| Patent | Date |
|---|
3D Integrated Circuit and Methods of Forming the Same
App 20220310449 - Kuang; Hsun-Chung ; et al. | 2022-09-29 |
Memory Window Of Mfm Mosfet For Small Cell Size
App 20220310635 - Trinh; Hai-Dang ; et al. | 2022-09-29 |
Anti-oxidation Layer To Prevent Dielectric Loss From Planarization Process
App 20220293429 - Guan; Zhen Yu ; et al. | 2022-09-15 |
Wakeup Free Approach To Improve The Ferroelectricity Of Feram Using A Stressor Layer
App 20220285374 - Lee; Bi-Shen ; et al. | 2022-09-08 |
Ferroelectric Memory Device and Method of Manufacturing the Same
App 20220278115 - Wei; Yi Yang ; et al. | 2022-09-01 |
Resistive memory cell with switching layer comprising one or more dopants
Grant 11,430,951 - Jiang , et al. August 30, 2 | 2022-08-30 |
Multi-doped data storage structure configured to improve resistive memory cell performance
Grant 11,404,638 - Lee , et al. August 2, 2 | 2022-08-02 |
Ferroelectric random access memory device with seed layer
Grant 11,393,833 - Lee , et al. July 19, 2 | 2022-07-19 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20220216052 - Huang; Xin-Hua ; et al. | 2022-07-07 |
3D Integrated Circuit and Methods of Forming the Same
App 20220208607 - Kuang; Hsun-Chung ; et al. | 2022-06-30 |
Structure and method to expose memory cells with different sizes
Grant 11,367,623 - Chen , et al. June 21, 2 | 2022-06-21 |
Chemical mechanical polishing apparatus, slurry, and method of using the same
Grant 11,351,648 - Chou , et al. June 7, 2 | 2022-06-07 |
Wafer carrier assembly
Grant 11,342,199 - Wu , et al. May 24, 2 | 2022-05-24 |
Bond Pad Structure For Bonding Improvement
App 20220157875 - Liang; Chin-Wei ; et al. | 2022-05-19 |
In-situ Cmp Self-assembled Monolayer For Enhancing Metal-dielectric Adhesion And Preventing Metal Diffusion
App 20220115267 - GUAN; Zhen Yu ; et al. | 2022-04-14 |
Integrate rinse module in hybrid bonding platform
Grant 11,282,697 - Huang , et al. March 22, 2 | 2022-03-22 |
Techniques For Mram Mtj Top Electrode Connection
App 20220077385 - Chen; Sheng-Chau ; et al. | 2022-03-10 |
Multi-doped Data Storage Structure Configured To Improve Resistive Memory Cell Performance
App 20220037589 - Lee; Bi-Shen ; et al. | 2022-02-03 |
FeRAM with Laminated Ferroelectric Film and Method Forming Same
App 20220028874 - Lee; Bi-Shen ; et al. | 2022-01-27 |
Threshold Voltage-modulated Memory Device Using Variable-capacitance And Methods Of Forming The Same
App 20210391329 - JIANG; Fa-Shen ; et al. | 2021-12-16 |
Structure Improving Reliability Of Top Electrode Contact For Resistance Switching Ram Having Cells Of Varying Height
App 20210384424 - Hsiao; Cheng-Tai ; et al. | 2021-12-09 |
MRAM MTJ top electrode connection
Grant 11,183,627 - Chen , et al. November 23, 2 | 2021-11-23 |
Structure and method to expose memory cells with different sizes
Grant 11,183,394 - Chen , et al. November 23, 2 | 2021-11-23 |
Particle Prevention In Wafer Edge Trimming
App 20210335602 - Chou; Tung-He ; et al. | 2021-10-28 |
Resistive Memory Cell With Switching Layer Comprising One Or More Dopants
App 20210336135 - Jiang; Fa-Shen ; et al. | 2021-10-28 |
Ferroelectric Random Access Memory Device With Seed Layer
App 20210335799 - Lee; Bi-Shen ; et al. | 2021-10-28 |
Semiconductor Device And Methods Of Manufacturing Thereof
App 20210327748 - HUANG; Tsai-Ming ; et al. | 2021-10-21 |
Memory device using an etch stop dielectric layer and methods for forming the same
Grant 11,152,426 - Hsiao , et al. October 19, 2 | 2021-10-19 |
CMP apparatus and method for estimating film thickness
Grant 11,133,231 - Chen , et al. September 28, 2 | 2021-09-28 |
