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Patent applications and USPTO patent grants for Kubokawa; Teruyoshi.The latest application filed is for "solder joint structure and method for soldering electronic components".
Patent | Date |
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Solder joint structure and method for soldering electronic components Grant 6,929,169 - Kubokawa , et al. August 16, 2 | 2005-08-16 |
Solder joint structure and method for soldering electronic components App 20050127143 - Kubokawa, Teruyoshi ;   et al. | 2005-06-16 |
Solder joint structure and method for soldering electronic components App 20040065718 - Kubokawa, Teruyoshi ;   et al. | 2004-04-08 |
Soft-magnetic dielectric high-frequency composite material and method for making the same Grant 5,755,986 - Yamamoto , et al. May 26, 1 | 1998-05-26 |
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