Kumar; Kaushik Arun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kumar; Kaushik Arun.The latest application filed is for "formation of siocl-containing layer on exposed low-k surfaces to reduce low-k damage".

Company Profile

0.12.15

Kumar; Kaushik Arun - Poughkeepsie NY US
Kumar; Kaushik Arun - Beacon NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Formation of SiOCl-containing layer on spacer sidewalls to prevent CD loss during spacer etch Grant 8,809,194 - Ranjan , et al. August 19, 2	2014-08-19
Dry metal etching method Grant 8,808,562 - Ohsawa , et al. August 19, 2	2014-08-19
Formation of SiOCl-containing layer on exposed low-k surfaces to reduce low-k damage Grant 8,592,327 - Ranjan , et al. November 26, 2	2013-11-26
Sidewall and chamfer protection during hard mask removal for interconnect patterning Grant 8,551,877 - Ranjan , et al. October 8, 2	2013-10-08
FORMATION OF SiOCl-CONTAINING LAYER ON EXPOSED LOW-K SURFACES TO REDUCE LOW-K DAMAGE App 20130237060 - RANJAN; Alok ; et al.	2013-09-12
Sidewall And Chamfer Protection During Hard Mask Removal For Interconnect Patterning App 20130236989 - RANJAN; Alok ; et al.	2013-09-12
FORMATION OF SiOCl-CONTAINING LAYER ON SPACER SIDEWALLS TO PREVENT CD LOSS DURING SPACER ETCH App 20130237059 - RANJAN; Alok ; et al.	2013-09-12
Dry Metal Etching Method App 20130065398 - OHSAWA; Yusuke ; et al.	2013-03-14
Ultra-low-k dual damascene structure and method of fabricating App 20120064713 - RUSSELL; Noel ; et al.	2012-03-15
Methods of patterning insulating layers using etching techniques that compensate for etch rate variations Grant 8,058,176 - Park , et al. November 15, 2	2011-11-15
Methods of Patterning Insulating Layers Using Etching Techniques that Compensate for Etch Rate Variations App 20090081873 - Park; Wan-jae ; et al.	2009-03-26
Method of forming an interconnect structure Grant 7,358,182 - Baks , et al. April 15, 2	2008-04-15
Maintaining uniform CMP hard mask thickness Grant 7,253,098 - Chen , et al. August 7, 2	2007-08-07
Method of forming an interconnect structure App 20070148966 - Baks; Heidi Lee ; et al.	2007-06-28
Line level air gaps App 20060264036 - Chen; Shyng-Tsong ; et al.	2006-11-23
Line level air gaps Grant 7,084,479 - Chen , et al. August 1, 2	2006-08-01
Surface Treatment Of Post-rie-damaged P-osg And Other Damaged Materials App 20060128163 - Chen; Shyng-Tsong ; et al.	2006-06-15
Maintaining Uniform Cmp Hard Mask Thickness App 20060043590 - Chen; Steven Shyng-Tsong T. ; et al.	2006-03-02
Line level air gaps App 20050127514 - Chen, Shyng-Tsong ; et al.	2005-06-16

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