Kuechenmeister; Frank

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuechenmeister; Frank.The latest application filed is for "photonics chips with an edge coupler and a continuous crackstop".

Company Profile

2.39.43

Kuechenmeister; Frank - Dresden DE
- Dresden DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Photonics Chips With An Edge Coupler And A Continuous Crackstop App 20220291464 - Polomoff; Nicholas A. ; et al.	2022-09-15
Articles including bonded metal structures and methods of preparing the same Grant 9,570,430 - Kuechenmeister , et al. February 14, 2	2017-02-14
Semiconductor dies with reduced area consumption Grant 9,478,489 - Richter , et al. October 25, 2	2016-10-25
Articles Including Bonded Metal Structures And Methods Of Preparing The Same App 20150333035 - Kuechenmeister; Frank ; et al.	2015-11-19
Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structure Grant 8,957,524 - Breuer , et al. February 17, 2	2015-02-17
Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems Grant 08920027 -	2014-12-30
Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems Grant 8,920,027 - Grillberger , et al. December 30, 2	2014-12-30
Technique for forming a passivation layer without a terminal metal Grant 8,841,140 - Letz , et al. September 23, 2	2014-09-23
Novel Pillar Structure For Use In Packaging Integrated Circuit Products And Methods Of Making Such A Pillar Structure App 20140264890 - Breuer; Dirk ; et al.	2014-09-18
Semiconductor Dies With Reduced Area Consumption App 20140110854 - Richter; Daniel ; et al.	2014-04-24
Substrate dicing technique for separating semiconductor dies with reduced area consumption Grant 8,664,025 - Richter , et al. March 4, 2	2014-03-04
Integrated Circuit Devices With Bump Structures That Include A Protection Layer App 20140021604 - Kuechenmeister; Frank ; et al.	2014-01-23
Integrated circuit package having offset vias Grant 8,624,404 - Su , et al. January 7, 2	2014-01-07
Integrated Circuit Package Having Offset Vias App 20130341802 - Su; Michael Z. ; et al.	2013-12-26
Methods of forming bump structures that include a protection layer Grant 8,580,672 - Kuechenmeister , et al. November 12, 2	2013-11-12
Method and device for fabricating bonding wires on the basis of microelectronic manufacturing techniques Grant 8,561,446 - Lehr , et al. October 22, 2	2013-10-22
Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts Grant 8,479,578 - Geisler , et al. July 9, 2	2013-07-09
Methods of Forming Bump Structures That Include a Protection Layer App 20130099372 - Kuechenmeister; Frank ; et al.	2013-04-25
Metal Features to Reduce Crack-Inducing Stresses in Metallization Stacks App 20130087907 - Lehr; Matthias U. ; et al.	2013-04-11
Back side metallization with superior adhesion in high-performance semiconductor devices Grant 8,384,218 - Zenner , et al. February 26, 2	2013-02-26
System for driving and controlling a movable electrode assembly in an electrochemical process tool Grant 8,357,268 - Pietzner , et al. January 22, 2	2013-01-22
Die Seal for Integrated Circuit Device App 20120286397 - Kuechenmeister; Frank ; et al.	2012-11-15
Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method Grant 8,293,636 - Schulze , et al. October 23, 2	2012-10-23
Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding Grant 8,283,247 - Lehr , et al. October 9, 2	2012-10-09
Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer Grant 8,216,880 - Lehr , et al. July 10, 2	2012-07-10
Semiconductor device having a filled trench structure and methods for fabricating the same Grant 8,174,131 - Zhang , et al. May 8, 2	2012-05-08
Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process App 20120052677 - Zenner; Soeren ; et al.	2012-03-01
Substrate Dicing Technique for Separating Semiconductor Dies with Reduced Area Consumption App 20120049379 - Richter; Daniel ; et al.	2012-03-01
Conductive Connection Structure With Stress Reduction Arrangement For A Semiconductor Device, And Related Fabrication Method App 20120049343 - Schulze; Thomas ; et al.	2012-03-01
Applying Thermal Mechanical Characteristics of Complex Semiconductor Devices by Integrated Heating Systems App 20120051392 - Grillberger; Michael ; et al.	2012-03-01
Wire Bonding On Reactive Metal Surfaces Of A Metallization Of A Semiconductor Device By Providing A Protection Layer App 20120009780 - Lehr; Matthias ; et al.	2012-01-12
Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protective layer Grant 8,043,956 - Lehr , et al. October 25, 2	2011-10-25
Semiconductor device including a reduced stress configuration for metal pillars Grant 8,039,958 - Platz , et al. October 18, 2	2011-10-18
Assessing Metal Stack Integrity In Sophisticated Semiconductor Devices By Mechanically Stressing Die Contacts App 20110209548 - Geisler; Holm ; et al.	2011-09-01
System and method for controlling an electrochemical etch process Grant 7,993,936 - Siury , et al. August 9, 2	2011-08-09
