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Patent applications and USPTO patent grants for Kumamoto; Shingo.The latest application filed is for "multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus".
Patent | Date |
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Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus Grant 7,170,012 - Suwa , et al. January 30, 2 | 2007-01-30 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus Grant 7,095,623 - Suwa , et al. August 22, 2 | 2006-08-22 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus App 20050225956 - Suwa, Tokihito ;   et al. | 2005-10-13 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus App 20050205297 - Suwa, Tokihito ;   et al. | 2005-09-22 |
Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus App 20030218871 - Suwa, Tokihito ;   et al. | 2003-11-27 |
Heat spreader and method of making the same Grant 6,129,993 - Kumamoto , et al. October 10, 2 | 2000-10-10 |
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