Structure improving reliability of top electrode contact for resistance switching RAM having cells of varying height
Grant 11,121,315 - Hsiao , et al. September 14, 2 | 2021-09-14 |
Capping Structure Along Image Sensor Element To Mitigate Damage To Active Layer
App 20210273003 - Lan; Chun-Kai ; et al. | 2021-09-02 |
Techniques To Inhibit Delamination From Flowable Gap-fill Dielectric
App 20210272896 - Lin; Hsing-Lien ; et al. | 2021-09-02 |
Hard Mask Layer Below Via Structure In Display Device
App 20210265417 - Lin; Chia-Hua ; et al. | 2021-08-26 |
Top Electrode Via With Low Contact Resistance
App 20210242399 - Lee; Bi-Shen ; et al. | 2021-08-05 |
Particle prevention in wafer edge trimming
Grant 11,081,334 - Chou , et al. August 3, 2 | 2021-08-03 |
Memory Device Using An Etch Stop Dielectric Layer And Methods For Forming The Same
App 20210217812 - HSIAO; Cheng-Tai ; et al. | 2021-07-15 |
Structure Improving Reliability Of Top Electrode Contact For Resistance Switching Ram Having Cells Of Varying Height
App 20210210681 - Hsiao; Cheng-Tai ; et al. | 2021-07-08 |
Semiconductor device and methods of manufacturing thereof
Grant 11,049,767 - Huang , et al. June 29, 2 | 2021-06-29 |
Integrated Stealth Laser For Wafer Edge Trimming Process
App 20210193453 - Wu; Ming-Tung ; et al. | 2021-06-24 |
3D Integrated Circuit and Methods of Forming the Same
App 20210151353 - Kuang; Hsun-Chung ; et al. | 2021-05-20 |
Conditioner Disk, Chemical Mechanical Polishing Device, And Method
App 20210129288 - Shen; Hsien Hua ; et al. | 2021-05-06 |
Semiconductor structure
Grant 10,991,758 - Chuang , et al. April 27, 2 | 2021-04-27 |
Chemical mechanical polishing system and method
Grant 10,967,479 - Liang , et al. April 6, 2 | 2021-04-06 |
Structure And Method To Expose Memory Cells With Different Sizes
App 20210050220 - Chen; Sheng-Chau ; et al. | 2021-02-18 |
Particle Prevention In Wafer Edge Trimming
App 20210043443 - Chou; Tung-He ; et al. | 2021-02-11 |
3D Integrated Circuit and Methods of Forming the Same
App 20210013098 - Kuang; Hsun-Chung ; et al. | 2021-01-14 |
Planarization apparatus and planarization method thereof
Grant 10,879,077 - Wu , et al. December 29, 2 | 2020-12-29 |
Apparatus of chemical mechanical polishing and operating method thereof
Grant 10,857,651 - Lan , et al. December 8, 2 | 2020-12-08 |
Structure And Method To Expose Memory Cells With Different Sizes
App 20200335353 - Chen; Sheng-Chau ; et al. | 2020-10-22 |
3D integrated circuit and methods of forming the same
Grant 10,790,189 - Kuang , et al. September 29, 2 | 2020-09-29 |
Structure and method to expose memory cells with different sizes
Grant 10,727,077 - Chen , et al. | 2020-07-28 |
Integrate rinse module in hybrid bonding platform
Grant 10,665,449 - Huang , et al. | 2020-05-26 |
Techniques For Mram Mtj Top Electrode Connection
App 20200144484 - Chen; Sheng-Chau ; et al. | 2020-05-07 |
Semiconductor Device And Methods Of Manufacturing Thereof
App 20200135538 - HUANG; Tsai-Ming ; et al. | 2020-04-30 |
Wafer Carrier Assembly
App 20200118842 - WU; MING-TUNG ; et al. | 2020-04-16 |
Techniques for MRAM MTJ top electrode connection
Grant 10,529,913 - Chen , et al. J | 2020-01-07 |
Techniques For Mram Mtj Top Electrode Connection
App 20200006638 - Chen; Sheng-Chau ; et al. | 2020-01-02 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20200006052 - Huang; Xin-Hua ; et al. | 2020-01-02 |
Wafer carrier assembly
Grant 10,510,563 - Wu , et al. Dec | 2019-12-17 |
Chemical Mechanical Polishing System And Method
App 20190291236 - Liang; Chin-Wei ; et al. | 2019-09-26 |
Semiconductor Structure
App 20190273118 - CHUANG; HARRY-HAK-LAY ; et al. | 2019-09-05 |
Chemical mechanical polishing system and method
