Kumar; Siddarth
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kumar; Siddarth.The latest application filed is for "methods of forming flexure based cooling solutions for package structures".
- Kumar; Siddarth - Chandler AZ
- Kumar; Siddarth - Siddarth AZ
- Kumar; Siddarth - Niskayuna NY US
| Patent | Date |
|---|---|
| Methods of forming flexure based cooling solutions for package structures Grant 11,276,625 - Kumar , et al. March 15, 2 | 2022-03-15 |
| Methods Of Forming Flexure Based Cooling Solutions For Package Structures App 20210280495 - Kumar; Siddarth ; et al. | 2021-09-09 |
| Stress isolation for silicon photonic applications Grant 10,748,844 - Kumar , et al. A | 2020-08-18 |
| Stress Isolation For Silicon Photonic Applications App 20190206782 - KUMAR; Siddarth ; et al. | 2019-07-04 |
| Warpage controlled package and method for same Grant 9,953,934 - Kumar , et al. April 24, 2 | 2018-04-24 |
| Electric circuit on flexible substrate Grant 9,930,793 - Hu , et al. March 27, 2 | 2018-03-27 |
| Thermal management for flexible integrated circuit packages Grant 9,735,089 - Kumar , et al. August 15, 2 | 2017-08-15 |
| Warpage Controlled Package And Method For Same App 20170178987 - Kumar; Siddarth ; et al. | 2017-06-22 |
| Systems and methods for package on package through mold interconnects Grant 9,659,908 - Sahasrabudhe , et al. May 23, 2 | 2017-05-23 |
| Systems And Methods For Package On Package Through Mold Interconnects App 20170133350 - Sahasrabudhe; Shubhada H. ; et al. | 2017-05-11 |
| Thermal Management For Flexible Integrated Circuit Packages App 20170092564 - Kumar; Siddarth ; et al. | 2017-03-30 |
| Electric Circuit On Flexible Substrate App 20150282341 - Hu; Chuan ; et al. | 2015-10-01 |
| Retractable seal system Grant 8,454,023 - Samudrala , et al. June 4, 2 | 2013-06-04 |
| Retractable Seal System App 20120286476 - Samudrala; Omprakash ; et al. | 2012-11-15 |
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