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Organic Electroluminescent Device
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Slicing method and wire saw apparatus
Grant 8,567,384 - Oishi , et al. October 29, 2 | 2013-10-29 |
Semiconductor substrate and semiconductor device
Grant 8,492,879 - Ohmi , et al. July 23, 2 | 2013-07-23 |
Polishing apparatus
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Multi-color molding article, multicolor molding method and substrate storage container
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Carrier for double-side polishing apparatus, double-side polishing apparatus using the same, and double-side polishing method
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Carrier For Double-side Polishing Apparatus, Double-side Polishing Apparatus Using The Same, And Double-side Polishing Method
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Multi-color Molding Article, Multicolor Molding Method And Substrate Storage Container
App 20110064896 - Kudo; Hideo ; et al. | 2011-03-17 |
Semiconductor Substrate And Semiconductor Device
App 20100213516 - Ohmi; Tadahiro ; et al. | 2010-08-26 |
Polishing Apparatus
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Slicing Method And Wire Saw Apparatus
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Semiconductor Wafer Fabricating Method and Semiconductor Wafer Mirror Edge Polishing Method
App 20080113510 - Kato; Tadahiro ; et al. | 2008-05-15 |
Precision substrate storage container and retaining member therefor
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Gaskets for substrate containers
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Write once optical recording medium
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Optical recording medium
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Gaskets for substrate containers and substrate container equipped with the same
App 20040041355 - Suzuki, Tsutomu ; et al. | 2004-03-04 |
Method of making multi-layer optical recording medium
App 20030235655 - Mitsuhata, Takanori ; et al. | 2003-12-25 |
Write once optical recording medium
App 20030228539 - Hosoda, Yasuo ; et al. | 2003-12-11 |
Precision substrate storage container and retaining member therefor
App 20030221985 - Yajima, Toshitsugu ; et al. | 2003-12-04 |
Optical recording medium
App 20030118772 - Hosoda, Yasuo ; et al. | 2003-06-26 |
Polishing method for wafer and holding plate
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Semiconductor wafer processing method and semiconductor wafers produced by the same
App 20010008807 - Nihonmatsu, Takashi ; et al. | 2001-07-19 |
Semiconductor wafers processing method and semiconductor wafers produced by the same
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Method of purifying alkaline solution and method of etching semiconductor wafers
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Surface grinding device and method of surface grinding a thin-plate workpiece
Grant 6,050,880 - Kato , et al. April 18, 2 | 2000-04-18 |
Method of polishing semiconductor wafers
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Method of manufacturing semiconductor wafers
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Apparatus and method for double-sided polishing semiconductor wafers
Grant 5,914,053 - Masumura , et al. June 22, 1 | 1999-06-22 |
Polishing pad used for polishing silicon wafers and polishing method using the same
Grant 5,827,395 - Masumura , et al. October 27, 1 | 1998-10-27 |
Method of manufacturing semiconductor mirror wafers
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Method of manufacturing semiconductor wafers
Grant 5,800,725 - Kato , et al. September 1, 1 | 1998-09-01 |
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Method for production of silicon wafer and apparatus therefor
Grant 5,679,212 - Kato , et al. October 21, 1 | 1997-10-21 |
Optical recording medium and its recording apparatus and reproducing apparatus
Grant 5,656,348 - Kudo , et al. August 12, 1 | 1997-08-12 |
Device for handling wafers
Grant 5,595,412 - Kudo , et al. January 21, 1 | 1997-01-21 |
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Method for handling or processing semiconductor wafers
Grant 5,547,515 - Kudo , et al. August 20, 1 | 1996-08-20 |
Method for production of wafer
Grant 5,447,890 - Kato , et al. September 5, 1 | 1995-09-05 |
Automatic cleaning apparatus for wafers
Grant 5,317,778 - Kudo , et al. June 7, 1 | 1994-06-07 |
Scrubber apparatus for cleaning a thin disk work
Grant 5,282,289 - Hasegawa , et al. February 1, 1 | 1994-02-01 |
Phase change optical information recording medium including means for preventing movement of the recorded portion
Grant 5,179,547 - Komaki , et al. January 12, 1 | 1993-01-12 |
Method of automatically chamfering a wafer and apparatus therefor
Grant 5,117,590 - Kudo , et al. June 2, 1 | 1992-06-02 |
Automatic cleaning apparatus for disks
Grant 5,081,733 - Kudo January 21, 1 | 1992-01-21 |
Optical recording medium and method of manufacturing thereof
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