Kuang; Xin-Chung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuang; Xin-Chung.The latest application filed is for "air trench in packages incorporating hybrid bonding".
- Kuang; Xin-Chung - Hsinchu TW
- Kuang; Xin-Chung - Hsin-Chu TW
- Kuang; Xin-Chung - Hsinchu City TW
| Patent | Date |
|---|---|
| Integrate rinse module in hybrid bonding platform Grant 9,446,467 - Huang , et al. September 20, 2 | 2016-09-20 |
| Air trench in packages incorporating hybrid bonding Grant 9,443,796 - Chou , et al. September 13, 2 | 2016-09-13 |
| Integrate Rinse Module in Hybrid Bonding Platform App 20140263586 - Huang; Xin-Hua ; et al. | 2014-09-18 |
| Air Trench in Packages Incorporating Hybrid Bonding App 20140264948 - Chou; Bruce C.S. ; et al. | 2014-09-18 |
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