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Patent applications and USPTO patent grants for Kumar; Anil K. N..The latest application filed is for "high reliability lead-free solder alloy".
Patent | Date |
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High reliability lead-free solder alloy Grant 10,821,557 - Ribas , et al. November 3, 2 | 2020-11-03 |
High Reliability Lead-Free Solder Alloy App 20190389012 - Ribas; Morgana De Avila ;   et al. | 2019-12-26 |
High Impact Solder Toughness Alloy App 20190262951 - Pandher; Ranjit ;   et al. | 2019-08-29 |
High Impact Solder Toughness Alloy App 20190255662 - Pandher; Ranjit ;   et al. | 2019-08-22 |
High Impact Solder Toughness Alloy App 20180290244 - Pandher; Ranjit ;   et al. | 2018-10-11 |
High Impact Solder Toughness Alloy App 20170304955 - Pandher; Ranjit ;   et al. | 2017-10-26 |
High Impact Solder Toughness Alloy App 20170136583 - Pandher; Ranjit ;   et al. | 2017-05-18 |
High Impact Solder Toughness Alloy App 20160214213 - Pandher; Ranjit ;   et al. | 2016-07-28 |
High Impact Solder Toughness Alloy App 20160144462 - Pandher; Ranjit ;   et al. | 2016-05-26 |
High Impact Toughness Solder Alloy App 20140219711 - Pandher; Ranjit ;   et al. | 2014-08-07 |
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