KUMAI; Toshio
Patent Applications and Registrations
Patent applications and USPTO patent grants for KUMAI; Toshio.The latest application filed is for "insert component embedding method".
- KUMAI; Toshio - Kawasaki JP
- Kumai; Toshio - Tokyo JP
- Kumai; Toshio - Chofu JP
| Patent | Date |
|---|---|
| Insert Component Embedding Method App 20100175811 - KUMAI; Toshio | 2010-07-15 |
| Information processing device Grant 7,536,039 - Shinoda , et al. May 19, 2 | 2009-05-19 |
| Information processing device App 20060034499 - Shinoda; Takao ; et al. | 2006-02-16 |
| Semiconductor device having terminals for heat radiation Grant 6,023,098 - Higashiguchi , et al. February 8, 2 | 2000-02-08 |
| Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device Grant 5,828,128 - Higashiguchi , et al. October 27, 1 | 1998-10-27 |
| Semiconductor device and semiconductor device mounting board Grant 5,760,469 - Higashiguchi , et al. June 2, 1 | 1998-06-02 |
| Dual in-line packaging with improved moisture resistance Grant 5,130,780 - Kumai , et al. July 14, 1 | 1992-07-14 |
| Magnetic recording media having lubricated contact layer Grant 4,477,520 - Hamada , et al. October 16, 1 | 1984-10-16 |
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