Kuan; Heap Hoe

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kuan; Heap Hoe.The latest application filed is for "semiconductor device and method of forming semiconductor die with active region responsive to external stimulus".

Company Profile

0.187.153

Kuan; Heap Hoe - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus Grant 10,217,873 - Han , et al. Feb	2019-02-26
Package-on-package using through-hole via die on saw streets Grant 9,847,253 - Do , et al. December 19, 2	2017-12-19
Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus App 20170110599 - Han; Byung Joon ; et al.	2017-04-20
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus Grant 9,564,413 - Han , et al. February 7, 2	2017-02-07
Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus Grant 9,553,162 - Strothmann , et al. January 24, 2	2017-01-24
Package-in-package using through-hole via die on saw streets Grant 9,524,938 - Do , et al. December 20, 2	2016-12-20
Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant Grant 9,515,016 - Huang , et al. December 6, 2	2016-12-06
Extended redistribution layers bumped wafer Grant 9,406,647 - Do , et al. August 2, 2	2016-08-02
Integrated circuit packaging system with patterned substrate and method of manufacture thereof Grant 9,299,648 - Shim , et al. March 29, 2	2016-03-29
Semiconductor package system with cavity substrate and manufacturing method therefor Grant 9,293,350 - Chow , et al. March 22, 2	2016-03-22
Semiconductor device and method of forming semiconductor package using panel form carrier Grant 9,275,877 - Lin , et al. March 1, 2	2016-03-01
Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices Grant 9,257,356 - Huang , et al. February 9, 2	2016-02-09
Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer Grant 9,177,848 - Do , et al. November 3, 2	2015-11-03
Integrated circuit packaging system with package underfill and method of manufacture thereof Grant 9,123,733 - Huang , et al. September 1, 2	2015-09-01
Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant Grant 9,099,455 - Chow , et al. August 4, 2	2015-08-04
Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP Grant 9,064,876 - Pagaila , et al. June 23, 2	2015-06-23
Embedded semiconductor die package and method of making the same using metal frame carrier Grant 9,059,186 - Shim , et al. June 16, 2	2015-06-16
Integrated circuit package system employing wafer level chip scale packaging Grant 9,048,197 - Do , et al. June 2, 2	2015-06-02
Integrated circuit packaging system having planar interconnect and method for manufacture thereof Grant 9,029,205 - Pagaila , et al. May 12, 2	2015-05-12
Integrated circuit package system with internal stacking module Grant 9,030,006 - Chow , et al. May 12, 2	2015-05-12
Semiconductor device and method of forming recessed conductive vias in saw streets Grant 9,006,882 - Pagaila , et al. April 14, 2	2015-04-14
Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof Grant 8,963,309 - Do , et al. February 24, 2	2015-02-24
Integrated circuit packaging system with embedded circuitry and post Grant 8,957,530 - Shim , et al. February 17, 2	2015-02-17
Integrated Circuit Package System With Mounting Structure App 20140335655 - Huang; Rui ; et al.	2014-11-13
Leadless package system having external contacts Grant 8,878,361 - Do , et al. November 4, 2	2014-11-04
Integrated circuit package system employing resilient member mold system technology Grant 8,852,986 - Kuan , et al. October 7, 2	2014-10-07
Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die Grant 8,815,643 - Do , et al. August 26, 2	2014-08-26
Integrated circuit package system with mounting structure Grant 8,803,330 - Huang , et al. August 12, 2	2014-08-12
Extended Redistribution Layers Bumped Wafer App 20140197540 - Do; Byung Tai ; et al.	2014-07-17
Integrated circuit package system with offset stacked die Grant 8,759,954 - Do , et al. June 24, 2	2014-06-24
Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor Grant 8,723,305 - Do , et al. May 13, 2	2014-05-13
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier App 20140127858 - Shim; Il Kwon ; et al.	2014-05-08
Extended redistribution layers bumped wafer Grant 8,716,853 - Do , et al. May 6, 2	2014-05-06
Embedded semiconductor die package and method of making the same using metal frame carrier Grant 8,659,113 - Shim , et al. February 25, 2	2014-02-25
Integrated circuit packaging system with support structure and method of manufacture thereof Grant 8,642,382 - Kuan , et al. February 4, 2	2014-02-04
Integrated circuit packaging system with encapsulation connector and method of manufacture thereof Grant 8,624,364 - Chow , et al. January 7, 2	2014-01-07
Integrated circuit packaging system with reinforced encapsulant having embedded interconnect and method of manufacture thereof Grant 8,604,602 - Chow , et al. December 10, 2	2013-12-10
Ultra-thin wafer system and method of manufacture thereof Grant 8,592,286 - Kuan , et al. November 26, 2	2013-11-26
Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor Grant 8,546,195 - Do , et al. October 1, 2	2013-10-01
