loadpatents
Patent applications and USPTO patent grants for Kuan; Nelson.The latest application filed is for "interconnect and system including same".
Patent | Date |
---|---|
Stress mitigation in packaged microchips Grant 8,344,487 - Zhang , et al. January 1, 2 | 2013-01-01 |
Package having a plurality of mounting orientations Grant 7,968,807 - Spooner , et al. June 28, 2 | 2011-06-28 |
Interconnect And System Including Same App 20100258348 - Ziff; Joshua ;   et al. | 2010-10-14 |
Stress Mitigation in Packaged Microchips App 20100013067 - Zhang; Xin ;   et al. | 2010-01-21 |
Stress Mitigation in Packaged Microchips App 20090230521 - Zhang; Xin ;   et al. | 2009-09-17 |
Package Having a Plurality of Mounting Orientations App 20080205025 - Spooner; Timothy R. ;   et al. | 2008-08-28 |
Stress Mitigation in Packaged Microchips App 20080157298 - Zhang; Xin ;   et al. | 2008-07-03 |
Bulk silicon mirrors with hinges underneath Grant 6,820,988 - van Drieenhuizen , et al. November 23, 2 | 2004-11-23 |
Bulk silicon mirrors with hinges underneath App 20040100706 - van Drieenhuizen, Bert P. ;   et al. | 2004-05-27 |
Bulk silicon mirrors with hinges underneath Grant 6,695,457 - van Drieenhuizen , et al. February 24, 2 | 2004-02-24 |
Bulk Silicon Mirrors With Hinges Underneath App 20040017625 - van Drieenhuizen, Bert P. ;   et al. | 2004-01-29 |
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