Kuhman; Daniel E.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuhman; Daniel E..The latest application filed is for "methods of forming semiconductor structure".
- Kuhman; Daniel E. - Fairport NY
| Patent | Date |
|---|---|
| Method for remote plasma deposition of fluoropolymer films Grant 6,444,275 - Kuhman , et al. September 3, 2 | 2002-09-03 |
| Methods of forming semiconductor structure App 20020086452 - Kneezel, Gary A. ; et al. | 2002-07-04 |
| High density remote plasma deposited fluoropolymer films Grant 6,243,112 - Kuhman , et al. June 5, 2 | 2001-06-05 |
| Method for improving substrate adhesion in fluoropolymer deposition processes Grant 5,900,288 - Kuhman , et al. May 4, 1 | 1999-05-04 |
| Thermal ink jet printhead with improved ink resistance Grant 5,729,261 - Burke , et al. March 17, 1 | 1998-03-17 |
| Biasable member having low surface energy Grant 5,303,014 - Yu , et al. April 12, 1 | 1994-04-12 |
| Coating processes for an ink jet printhead Grant 5,073,785 - Jansen , et al. December 17, 1 | 1991-12-17 |
| Amorphous silicon carbide electroreceptors Grant 4,885,220 - Kuhman , et al. December 5, 1 | 1989-12-05 |
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