Kukanskis; Peter E.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kukanskis; Peter E..The latest application filed is for "composition and process for treatment of metallic surfaces".

Company Profile

0.16.0

Kukanskis; Peter E. - Woodbury CT
Kukanskis; Peter E. - Watertown CT
Kukanskis; Peter E. - Naugatuck CT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition and process for treatment of metallic surfaces Grant 5,376,189 - Kukanskis December 27, 1	1994-12-27
Composition for preparing printed circuit through-holes for metallization Grant 5,132,038 - Kukanskis , et al. July 21, 1	1992-07-21
Composition and method for improving adhesion of coatings to copper surfaces Grant 5,037,482 - Kukanskis , et al. August 6, 1	1991-08-06
Process for preparation printed circuit through-holes for metallization Grant 5,032,427 - Kukanskis , et al. July 16, 1	1991-07-16
Process for metallizing non-conductive substrates Grant 4,976,990 - Bach , et al. December 11, 1	1990-12-11
Method for manufacture of printed circuit boards Grant 4,931,148 - Kukanskis , et al. June 5, 1	1990-06-05
Inhibited composition and method for stripping tin, lead or tin-lead alloy from copper surfaces Grant 4,921,571 - Kukanskis , et al. May 1, 1	1990-05-01
Process for preparing printed circuit board thru-holes Grant 4,756,930 - Kukanskis , et al. * July 12, 1	1988-07-12
Method for manufacture of printed circuit boards Grant 4,735,694 - Kukanskis April 5, 1	1988-04-05
Oxidizing accelerator Grant 4,608,275 - Kukanskis , et al. August 26, 1	1986-08-26
Process for preparing printed circuit board thru-holes Grant 4,597,988 - Kukanskis , et al. July 1, 1	1986-07-01
Electroless copper deposition solution using a hypophosphite reducing agent Grant 4,279,948 - Kukanskis , et al. July 21, 1	1981-07-21
Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions Grant 4,265,943 - Goldstein , et al. May 5, 1	1981-05-05
Electroless copper composition solution using a hypophosphite reducing agent Grant 4,209,331 - Kukanskis , et al. June 24, 1	1980-06-24
Method of manufacture of additive printed circuitboards using permanent resist mask Grant 3,982,045 - Kukanskis September 21, 1	1976-09-21
Additive printed circuit boards and method of manufacture Grant 3,959,523 - Grunwald , et al. May 25, 1	1976-05-25

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