And Mounting Method
App 20090321926 - Nakamura; Kojiro ;   et al.
2009-12-31
Electronic Component And Resin Packaging Method For Electronic Component
App 20090278265 - Imanishi; Makoto ;   et al.
2009-11-12
Electronic Circuit Device And Method For Manufacturing Same
App 20090267214 - Kumazawa; Kentaro ;   et al.
2009-10-29
Semiconductor Chip Assembly And Fabrication Method Therefor
App 20080150133 - Nakamura; Kojiro ;   et al.
2008-06-26

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