KUKIMOTO; Yoichi
Patent Applications and Registrations
Patent applications and USPTO patent grants for KUKIMOTO; Yoichi.The latest application filed is for "solder paste composition having solder powder, flux and metallic powder".
- KUKIMOTO; Yoichi - Kakogawa-shi JP
- Kukimoto; Yoichi - Kakogawa JP
| Patent | Date |
|---|---|
| Solder Paste Composition Having Solder Powder, Flux And Metallic Powder App 20100270365 - KUKIMOTO; Yoichi ; et al. | 2010-10-28 |
| Solder precoating method Grant 7,569,164 - Sakurai , et al. August 4, 2 | 2009-08-04 |
| Solder paste composition and solder precoating method App 20080179383 - Sakurai; Hitoshi ; et al. | 2008-07-31 |
| Solder Paste Composition, Solder Precoating Method And Mounted Substrate App 20080160331 - Kukimoto; Yoichi ; et al. | 2008-07-03 |
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