Kumagai; Junichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kumagai; Junichi.The latest application filed is for "plasma display apparatus and method of driving plasma display panel".
- Kumagai; Junichi - Yokohama JP
- Kumagai; Junichi - Ibaraki JP
- Kumagai; Junichi - Kunitomi JP
- Kumagai; Junichi - Aizuwakamatsu JP
- Kumagai; Junichi - Aizuwakamatsu-shi JP
- Kumagai; Junichi - Matsudo JP
- Kumagai, Junichi - Matsudo-shi JP
- Kumagai; Junichi - Tokyo JP
| Patent | Date |
|---|---|
| Plasma display device and driving method using all cell reset and on cell reset operations Grant 8,319,705 - Kumagai , et al. November 27, 2 | 2012-11-27 |
| Driving method for plasma display panel and plasma display device Grant 8,207,912 - Itokawa , et al. June 26, 2 | 2012-06-26 |
| Plasma Display Apparatus And Method Of Driving Plasma Display Panel App 20110261047 - Kumagai; Junichi ; et al. | 2011-10-27 |
| Driving Method Of Plasma Display Panel And Plasma Display Apparatus App 20090225007 - Kumagai; Junichi ; et al. | 2009-09-10 |
| Plasma Display Device App 20090201227 - KUMAGAI; Junichi ; et al. | 2009-08-13 |
| Driving Method Of A Plasma Display Device And A Plasma Display Device App 20090201276 - Furukawa; Isao ; et al. | 2009-08-13 |
| Driving Method For Plasma Display Panel And Plasma Display Device App 20090201226 - Itokawa; Naoki ; et al. | 2009-08-13 |
| Copper alloy and method of manufacturing the same Grant 7,485,200 - Ishida , et al. February 3, 2 | 2009-02-03 |
| Copper alloy and method of manufacturing the same Grant 7,338,631 - Ishida , et al. March 4, 2 | 2008-03-04 |
| Copper alloy and method of manufacturing the same App 20080041507 - Ishida; Masahiko ; et al. | 2008-02-21 |
| Fittings for use in files Grant 7,032,274 - Kumagai April 25, 2 | 2006-04-25 |
| Copper alloy and method of manufacturing the same App 20050230014 - Ishida, Masahiko ; et al. | 2005-10-20 |
| Fittings for use in files App 20020050028 - Kumagai, Junichi | 2002-05-02 |
| Fittings for use in files App 20020010984 - Kumagai, Junichi | 2002-01-31 |
| High-strength copper based alloy free from smutting during pretreatment for plating Grant 5,997,810 - Futatsuka , et al. December 7, 1 | 1999-12-07 |
| Lead frame material formed of copper alloy for resin sealed type semiconductor devices Grant 5,463,247 - Futatsuka , et al. October 31, 1 | 1995-10-31 |
| Electrostatic copying apparatus Grant 4,386,839 - Kumagai , et al. June 7, 1 | 1983-06-07 |
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