Back Side Metallization With Superior Adhesion In High-performance Semiconductor Devices App 20110074031 - Zenner; Soeren ; et al.	2011-03-31
Semiconductor chip with reinforcement layer and method of making the same Grant 7,897,433 - Su , et al. March 1, 2	2011-03-01
Semiconductor Device Having A Filled Trench Structure And Methods For Fabricating The Same App 20100301460 - ZHANG; Zhen ; et al.	2010-12-02
Method for decreasing surface delamination of gel-type thermal interface material by management of the material cure temperature Grant 7,833,839 - Touzelbaev , et al. November 16, 2	2010-11-16
Method for forming solder balls with a stable oxide layer by controlling the reflow ambient Grant 7,829,453 - Jungnickel , et al. November 9, 2	2010-11-09
Semiconductor Chip with Reinforcement Layer App 20100207281 - Su; Michael ; et al.	2010-08-19
Semiconductor Device Including A Cost-efficient Chip-package Connection Based On Metal Pillars App 20100164098 - Kuechenmeister; Frank ; et al.	2010-07-01
Method And Device For Fabricating Bonding Wires On The Basis Of Microelectronic Manufacturing Techniques App 20100107717 - Lehr; Matthias ; et al.	2010-05-06
Semiconductor Device Including A Reduced Stress Configuration For Metal Pillars App 20100109158 - Platz; Alexander ; et al.	2010-05-06
Semiconductor device with gel-type thermal interface material Grant 7,678,615 - Touzelbaev , et al. March 16, 2	2010-03-16
Enhanced Wire Bond Stability On Reactive Metal Surfaces Of A Semiconductor Device By Encapsulation Of The Bond Structure App 20100052137 - Meyer; Andreas ; et al.	2010-03-04
Wire Bonding On Reactive Metal Surfaces Of A Metallization Of A Semiconductor Device By Providing A Protective Layer App 20090243105 - Lehr; Matthias ; et al.	2009-10-01
Technique for efficiently patterning an underbump metallization layer using a dry etch process Grant 7,585,759 - Kuechenmeister , et al. September 8, 2	2009-09-08
Technique for forming a copper-based contact layer without a terminal metal Grant 7,569,937 - Kuechenmeister , et al. August 4, 2	2009-08-04
Wire Bonding Of Aluminum-free Metallization Layers By Surface Conditioning App 20090166861 - Lehr; Matthias ; et al.	2009-07-02
Semiconductor Device Including A Die Region Designed For Aluminum-free Solder Bump Connection And A Test Structure Designed For Aluminum-free Wire Bonding App 20090140244 - Lehr; Matthias ; et al.	2009-06-04
Semiconductor Device with Gel-Type Thermal Interface Material App 20090057877 - Touzelbaev; Maxat ; et al.	2009-03-05
Efficient method of forming and assembling a microelectronic chip including solder bumps Grant 7,491,556 - Jungnickel , et al. February 17, 2	2009-02-17
Backside Metallization For Integrated Circuit Devices App 20080203571 - Jungnickel; Gotthard ; et al.	2008-08-28
System For Driving And Controlling A Movable Electrode Assembly In An Electrochemical Process Tool App 20080156641 - Pietzner; Michael ; et al.	2008-07-03
System And Method For Controlling An Electrochemical Etch Process App 20080160650 - Siury; Kerstin ; et al.	2008-07-03
Semiconductor substrate thinning method for manufacturing thinned die Grant 7,375,032 - Seliger , et al. May 20, 2	2008-05-20
Technique For Forming A Passivation Layer Without A Terminal Metal App 20080102540 - Letz; Tobias ; et al.	2008-05-01
Metallization Layer Stack Without A Terminal Aluminum Metal Layer App 20080099913 - Lehr; Matthias ; et al.	2008-05-01
Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly Grant 7,306,976 - Feustel , et al. December 11, 2	2007-12-11
Method For Forming Solder Balls With A Stable Oxide Layer By Controlling The Reflow Ambient App 20070123020 - Jungnickel; Gotthard ; et al.	2007-05-31
Technique For Forming A Copper-based Contact Layer Without A Terminal Metal App 20070023918 - Kuechenmeister; Frank ; et al.	2007-02-01
Technique For Efficiently Patterning An Underbump Metallization Layer Using A Dry Etch Process App 20070023928 - KUECHENMEISTER; FRANK ; et al.	2007-02-01
Method and system for on-line controlling of solder bump deposition App 20060266652 - Netz; Andreas ; et al.	2006-11-30
Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly App 20060246627 - Feustel; Frank ; et al.	2006-11-02
Efficient method of forming and assembling a microelectronic chip including solder bumps App 20060172444 - Jungnickel; Gotthard ; et al.	2006-08-03
Semiconductor substrate thinning method for manufacturing thinned die App 20060068595 - Seliger; Frank ; et al.	2006-03-30
Soft error resistant semiconductor device Grant 6,894,390 - Schammler , et al. May 17, 2	2005-05-17
Soft error resistant semiconductor device App 20040164409 - Schammler, Gisela ; et al.	2004-08-26
Solder bump structure and a method of forming the same Grant 6,639,314 - Boettcher , et al. October 28, 2	2003-10-28
Solder bump structure and a method of forming the same App 20030052415 - Boettcher, Mathias ; et al.	2003-03-20

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.