| Patent | Date |
|---|
Edge interconnect self-assembly substrate
Grant 11,398,463 - Kulick , et al. July 26, 2 | 2022-07-26 |
Edge interconnects for use with circuit boards and integrated circuits
Grant 11,224,126 - Kulick , et al. January 11, 2 | 2022-01-11 |
Adiabatic Flip-Flop and Memory Cell Design
App 20210327496 - Snider; Gregory ; et al. | 2021-10-21 |
Assembling and Handling Edge Interconnect Packaging System
App 20210168938 - Kulick; Jason M. ; et al. | 2021-06-03 |
Assembling and handling edge interconnect packaging system
Grant 10,945,335 - Kulick , et al. March 9, 2 | 2021-03-09 |
Edge Interconnects for Use With Circuit Boards and Integrated Circuits
App 20210051799 - Kulick; Jason M. ; et al. | 2021-02-18 |
Edge Interconnect Self-Assembly Substrate
App 20210050335 - Kulick; Jason M. ; et al. | 2021-02-18 |
Edge interconnect self-assembly substrate
Grant 10,896,898 - Kulick , et al. January 19, 2 | 2021-01-19 |
Method and system to passively align and attach fiber array to laser array or optical waveguide array
Grant 10,598,861 - Kulick , et al. | 2020-03-24 |
Method and System to Passively Align and Attach Fiber Array to Laser Array or Optical Waveguide Array
App 20200003955 - Kulick; Jason M. ; et al. | 2020-01-02 |
Inter-chip alignment
Grant 10,410,989 - Hall , et al. Sept | 2019-09-10 |
Method and system to passively align and attach fiber array to laser array or optical waveguide array
Grant 10,409,004 - Kulick , et al. Sept | 2019-09-10 |
Method and System to Passively Align and Attach Fiber Array to Laser Array or Optical Waveguide Array
App 20190250335 - KULICK; Jason M. ; et al. | 2019-08-15 |
Edge interconnect packaging of integrated circuits for power systems
Grant 10,325,875 - Kulick , et al. | 2019-06-18 |
Substrates with interdigitated hinged edge interconnects
Grant 10,182,498 - Kulick , et al. Ja | 2019-01-15 |
Prototyping of electronic circuits with edge interconnects
Grant 10,056,335 - Kulick , et al. August 21, 2 | 2018-08-21 |
Quilt packaging system with mated metal interconnect nodules and voids
Grant 10,050,027 - Hall , et al. August 14, 2 | 2018-08-14 |
Assembling and Handling Edge Interconnect Packaging System
App 20180077801 - Kulick; Jason M. ; et al. | 2018-03-15 |
Prototyping of Electronic Circuits with Edge Interconnects
App 20180019208 - Kulick; Jason M. ; et al. | 2018-01-18 |
Method of interconnecting microchips
Grant 9,844,139 - Kulick , et al. December 12, 2 | 2017-12-12 |
Prototyping of electronic circuits with edge interconnects
Grant 9,806,030 - Kulick , et al. October 31, 2 | 2017-10-31 |
Inter-Chip Alignment
App 20170229416 - Hall; Douglas C. ; et al. | 2017-08-10 |
Inter-Chip Alignment
App 20170179093 - Hall; Douglas C. ; et al. | 2017-06-22 |
Edge Interconnect Packaging of Integrated Circuits for Power Systems
App 20170162532 - Kulick; Jason M. ; et al. | 2017-06-08 |
Prototyping of Electronic Circuits with Edge Interconnects
App 20170125350 - Kulick; Jason M. ; et al. | 2017-05-04 |
Edge Interconnect Self-Assembly Substrate
App 20170125389 - Kulick; Jason M. ; et al. | 2017-05-04 |
Substrates with Interdigitated Hinged Edge Interconnects
App 20170127518 - Kulick; Jason M. ; et al. | 2017-05-04 |
Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
Grant 9,620,473 - Hall , et al. April 11, 2 | 2017-04-11 |
Assembling and Handling Edge Interconnect Packaging System
App 20140268592 - Kulick; Jason M. ; et al. | 2014-09-18 |
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