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Patent applications and USPTO patent grants for Kukita; Tomomi.The latest application filed is for "slurry and polishing method".
Patent | Date |
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Setting value change device Grant 11,379,109 - Kukita , et al. July 5, 2 | 2022-07-05 |
Slurry, polishing solution production method, and polishing method Grant 11,359,121 - Kukita , et al. June 14, 2 | 2022-06-14 |
Polishing liquid, polishing liquid set and polishing method Grant 11,352,523 - Iwano , et al. June 7, 2 | 2022-06-07 |
Polishing liquid, polishing liquid set and polishing method Grant 11,292,939 - Iwano , et al. April 5, 2 | 2022-04-05 |
Slurry And Polishing Method App 20220033680 - IWANO; Tomohiro ;   et al. | 2022-02-03 |
Slurry, Screening Method, And Polishing Method App 20210309884 - NOMURA; Satoyuki ;   et al. | 2021-10-07 |
Slurry And Polishing Method App 20210301179 - NOMURA; Satoyuki ;   et al. | 2021-09-30 |
Slurry, Polishing Solution Production Method, And Polishing Method App 20210261820 - KUKITA; Tomomi ;   et al. | 2021-08-26 |
Slurry And Polishing Method App 20210261821 - MATSUMOTO; Takaaki ;   et al. | 2021-08-26 |
Slurry, Method For Producing Polishing Liquid, And Polishing Method App 20210246346 - HASEGAWA; Tomoyasu ;   et al. | 2021-08-12 |
Air Conditioner, Air-conditioning System, Communication System, Control System, Device Control System, Device Management System, And Sound Information Analysis System App 20210080141 - TSUBOI; Kousuke ;   et al. | 2021-03-18 |
Slurry, Slurry Set And Polishing Method App 20210071037 - IWANO; Tomohiro ;   et al. | 2021-03-11 |
Polishing Liquid, Polishing Liquid Set, And Polishing Method App 20210054233 - MATSUMOTO; Takaaki ;   et al. | 2021-02-25 |
Device Control System App 20200126549 - TEI; Shimei ;   et al. | 2020-04-23 |
Setting Value Change Device App 20180314403 - KUKITA; Tomomi ;   et al. | 2018-11-01 |
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