KULICKE & SOFFA INVESTMENTS INC.
Patent Applications and Registrations
Patent applications and USPTO patent grants for KULICKE & SOFFA INVESTMENTS INC..The latest application filed is for "interconnect apparatus and methods".
Company Profile
0.45.13
- KULICKE & SOFFA INVESTMENTS INC. - WILLOW GROVE PA
- Kulicke & Soffa Investments, Inc. - Fort Washington PA
- Kulicke & Soffa Investments, Inc -
- Kulicke & Soffa Investments, Inc. - Wilmington DE
- Kulicke & Soffa Investments, Inc - Wilmington DE
- Kulicke & Soffa Investments, Inc. - DE
- Kulicke & Soffa Investments, Inc. - Little Falls DE
- KULICKE & SOFFA INVESTMENTS, INC. - Falls Center II 2751 Centervillen Road Wilmington DE
Patent Activity
| Patent | Date |
|---|---|
| Interconnect apparatus and methods App 20070026574 - Beatson; David T. ; et al. | 2007-02-01 |
| Bonding tool with polymer coating Grant 7,077,304 - Sonnenreich , et al. July 18, 2 | 2006-07-18 |
| Electronic flame-off electrode with ball-shaped tip App 20060076337 - Brunner; Jon ; et al. | 2006-04-13 |
| High speed method of aligning cutting lines of a workplace using patterns Grant RE39,018 - Azuma , et al. March 21, 2 | 2006-03-21 |
| Capillary with contained inner chamfer Grant 7,004,369 - Perlberg , et al. February 28, 2 | 2006-02-28 |
| Fiber alignment process using cornercube offset tool Grant 6,997,368 - Beatson , et al. February 14, 2 | 2006-02-14 |
| Low-profile capillary for wire bonding App 20050252950 - Eder, James E. ; et al. | 2005-11-17 |
| Macrocomposite guideway and gib produced therefrom Grant 6,960,022 - Beatson , et al. November 1, 2 | 2005-11-01 |
| System and method for reducing or eliminating semiconductor device wire sweep Grant 6,955,949 - Batish , et al. October 18, 2 | 2005-10-18 |
| High density chip level package for the packaging of integrated circuits and method to manufacture same Grant 6,953,999 - Strandberg , et al. October 11, 2 | 2005-10-11 |
| Semiconductor copper bond pad surface protection App 20050181191 - Ellis, Timothy W. ; et al. | 2005-08-18 |
| High density chip level package for the packaging of integrated circuits and method to manufacture same App 20050146033 - Strandberg, Jan I. ; et al. | 2005-07-07 |
| Capillary with contained inner chamfer Grant 6,910,612 - Perlberg , et al. June 28, 2 | 2005-06-28 |
| Multi-part capillary App 20050121493 - Mironescu, Dan ; et al. | 2005-06-09 |
| Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method App 20050121798 - Batish, Rakesh | 2005-06-09 |
| Method for providing plural magnified images Grant 6,903,880 - Beatson , et al. June 7, 2 | 2005-06-07 |
| Semiconductor copper bond pad surface protection Grant 6,885,104 - Ellis , et al. April 26, 2 | 2005-04-26 |
| High density chip level package for the packaging of integrated circuits and method to manufacture same Grant 6,872,589 - Strandberg , et al. March 29, 2 | 2005-03-29 |
| Multi-wavelength aperture and vision system and method using same Grant 6,870,684 - Beatson , et al. March 22, 2 | 2005-03-22 |
| System and method for preventing and alleviating short circuiting in a semiconductor device Grant 6,847,122 - Batish , et al. January 25, 2 | 2005-01-25 |
| Design of interconnection pads with separated probing and wire bonding regions Grant 6,784,556 - Lin August 31, 2 | 2004-08-31 |
| Die attach process using cornercube offset tool Grant 6,778,274 - Beatson , et al. August 17, 2 | 2004-08-17 |
| High density chip level package for the packaging of integrated circuits and method to manufacture same App 20040155337 - Strandberg, Jan I. ; et al. | 2004-08-12 |
| Multi-color machine vision system Grant 6,760,161 - Beatson , et al. July 6, 2 | 2004-07-06 |
| Fiber alignment apparatus and process using cornercube offset tool Grant 6,729,530 - Beatson , et al. May 4, 2 | 2004-05-04 |
