loadpatents
name:-0.015314102172852
name:-0.0071630477905273
name:-0.0028321743011475
Kudo; Hidehiro Patent Filings

Kudo; Hidehiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kudo; Hidehiro.The latest application filed is for "on-vehicle motor-driven compressor".

Company Profile
2.5.9
  • Kudo; Hidehiro - Kariya JP
  • KUDO; Hidehiro - Kariya-shi JP
  • Kudo; Hidehiro - Aichi-ken JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
On-vehicle motor-driven compressor
Grant 10,897,183 - Ambo , et al. January 19, 2
2021-01-19
On-vehicle Motor-driven Compressor
App 20190305648 - AMBO; Shunsuke ;   et al.
2019-10-03
Method of manufacturing a low expansion material and semiconductor device using the low expansion material
Grant 7,196,417 - Sugiyama , et al. March 27, 2
2007-03-27
Method of manufacturing composite material
App 20060249500 - Kudo; Hidehiro ;   et al.
2006-11-09
Composite structural material, and method of producing the same
Grant 7,097,914 - Tanaka , et al. August 29, 2
2006-08-29
Low-expansion unit, method of manufacturing the same and semiconductor provided with the same
Grant 7,087,316 - Yoshida , et al. August 8, 2
2006-08-08
Composite material and method for manufacturing the same
Grant 6,994,917 - Kinoshita , et al. February 7, 2
2006-02-07
Low-expansion unit, method of manufacturing the same and semiconductor provided with the same
App 20050031889 - Yoshida, Takashi ;   et al.
2005-02-10
Composite material and method for manufacturing the same
App 20040142202 - Kinoshita, Kyoichi ;   et al.
2004-07-22
Method of manufacturing a low expansion material and semiconductor device using the low expansion material
App 20040130018 - Sugiyama, Tomohei ;   et al.
2004-07-08
Composite structural material, and method of producing the same
App 20040101707 - Tanaka, Katsufumi ;   et al.
2004-05-27
Semiconductor module and plate-shaped lead
App 20040065947 - Sugiyama, Tomohei ;   et al.
2004-04-08
Low expansion plate, method of manufacturing the same, and semiconductor device using the low expansion plate
App 20040041244 - Sugiyama, Tomohei ;   et al.
2004-03-04
Radiator system, radiating method, thermal buffer, semiconductor module, heat spreader and substrate
App 20040016748 - Kinoshita, Kyoichi ;   et al.
2004-01-29

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