Kumagai; Masashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kumagai; Masashi.The latest application filed is for "antibody against serotype g lipopolysaccharide of pseudomonas aeruginosa".

Company Profile

1.26.37

Kumagai; Masashi - Kitaibaraki JP
Kumagai; Masashi - Hitachi N/A JP
Kumagai; Masashi - Yokohama-shi JP
Kumagai; Masashi - Yokohama JP
Kumagai; Masashi - Kanagawa JP
Kumagai; Masashi - Hitachi-shi JP
Kumagai; Masashi - Kitaibaraki-shi JP
Kumagai; Masashi - Kanagawa-Ken JP
Kumagai; Masashi - Ibaraki JP
Kumagai; Masashi - Toda JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Two-layer flexible substrate Grant 8,568,856 - Tsuchida , et al. October 29, 2	2013-10-29
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same Grant 8,449,751 - Kumagai , et al. May 28, 2	2013-05-28
Antibody Against Serotype G Lipopolysaccharide Of Pseudomonas Aeruginosa App 20130045207 - Tanaka; Jiro ; et al.	2013-02-21
Antibody Against Serotype I Lipopolysaccharide Of Pseudomonas Aeruginosa App 20130022603 - Tanaka; Jiro ; et al.	2013-01-24
Antibody Against Serotype B Lipopolysaccharide Of Pseudomonas Aeruginosa App 20130022604 - Tanaka; Jiro ; et al.	2013-01-24
Antibody Against Serotype E Lipopolysaccharide Of Pseudomonas Aeruginosa App 20130004499 - Tanaka; Jiro ; et al.	2013-01-03
Antibody Against Serotype A Lipopolysaccharide Of Pseudomonas Aeruginosa App 20130004500 - Tanaka; Jiro ; et al.	2013-01-03
Electroless nickel plating liquid Grant 8,182,594 - Hino , et al. May 22, 2	2012-05-22
Pseudomonas aeruginosa outer membrane protein PA0427 Grant 8,084,044 - Tanaka , et al. December 27, 2	2011-12-27
Portable Terminal Device With Waterproof Structure App 20110110022 - Kumagai; Masashi ; et al.	2011-05-12
Pseudomonas Aeruginosa-outer Membrane Protein Pa4710 App 20100330100 - Tanaka; Jiro ; et al.	2010-12-30
Type Iii Secretion System Component Protein Pa1698 Of Pseudomonas Aeruginosa App 20100291070 - Kumagai; Masashi ; et al.	2010-11-18
Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith Grant 7,824,534 - Tsuchida , et al. November 2, 2	2010-11-02
Copper electrolytic solution and electrolytic copper foil produced therewith App 20100270163 - Kumagai; Masashi ; et al.	2010-10-28
Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith App 20100224496 - Tsuchida; Katsuyuki ; et al.	2010-09-09
Copper electrolytic solution and electrolytic copper foil produced therewith Grant 7,777,078 - Kumagai , et al. August 17, 2	2010-08-17
Copper electrolytic solution containing quaternary amine compound with specific skeleton and oragno-sulfur compound as additives, and electrolytic copper foil manufactured using the same Grant 7,771,835 - Kumagai , et al. August 10, 2	2010-08-10
Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same Grant 7,678,257 - Kumagai , et al. March 16, 2	2010-03-16
Surface treated copper film Grant 7,651,783 - Tsuchida , et al. January 26, 2	2010-01-26
Pseudomonas Aeruginosa Outer Membrane Protein PA5158 App 20090155279 - Tanaka; Jiro ; et al.	2009-06-18
Two-Layer Flexible Substrate App 20090092789 - Tsuchida; Katsuyuki ; et al.	2009-04-09
Electroless nickel plating liquid App 20090064892 - Hino; Eiji ; et al.	2009-03-12
Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same Grant 7,432,335 - Kumagai , et al. October 7, 2	2008-10-07
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same Grant 7,378,160 - Kumagai , et al. May 27, 2	2008-05-27
Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same App 20080075972 - Kumagai; Masashi ; et al.	2008-03-27
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same App 20080073219 - Kumagai; Masashi ; et al.	2008-03-27
Electroless gold plating liquid Grant 7,300,501 - Hino , et al. November 27, 2	2007-11-27
Copper electrolytic solution containing as additive compound having specific skeleton, and electrolytic copper foil manufactured therewith App 20070170069 - Tsuchida; Katsuyuki ; et al.	2007-07-26
Surface processing agent for tin or tin alloy material App 20070131141 - Masatoki; Tamiharu ; et al.	2007-06-14
Resin composition App 20070123681 - Kobayashi; Hironori ; et al.	2007-05-31