| Bonding tool with polymer coating Grant 6,729,527 - Sonnenreich , et al. May 4, 2 | 2004-05-04 |
| Ultra fine pitch capillary Grant 6,715,658 - Perlberg , et al. April 6, 2 | 2004-04-06 |
| Indirect imaging method for a bonding tool Grant 6,712,257 - Beatson , et al. March 30, 2 | 2004-03-30 |
| Die attach system and process using cornercube offset tool Grant 6,705,507 - Beatson , et al. March 16, 2 | 2004-03-16 |
| Method for manufacturing a printed circuit board substrate with passive electrical components App 20040012937 - DeGrappo, David ; et al. | 2004-01-22 |
| Indirect imaging system for a bonding tool Grant 6,641,026 - Beatson , et al. November 4, 2 | 2003-11-04 |
| Design of interconnection pads with separated probing and wire bonding regions App 20030197289 - Lin, Paul T. | 2003-10-23 |
| High density substrate for the packaging of integrated circuits App 20030197285 - Strandberg, Jan I. ; et al. | 2003-10-23 |
| Solder ball delivery and reflow method Grant 6,634,545 - Razon , et al. October 21, 2 | 2003-10-21 |
| Composite noble metal wire Grant 6,610,930 - Seuntjens August 26, 2 | 2003-08-26 |
| Wirebonded semiconductor package structure and method of manufacture Grant 6,608,390 - Beatson , et al. August 19, 2 | 2003-08-19 |
| Method for manufacturing a printed circuit board substrate Grant 6,599,561 - Dow , et al. July 29, 2 | 2003-07-29 |
| Dual laser cutting of wafers Grant 6,562,698 - Manor May 13, 2 | 2003-05-13 |
| Macrocomposite guideway and rail produced therefrom App 20030079640 - Beatson, David T. ; et al. | 2003-05-01 |
| Method for laser scribing of wafers Grant 6,555,447 - Weishauss , et al. April 29, 2 | 2003-04-29 |
| Method for making a probe apparatus for testing integrated circuits Grant 6,530,148 - Kister March 11, 2 | 2003-03-11 |
| Controlled attenuation capillary Grant 6,523,733 - Miller , et al. February 25, 2 | 2003-02-25 |
| Dicing method and apparatus for cutting panels or wafers into rectangular shaped die App 20020157657 - Toledano, Eli | 2002-10-31 |
| Method for singulating semiconductor wafers Grant 6,420,245 - Manor July 16, 2 | 2002-07-16 |
| Semiconductor copper bond pad surface protection Grant 6,413,576 - Ellis , et al. July 2, 2 | 2002-07-02 |
| Missing wire detector Grant 6,179,197 - Toner January 30, 2 | 2001-01-30 |
| Monitoring system for dicing saws Grant 6,165,051 - Weisshaus , et al. December 26, 2 | 2000-12-26 |
| High speed method of aligning cutting lines of a workpiece using patterns Grant 6,142,138 - Azuma , et al. November 7, 2 | 2000-11-07 |
| Tool used in forming a chip scale package Grant 6,136,681 - Razon , et al. October 24, 2 | 2000-10-24 |
| Wire bonding capillary with a conical surface Grant 6,073,827 - Razon , et al. June 13, 2 | 2000-06-13 |
| Monitoring system for dicing saws Grant 6,033,288 - Weisshaus , et al. March 7, 2 | 2000-03-07 |
| Low mass ultrasonic bonding tool Grant 5,890,643 - Razon , et al. April 6, 1 | 1999-04-06 |
| Ceramic carrier transport for die attach equipment Grant 5,547,537 - Reynolds , et al. August 20, 1 | 1996-08-20 |
| Unibody ultrasonic transducer Grant 5,469,011 - Safabakhsh November 21, 1 | 1995-11-21 |
| Fine pitch capillary bonding tool Grant 5,421,503 - Perlberg , et al. June 6, 1 | 1995-06-06 |
| Apparatus and method for automatically adjusting power output of an ultrasonic generator Grant 5,357,423 - Weaver , et al. October 18, 1 | 1994-10-18 |
| High yield clampless wire bonding method Grant 5,176,311 - Levine , et al. January 5, 1 | 1993-01-05 |
| Method of making low profile fine wire interconnections Grant 5,111,989 - Holdgrafer , et al. May 12, 1 | 1992-05-12 |
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