Kuang; Raymond
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuang; Raymond.The latest application filed is for "chip carrier substrate with a land grid array and external bond terminals".
- Kuang; Raymond - Fremont CA
| Patent | Date |
|---|---|
| Chip Carrier Substrate With A Land Grid Array And External Bond Terminals App 20070228548 - Kuang; Raymond | 2007-10-04 |
| Chip carrier substrate with a land grid array and external bond terminals Grant 7,244,633 - Kuang July 17, 2 | 2007-07-17 |
| Method for using a chip carrier substrate with a land grid array and external bond terminals Grant 7,148,505 - Kuang December 12, 2 | 2006-12-12 |
| Chip carrier substrate with a land grid array and external bond terminals Grant 6,946,726 - Kuang September 20, 2 | 2005-09-20 |
| Radiation shielding die carrier package Grant 6,853,055 - Kuang February 8, 2 | 2005-02-08 |
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