Electroless gold plating liquid App 20070095249 - Hino; Eiji ; et al.	2007-05-03
Copper electrolytic solution containing quaternary amine compound with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same App 20070042201 - Kumagai; Masashi ; et al.	2007-02-22
Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith Grant 7,144,491 - Kumagai , et al. December 5, 2	2006-12-05
Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same App 20060217494 - Kumagai; Masashi ; et al.	2006-09-28
Solid silane coupling agent composition, process for producing the same, and resin composition containing the same Grant 7,109,273 - Tsuchida , et al. September 19, 2	2006-09-19
Basic silane coupling agent organic carboxylate composition, method for producing the same, and epoxy resin composition containing the same Grant 7,094,845 - Kumagai , et al. August 22, 2	2006-08-22
Copper electrolytic solution and electrolytic copper foil produced therewith App 20060166032 - Kumagai; Masashi ; et al.	2006-07-27
Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these Grant 7,045,461 - Imori , et al. May 16, 2	2006-05-16
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same Grant 7,005,055 - Kumagai , et al. February 28, 2	2006-02-28
Copper electrolytic solution containing quaternary amine compound polymer with specific skeleton and organo-sulfur compound as additives, and electrolytic copper foil manufactured using the same App 20060011488 - Kumagai; Masashi ; et al.	2006-01-19
Copper electrolytic solution containing amine compound having specific skeleton and organosulfur compound as additives, and electrolytic copper foil produced using the same App 20050252778 - Kumagai, Masashi ; et al.	2005-11-17
Copper electrolytic solution containing organic sulfur compound and quaternary amine compound of specified skeleton as additives and electrolytic copper foil produced therewith App 20050173256 - Kumagai, Masashi ; et al.	2005-08-11
Solid silane coupling agent composition, process for producing the same, and resin composition containing the same App 20050165195 - Tsuchida, Katsuyuki ; et al.	2005-07-28
Water-based metal surface treatment agent Grant 6,921,577 - Ouchi , et al. July 26, 2	2005-07-26
Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins Grant 6,916,865 - Kumagai , et al. July 12, 2	2005-07-12
Surface treatment for copper foil Grant 6,835,241 - Tsuchida , et al. December 28, 2	2004-12-28
Surface-treated copper foil App 20040209109 - Tsuchida, Katsuyuki ; et al.	2004-10-21
Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these App 20040182714 - Imori, Toru ; et al.	2004-09-23
Surface treatment for copper foil App 20040149167 - Tsuchida, Katsuyuki ; et al.	2004-08-05
Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same App 20040149583 - Kumagai, Masashi ; et al.	2004-08-05
Portable telephone set with hinged lid Grant 6,731,959 - Kumagai , et al. May 4, 2	2004-05-04
Imidazole/organic monocarboxylic acid salt derivative reaction product, method for producing the same, and surface treatment agent, resin additive and resin composition using the same Grant 6,710,181 - Kumagai , et al. March 23, 2	2004-03-23
Basic silane coupling agent-organic carboxylic acid salt composition, process for preparing the salt composition and epoxy resin compositions containing the same App 20040034136 - Kumagai, Masashi ; et al.	2004-02-19
Metal surface treatment agent, and metal material coated with same Grant 6,605,356 - Ouchi , et al. August 12, 2	2003-08-12
Monocarboxylate salts of imidazole reaction products, process for preparing the salts, and surface treatments, additives for resins, and resin compositions, containing the same App 20030088108 - Kumagai, Masashi ; et al.	2003-05-08
Metal surface treatment agent, and metal material coated with same App 20030054174 - Ouchi, Takashi ; et al.	2003-03-20
Water-based metal surface treatment agent App 20030017343 - Ouchi, Takashi ; et al.	2003-01-23
Imidazole-silane compounds and metal surface finishing agent containing the same Grant 5,258,522 - Tsuchida , et al. November 2, 1	1993-11-02

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