Kulicke and Soffa Die Bonding GmbH
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kulicke and Soffa Die Bonding GmbH.The latest application filed is for "method and apparatus for inspecting a semiconductor chip prior to bonding".
- Kulicke and Soffa Die Bonding GmbH - Berg CH
| Patent | Date |
|---|---|
| Method and apparatus for inspecting a semiconductor chip prior to bonding Grant 9,515,045 - Marte , et al. December 6, 2 | 2016-12-06 |
| Tool for picking a planar object from a supply station Grant 9,373,530 - Schmidt-Lange , et al. June 21, 2 | 2016-06-21 |
| Method and apparatus for the placement of electronic components, in particular semi conductor chips on a substrate Grant 8,914,971 - Trinks December 23, 2 | 2014-12-23 |
| Method And Apparatus For Inspecting A Semiconductor Chip Prior To Bonding App 20130025791 - Marte; Andreas ; et al. | 2013-01-31 |
| Tool For Picking A Planar Object From A Supply Station App 20120168089 - Schmidt-Lange; Michael ; et al. | 2012-07-05 |
| Device for fixing a flat object, in particular a substrate, to a work surface by means of low pressure Grant 8,082,661 - Schuster December 27, 2 | 2011-12-27 |
| Method and device for detaching a component which is attached to a flexible film Grant 7,981,246 - Trinks , et al. July 19, 2 | 2011-07-19 |
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