Grant 10,350,726 - Liang , et al. July 16, 2 | 2019-07-16 |
Semiconductor structure
Grant 10,304,903 - Chuang , et al. | 2019-05-28 |
Structure And Method To Expose Memory Cells With Different Sizes
App 20190157099 - Chen; Sheng-Chau ; et al. | 2019-05-23 |
Cmp Apparatus And Method For Estimating Film Thickness
App 20190157170 - CHEN; YU-MIN ; et al. | 2019-05-23 |
Apparatus Of Chemical Mechanical Polishing And Operating Method Thereof
App 20190152020 - LAN; CHUN-KAI ; et al. | 2019-05-23 |
Planarization Apparatus And Planarization Method Thereof
App 20190131148 - WU; MING-TUNG ; et al. | 2019-05-02 |
3D Integrated Circuit and Methods of Forming the Same
App 20190035681 - Kuang; Hsun-Chung ; et al. | 2019-01-31 |
Through via structure and manufacturing method thereof
Grant 10,181,441 - Hsiao , et al. Ja | 2019-01-15 |
Structure and method to expose memory cells with different sizes
Grant 10,163,651 - Chen , et al. Dec | 2018-12-25 |
Chemical Mechanical Polishing System And Method
App 20180361529 - Liang; Chin-Wei ; et al. | 2018-12-20 |
Chemical Mechanical Polishing Apparatus, Slurry, And Method Of Using The Same
App 20180361525 - CHOU; TUNG-HE ; et al. | 2018-12-20 |
Wafer bonding process and structure
Grant 10,128,209 - Liu , et al. November 13, 2 | 2018-11-13 |
3D integrated circuit and methods of forming the same
Grant 10,090,196 - Kuang , et al. October 2, 2 | 2018-10-02 |
Semiconductor Structure
App 20180158869 - CHUANG; HARRY-HAK-LAY ; et al. | 2018-06-07 |
Through Via Structure And Manufacturing Method Thereof
App 20180145021 - HSIAO; CHENG-TAI ; et al. | 2018-05-24 |
Semiconductor structure and method of forming the same
Grant 9,893,120 - Chuang , et al. February 13, 2 | 2018-02-13 |
Wafer Carrier Assembly
App 20170301563 - WU; MING-TUNG ; et al. | 2017-10-19 |
Semiconductor Structure And Method Of Forming The Same
App 20170301728 - CHUANG; HARRY-HAK-LAY ; et al. | 2017-10-19 |
Air trench in packages incorporating hybrid bonding
Grant 9,786,628 - Chou , et al. October 10, 2 | 2017-10-10 |
Air Trench in Packages Incorporating Hybrid Bonding
App 20170069593 - Chou; Bruce C.S. ; et al. | 2017-03-09 |
Integrate Rinse Module in Hybrid Bonding Platform
App 20170004964 - Huang; Xin-Hua ; et al. | 2017-01-05 |
Wafer Bonding Process and Structure
App 20160358882 - Liu; Ping-Yin ; et al. | 2016-12-08 |
Air trench in packages incorporating hybrid bonding
Grant 9,502,396 - Chou , et al. November 22, 2 | 2016-11-22 |
Wafer bonding process and structure
Grant 9,425,155 - Liu , et al. August 23, 2 | 2016-08-23 |
Air Trench in Packages Incorporating Hybrid Bonding
App 20160163684 - Chou; Bruce C.S. ; et al. | 2016-06-09 |
3D Integrated Circuit and Methods of Forming the Same
App 20160155665 - Kuang; Hsun-Chung ; et al. | 2016-06-02 |
3D integrated circuit and methods of forming the same
Grant 9,257,399 - Kuang , et al. February 9, 2 | 2016-02-09 |
Wafer Bonding Process and Structure
App 20150243611 - Liu; Ping-Yin ; et al. | 2015-08-27 |
3D Integrated Circuit and Methods of Forming the Same
App 20150108644 - Kuang; Hsun-Chung ; et al. | 2015-04-23 |
3D IC and 3D CIS structure
Grant 8,810,048 - Kuang August 19, 2 | 2014-08-19 |
3D IC and 3D CIS Structure
App 20140077386 - Kuang; Hsun-Chung | 2014-03-20 |
Hard mask for thin film resistor manufacture
Grant 8,334,187 - Chang , et al. December 18, 2 | 2012-12-18 |
Hard Mask For Thin Film Resistor Manufacture
App 20110318898 - Chang; Li-Wen ; et al. | 2011-12-29 |
Method of making a thin film resistor
Grant 8,080,461 - Yeh , et al. December 20, 2 | 2011-12-20 |
Method Of Making A Thin Film Resistor
App 20110177668 - YEH; Der-Chyang ; et al. | 2011-07-21 |
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