Kuan; Lee Choon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuan; Lee Choon.The latest application filed is for "semiconductor device assemblies including face-to-face semiconductor dice and related methods".

Company Profile

0.23.32

Kuan; Lee Choon - Singapore N/A SG
Kuan; Lee Choon - SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Carrierless chip package for integrated circuit devices, and methods of making same Grant 9,673,121 - Corisis , et al. June 6, 2	2017-06-06
Land grid array semiconductor device packages Grant 9,355,992 - Kuan , et al. May 31, 2	2016-05-31
Semiconductor device assemblies including face-to-face semiconductor dice and related methods Grant 9,269,695 - Seng , et al. February 23, 2	2016-02-23
Semiconductor Device Assemblies Including Face-to-face Semiconductor Dice And Related Methods App 20150076679 - Seng; Eric Tan Swee ; et al.	2015-03-19
Land Grid Array Semiconductor Device Packages App 20140342476 - Kuan; Lee Choon ; et al.	2014-11-20
Apparatus and methods for forming wire bonds Grant 8,444,044 - Wang , et al. May 21, 2	2013-05-21
Methods Of Forming Semiconductor Device Packages Including A Semiconductor Device And A Redistribution Element, Methods Of Forming Redistribution Elements And Methods For Packaging Semiconductor Devices App 20130059419 - Kuan; Lee Choon ; et al.	2013-03-07
Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies Grant 8,384,200 - Seng , et al. February 26, 2	2013-02-26
Stacked Microelectronic Devices And Methods For Manufacturing Stacked Microelectronic Devices App 20120108010 - Tian; Edmund Lua Koon ; et al.	2012-05-03
Semiconductor device packages and assemblies Grant 8,125,092 - Corisis , et al. February 28, 2	2012-02-28
Novel Build-up Package For Integrated Circuit Devices, And Methods Of Making Same App 20110266701 - Wan; Ng Hong ; et al.	2011-11-03
Electronic Device Assemblies Including Conductive Vias Having Two Or More Conductive Elements App 20100284140 - Corisis; David J. ; et al.	2010-11-11
Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods Grant 7,767,913 - Corisis , et al. August 3, 2	2010-08-03
Build-up-package for integrated circuit devices, and methods of making same Grant 7,691,682 - Wan , et al. April 6, 2	2010-04-06
Upgradeable And Repairable Semiconductor Packages And Methods App 20090236735 - Corisis; David J. ; et al.	2009-09-24
Apparatus And Methods For Forming Wire Bonds App 20090223937 - Wang; Low Peng ; et al.	2009-09-10
Board-on-chip Type Substrates With Conductive Traces In Multiple Planes, Semiconductor Device Packages Including Such Substrates, And Associated Methods App 20090218677 - Kuan; Lee Choon ; et al.	2009-09-03
Carrierless chip package for integrated circuit devices, and methods of making same Grant 7,504,285 - Corisis , et al. March 17, 2	2009-03-17
Stacked Microelectronic Devices And Methods For Manufacturing Stacked Microelectronic Devices App 20090045496 - Tian; Edmund Lua ; et al.	2009-02-19
Stacked Microelectronic Devices And Methods For Manufacturing Microelectronic Devices App 20090011541 - Corisis; David J. ; et al.	2009-01-08
Novel Build-up-package For Integrated Circuit Devices, And Methods Of Making Same App 20090001551 - Wan; Ng Hong ; et al.	2009-01-01
Bow control in an electronic package Grant 7,465,488 - Kuan , et al. December 16, 2	2008-12-16
Chip on board leadframe for semiconductor components having area array Grant 7,459,778 - Kim , et al. December 2, 2	2008-12-02
Carrierless Chip Package For Integrated Circuit Devices, And Methods Of Making Same App 20080136001 - Corisis; David J. ; et al.	2008-06-12
Carrierless Chip Package For Integrated Circuit Devices, And Methods Of Making Same App 20070249100 - Corisis; David J. ; et al.	2007-10-25
Carrierless chip package for integrated circuit devices, and methods of making same App 20070216033 - Corisis; David J. ; et al.	2007-09-20
Semiconductor device assemblies including face-to-face semiconductor dice, systems including such assemblies, and methods for fabricating such assemblies App 20070194415 - Seng; Eric Tan Swee ; et al.	2007-08-23
Conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, semiconductor device assemblies including such vias, and accompanying methods App 20070194431 - Corisis; David J. ; et al.	2007-08-23
Bow control in an electronic package Grant 7,235,872 - Kuan , et al. June 26, 2	2007-06-26
Lead frame-based semiconductor device packages incorporating at least one land grid array package and methods of fabrication App 20070045784 - Corisis; David J. ; et al.	2007-03-01
Stacked microelectronic devices and methods for manufacturing microelectronic devices App 20070045862 - Corisis; David J. ; et al.	2007-03-01
Land grid array semiconductor device packages, assemblies including same, and methods of fabrication App 20070045818 - Kuan; Lee Choon ; et al.	2007-03-01
Bow control in an electronic package Grant 7,161,236 - Kuan , et al. January 9, 2	2007-01-09
Bow Control In An Electronic Package App 20060244141 - Kuan; Lee Choon ; et al.	2006-11-02
Chip on board leadframe for semiconductor components having area array App 20060163702 - Kim; Dalson Ye Seng ; et al.	2006-07-27
Method for fabricating semiconductor component with chip on board leadframe Grant 7,049,173 - Kim , et al. May 23, 2	2006-05-23
Method for fabricating a semiconductor package with multi layered leadframe Grant 6,972,214 - Kuan , et al. December 6, 2	2005-12-06
Temporary, conformable contacts for microelectronic components Grant 6,913,476 - Yean , et al. July 5, 2	2005-07-05
Semiconductor component having chip on board leadframe Grant 6,903,449 - Kim , et al. June 7, 2	2005-06-07
Method for fabricating a semiconductor package with multi layered leadframe App 20050087847 - Kuan, Lee Choon ; et al.	2005-04-28
Bow control in an electronic package App 20050029552 - Kuan, Lee Choon ; et al.	2005-02-10
Method for fabricating semiconductor component with chip on board leadframe App 20050023654 - Seng Kim, Dalson Ye ; et al.	2005-02-03
Semiconductor component having chip on board leadframe and method of fabrication App 20050023651 - Kim, Dalson Ye Seng ; et al.	2005-02-03
Method for fabricating semiconductor component with multi layered leadframe Grant 6,835,599 - Kuan , et al. December 28, 2	2004-12-28
Semiconductor component having multi layered leadframe Grant 6,784,525 - Kuan , et al. August 31, 2	2004-08-31
Method for fabricating semiconductor component with multi layered leadframe App 20040130010 - Kuan, Lee Choon ; et al.	2004-07-08
Temporary, Conformable Contacts For Microelectronic Components App 20040029425 - Yean, Tay Wuu ; et al.	2004-02-12
Bow control in an electronic package App 20030047797 - Kuan, Lee Choon ; et al.	2003-03-13
BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die Grant 6,507,114 - Hui , et al. January 14, 2	2003-01-14
BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die App 20020100976 - Hui, Chong Chin ; et al.	2002-08-01
Method for fabricating BOC semiconductor package App 20020102831 - Hui, Chong Chin ; et al.	2002-08-01

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