KUMAKI; Takashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for KUMAKI; Takashi.The latest application filed is for "shield-type connector".

Company Profile

0.14.15

KUMAKI; Takashi - Tokyo JP
KUMAKI; Takashi - Chiyoda-ku Tokyo
Kumaki; Takashi - Hitachi N/A JP
Kumaki; Takashi - Hitachi-shi JP
Kumaki; Takashi - Ibaraki JP
Kumaki; Takashi - Sodegaura-shi Chiba JP
Kumaki; Takashi - Osaka JP
Kumaki; Takashi - Suita JP
KUMAKI, TAKASHI - OSAKA-SHI JP
Kumaki; Takashi - Sagamihara JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Shield-type Connector App 20220263274 - KUMAKI; Takashi ; et al.	2022-08-18
Optically Softening Resin Composition, Method For Producing Softened Product Of Optically Softening Resin Composition, Curable Resin Composition And Cured Product Of Same, And Patterned Film And Method For Producing Same App 20220162406 - MIYAMOTO; Yuki ; et al.	2022-05-26
Photosensitive element, method for formation of resist pattern, and method for production of print circuit board Grant 8,501,392 - Saitou , et al. August 6, 2	2013-08-06
Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board Grant 8,198,008 - Miyasaka , et al. June 12, 2	2012-06-12
Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board Grant 8,192,916 - Miyasaka , et al. June 5, 2	2012-06-05
Photosensitive resin composition, and, photosensitive element, method for forming resist pattern, method for manufacturing printed wiring board and method for manufacturing partition wall for plasma display panel using the composition Grant 8,105,759 - Miyasaka , et al. January 31, 2	2012-01-31
Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board Grant 7,993,809 - Miyasaka , et al. August 9, 2	2011-08-09
Photosensitive Resin Composition, Photosensitive Element, Method For Forming Resist Pattern And Method For Producing Printed Wiring Board App 20100285408 - MIYASAKA; Masahiro ; et al.	2010-11-11
Photosensitive Resin Composition, Photosensitive Element, Method For Forming Resist Pattern And Method For Producing Printed Wiring Board App 20100279229 - MIYASAKA; Masahiro ; et al.	2010-11-04
Photosensitive Resin Composition, Method For Forming Resist Pattern, Method For Manufacturing Printed Wiring Board, And Method For Producing Substrate For Plasma Display Panel App 20100233627 - Kumaki; Takashi ; et al.	2010-09-16
Photosensitive Element, Method For Formation Of Resist Pattern, And Method For Production Of Print Circuit Board App 20090297982 - Saitou; Manabu ; et al.	2009-12-03
Photosensitive element, resist pattern formation method and printed wiring board production method Grant 7,622,243 - Kumaki , et al. November 24, 2	2009-11-24
Photosensitive Resin Composition, And, Photosensitive Element, Method For Forming Resist Pattern, Method For Manufacturing Printed Wiring Board And Method For Manufacturing Partition Wall For Plasma Display Panel Using The Composition App 20090202944 - Miyasaka; Masahiro ; et al.	2009-08-13
Sulfur-containing phenolic resin, process for preparing the same, phenol derivatives having thioether structure or disulfide structure, process for preparing the same and epoxy resin composition and adhesive Grant 7,504,471 - Sue , et al. March 17, 2	2009-03-17
Disulfide-containing phenolic resin as curing agent for epoxy resin Grant 7,491,789 - Sue , et al. February 17, 2	2009-02-17
Photosensitive Resin Composition, Photosensitive Element, Method for Forming Resist Pattern and Method for Producing Printed Wiring Board App 20090029289 - Miyasaka; Masahiro ; et al.	2009-01-29
Novel Sulfur-containing Phenolic Resin, Process For Preparing The Same, Phenol Derivatives Having Thioether Structure Or Disulfide Structure, Process For Preparing The Same And Epoxy Resin Composition Adhesive App 20080051550 - SUE; Haruaki ; et al.	2008-02-28
Photosensitive element, resist pattern formation method and printed wiring board production method App 20070105036 - Kumaki; Takashi ; et al.	2007-05-10
Thermoplastic polymer, thermoplastic polymer composition, antistatic agent, and resin composition App 20060155096 - Matsumoto; Shinsuke ; et al.	2006-07-13
Novel sulfurized phenolic resin, process for producing the same, phenol derivative having thioeter structure or disulfide structure, process for producing the same, and epoxy resin composition and adhesive App 20050222369 - Sue, Haruaki ; et al.	2005-10-06
Method and apparatus for producing polyester polyol, polyester polyol and polyurethane foam Grant 6,667,416 - Murayama , et al. December 23, 2	2003-12-23
Apparatus for decomposition and recovery of polyurethane resin Grant 6,660,236 - Kodama , et al. December 9, 2	2003-12-09
Method for decomposition and recovery of polyurethane resin Grant 6,489,373 - Kodama , et al. December 3, 2	2002-12-03
Method For Decomposition And Recovery Of Polyurethane Resin App 20020049258 - KODAMA, KATSUHISA ; et al.	2002-04-25
Method and apparatus for producing polyester polyol, polyester polyol and polyurethane foam App 20020035166 - Murayama, Kouichi ; et al.	2002-03-21
Method of decomposing a polyurethane App 20010027246 - Murayama, Koichi ; et al.	2001-10-04
Low resilience urethane foam Grant 6,204,300 - Kageoka , et al. March 20, 2	2001-03-20
Apparatus for playing back rotating recording mediums Grant 4,602,361 - Kumaki , et al. July 22, 1	1986-07-22

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