Kumamoto; Nobuhisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kumamoto; Nobuhisa.The latest application filed is for "suction-holding apparatus and wafer polishing apparatus".

Company Profile

0.11.8

Kumamoto; Nobuhisa - Kyoto JP
KUMAMOTO; Nobuhisa - Kyoto-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Suction-holding apparatus and wafer polishing apparatus Grant 9,583,376 - Kumamoto February 28, 2	2017-02-28
Suction-holding Apparatus And Wafer Polishing Apparatus App 20140302755 - KUMAMOTO; Nobuhisa	2014-10-09
Semiconductor chip and production process therefor App 20080138976 - Kumamoto; Nobuhisa ; et al.	2008-06-12
Process of producing semiconductor chip with surface interconnection at bump Grant 7,329,562 - Kumamoto , et al. February 12, 2	2008-02-12
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device Grant 7,045,900 - Hikita , et al. May 16, 2	2006-05-16
Damascene interconnection and semiconductor device Grant 7,042,100 - Yamamoto , et al. May 9, 2	2006-05-09
Damascene interconnection and semiconductor device App 20050156332 - Yamamoto, Koji ; et al.	2005-07-21
Semiconductor device and manufacturing method thereof Grant 6,897,091 - Hikita , et al. May 24, 2	2005-05-24
Damascene interconnection and semiconductor device Grant 6,879,049 - Yamamoto , et al. April 12, 2	2005-04-12
Semiconductor chip, chip-on-chip structure device, and assembling method thereof Grant 6,869,829 - Hikita , et al. March 22, 2	2005-03-22
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device App 20040222521 - Hikita, Junichi ; et al.	2004-11-11
Semiconductor chip and production process therefor App 20040183208 - Kumamoto, Nobuhisa ; et al.	2004-09-23
Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device Grant 6,724,084 - Hikita , et al. April 20, 2	2004-04-20
Semiconductor chip and production process therefor Grant 6,707,159 - Kumamoto , et al. March 16, 2	2004-03-16
Semiconductor chip, chip-on-chip structure device, and assembling method thereof App 20020190369 - Hikita, Junichi ; et al.	2002-12-19
Semiconductor chip, chip-on-chip structure device and assembling method thereof Grant 6,476,499 - Hikita , et al. November 5, 2	2002-11-05
Semiconductor device and manufacturing method thereof App 20020127777 - Hikita, Junichi ; et al.	2002-09-12
Semiconductor device and semiconductor chip Grant 6,404,061 - Hikita , et al. June 11, 2	2002-06-11
Plasma treatment apparatus and electrode used for the same App 20010014374 - Kumamoto, Nobuhisa ; et al.	2001-08-16

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.