Kulkarni; Srikanth

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kulkarni; Srikanth.The latest application filed is for "selective mold placement on integrated circuit (ic) packages and methods of fabricating".

Company Profile

1.2.8

Kulkarni; Srikanth - San Diego CA
Kulkarni; Srikanth - Dallas TX
KULKARNI; Srikanth - San Jose CA
Kulkarni; Srikanth - Freemont CA
Kulkarni; Srikanth - Karnataka IN

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure for arrayed partial molding of packages Grant 11,211,263 - Kulkarni , et al. December 28, 2	2021-12-28
Selective Mold Placement On Integrated Circuit (ic) Packages And Methods Of Fabricating App 20210351096 - Chattopadhyay; Sayok ; et al.	2021-11-11
Package Comprising Dummy Interconnects App 20210280507 - ALDRETE; Manuel ; et al.	2021-09-09
Structure For Arrayed Partial Molding Of Packages App 20210151330 - KULKARNI; Srikanth ; et al.	2021-05-20
Techniques for adhesive control between a substrate and a die Grant 10,056,294 - Sridharan , et al. August 21, 2	2018-08-21
Gas Sensor App 20180196022 - KULKARNI; Srikanth ; et al.	2018-07-12
System And Method For Providing Hermetically Sealed Packages With Consistent Vacuum Cavity App 20170166442 - Kulkarni; Srikanth ; et al.	2017-06-15
System And Method For Improving Dicing Quality For Bonded Wafer Pairs App 20170170159 - Kulkarni; Srikanth ; et al.	2017-06-15
Techniques For Adhesive Control Between A Substrate And A Die App 20150155264 - Sridharan; Vivek S. ; et al.	2015-06-04
Novel Preparation of 6-O-Acyl Chlorosucrose from Anhydrous Cholorinated Reaction Mass App 20100160625 - Ratnam; Rakesh ; et al.	2010-06-24

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