Mountable integrated circuit package system with mountable integrated circuit die Grant 8,536,692 - Kuan , et al. September 17, 2	2013-09-17
Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus App 20130221452 - Strothmann; Thomas J. ; et al.	2013-08-29
Package-in-Package Using Through-Hole Via Die on Saw Streets App 20130214385 - Do; Byung Tai ; et al.	2013-08-22
Integrated circuit leaded stacked package system Grant 8,513,542 - Kuan , et al. August 20, 2	2013-08-20
Integrated circuit package system with shield Grant 8,507,319 - Chow , et al. August 13, 2	2013-08-13
Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof Grant 8,492,204 - Do , et al. July 23, 2	2013-07-23
Integrated circuit package system with redistribution layer and method for manufacturing thereof Grant 8,487,434 - Kuan , et al. July 16, 2	2013-07-16
Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors Grant 8,476,120 - Huang , et al. July 2, 2	2013-07-02
Package-in-package using through-hole via die on saw streets Grant 8,445,325 - Do , et al. May 21, 2	2013-05-21
Circuit system with leads and method of manufacture thereof Grant 8,420,950 - Chow , et al. April 16, 2	2013-04-16
Integrated circuit packaging system with flex tape and method of manufacture thereof Grant 8,421,202 - Shim , et al. April 16, 2	2013-04-16
Integrated circuit package system with warp-free chip Grant 8,421,197 - Do , et al. April 16, 2	2013-04-16
Integrated circuit package system including honeycomb molding Grant 8,409,921 - Kuan , et al. April 2, 2	2013-04-02
Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant App 20130075899 - Huang; Rui ; et al.	2013-03-28
Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant App 20130075902 - Chow; Seng Guan ; et al.	2013-03-28
Integrated circuit packaging system with package underfill and method of manufacture thereof Grant 8,405,228 - Huang , et al. March 26, 2	2013-03-26
Semiconductor Device and Method of Forming Semiconductor Die with Active Region Responsive to External Stimulus App 20130069252 - Han; Byung Joon ; et al.	2013-03-21
Semiconductor Device and Method of Forming Semiconductor Package Using Panel Form Carrier App 20130069241 - Lin; Yaojian ; et al.	2013-03-21
Integrated circuit packaging system with stacking interconnect and method of manufacture thereof Grant 8,390,108 - Cho , et al. March 5, 2	2013-03-05
Integrated circuit package system with image sensor system Grant 8,378,502 - Chow , et al. February 19, 2	2013-02-19
Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof Grant 8,368,188 - Do , et al. February 5, 2	2013-02-05
Integrated circuit package system for stackable devices and method for manufacturing thereof Grant 8,368,199 - Chow , et al. February 5, 2	2013-02-05
Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant Grant 8,354,746 - Huang , et al. January 15, 2	2013-01-15
Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant Grant 8,354,304 - Chow , et al. January 15, 2	2013-01-15
Integrated Circuit Packaging System With Support Structure And Method Of Manufacture Thereof App 20120319262 - Kuan; Heap Hoe ; et al.	2012-12-20
Wafer level laser marking system for ultra-thin wafers using support tape Grant 8,334,150 - Kuan , et al. December 18, 2	2012-12-18
Integrated Circuit Package System With Internal Stacking Module App 20120292750 - Chow; Seng Guan ; et al.	2012-11-22
Semiconductor Device and Method of Mounting Die with TSV in Cavity of Substrate for Electrical Interconnect of FI-POP App 20120292785 - Pagaila; Reza A. ; et al.	2012-11-22
Semiconductor device and method of providing common voltage bus and wire bondable redistribution Grant 8,309,451 - Do , et al. November 13, 2	2012-11-13
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 8,304,880 - Chow , et al. November 6, 2	2012-11-06
Semiconductor Wafer Having Through-Hole Vias on Saw Streets with Backside Redistribution Layer App 20120273967 - Do; Byung Tai ; et al.	2012-11-01
Integrated circuit packaging system with bump conductors and method of manufacture thereof Grant 8,299,596 - Huang , et al. October 30, 2	2012-10-30
Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution App 20120261817 - Do; Byung Tai ; et al.	2012-10-18
Integrated circuit packaging system with package stacking and method of manufacture thereof Grant 8,288,844 - Huang , et al. October 16, 2	2012-10-16
Integrated circuit package system with internal stacking module Grant 8,278,141 - Chow , et al. October 2, 2	2012-10-02
Method of Fabricating Semiconductor Die with Through-Hole Via on Saw Streets and Through-Hole Via in Active Area of Die App 20120244661 - Do; Byung Tai ; et al.	2012-09-27
Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof Grant 8,269,320 - Huang , et al. September 18, 2	2012-09-18
Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP Grant 8,263,434 - Pagaila , et al. September 11, 2	2012-09-11
Encapsulant interposer system with integrated passive devices and manufacturing method therefor Grant 8,258,612 - Kuan , et al. September 4, 2	2012-09-04
Integrated circuit package system with penetrable film adhesive Grant 8,258,015 - Chow , et al. September 4, 2	2012-09-04
Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer Grant 8,247,268 - Do , et al. August 21, 2	2012-08-21
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier App 20120199971 - Shim; Il Kwon ; et al.	2012-08-09
Package-on-Package Using Through-Hole Via Die on Saw Streets App 20120199963 - Do; Byung Tai ; et al.	2012-08-09
Stackable integrated circuit package system with multiple interconnect interface Grant 8,232,658 - Chow , et al. July 31, 2	2012-07-31
Embedded semiconductor die package and method of making the same using metal frame carrier Grant 8,222,717 - Shim , et al. July 17, 2	2012-07-17
Semiconductor Device and Method of Forming No-Flow Underfill Material Around Vertical Interconnect Structure App 20120175771 - Huang; Rui ; et al.	2012-07-12
Semiconductor Device and Method of Forming Three-Dimensional Vertically Oriented Integrated Capacitors App 20120168963 - Huang; Rui ; et al.	2012-07-05
Integrated Circuit Packaging System With Bump Conductors And Method Of Manufacture Thereof App 20120146241 - Huang; Rui ; et al.	2012-06-14
Mountable integrated circuit package system with mounting interconnects Grant 8,188,586 - Chow , et al. May 29, 2	2012-05-29
Integrated circuit package-on-package system with anti-mold flash feature Grant 8,183,675 - Chow , et al. May 22, 2	2012-05-22
Integrated circuit package system for shielding electromagnetic interference Grant 8,178,956 - Do , et al. May 15, 2	2012-05-15
Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference App 20120104573 - Pagaila; Reza A. ; et al.	2012-05-03
Semiconductor Package Having Semiconductor Die with Internal Vertical Interconnect Structure and Method Therefor App 20120104599 - Do; Byung Tai ; et al.	2012-05-03
Integrated circuit package in package system Grant 8,164,172 - Ho , et al. April 24, 2	2012-04-24
Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure Grant 8,163,597 - Huang , et al. April 24, 2	2012-04-24
Semiconductor Package Having Semiconductor Die with Internal Vertical Interconnect Structure and Method Therefor App 20120094444 - Do; Byung Tai ; et al.	2012-04-19
Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors Grant 8,159,047 - Huang , et al. April 17, 2	2012-04-17
Integrated circuit package system with offset stacking and anti-flash structure Grant 8,143,711 - Chow , et al. March 27, 2	2012-03-27
Integrated circuit package system with wire-in-film encapsulation Grant 8,138,590 - Chow , et al. March 20, 2	2012-03-20
Package system for shielding semiconductor dies from electromagnetic interference Grant 8,138,024 - Do , et al. March 20, 2	2012-03-20
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20120061854 - Chow; Seng Guan ; et al.	2012-03-15
Wafer strength reinforcement system for ultra thin wafer thinning Grant 8,124,455 - Kuan , et al. February 28, 2	2012-02-28
Integrated circuit package system employing an exposed thermally conductive coating Grant 8,124,460 - Chow , et al. February 28, 2	2012-02-28
Stackable integrated circuit package system Grant 8,106,500 - Chow , et al. January 31, 2	2012-01-31
Semiconductor device and method of shielding semiconductor die from inter-device interference Grant 8,101,460 - Pagaila , et al. January 24, 2	2012-01-24
Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor Grant 8,084,302 - Do , et al. December 27, 2	2011-12-27
Integrated circuit package system with offset stacking Grant 8,084,849 - Chow , et al. December 27, 2	2011-12-27
Integrated Circuit Packaging System With Flip Chip Mounting And Method Of Manufacture Thereof App 20110309481 - Huang; Rui ; et al.	2011-12-22
Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device Grant 8,080,882 - Do , et al. December 20, 2	2011-12-20
Integrated circuit packaging system with multi level contact and method of manufacture thereof Grant 8,080,885 - Chow , et al. December 20, 2	2011-12-20
Integrated Circuit Package System With Offset Stacked Die App 20110284998 - Do; Byung Tai ; et al.	2011-11-24
Leadless Package System Having External Contacts App 20110285002 - Do; Byung Tai ; et al.	2011-11-24
Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die Grant 8,062,929 - Do , et al. November 22, 2	2011-11-22
Semiconductor Package with Penetrable Encapsulant Joining Semiconductor Die and Method Thereof App 20110266652 - Do; Byung Tai ; et al.	2011-11-03
Integrated circuit package system with insulator over circuitry Grant 8,049,314 - Do , et al. November 1, 2	2011-11-01
Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps Grant 8,048,776 - Do , et al. November 1, 2	2011-11-01
Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant App 20110254157 - Huang; Rui ; et al.	2011-10-20
Leadless semiconductor chip carrier system Grant 8,039,311 - Kuan , et al. October 18, 2	2011-10-18
Integrated Circuit Package In Package System App 20110248411 - Ho; Tsz Yin ; et al.	2011-10-13
Semiconductor Device and Method of Forming Three-Dimensional Vertically Oriented Integrated Capacitors App 20110233726 - Huang; Rui ; et al.	2011-09-29
Semiconductor package having through-hole vias on saw streets formed with partial saw Grant 8,021,923 - Do , et al. September 20, 2	2011-09-20
Integrated circuit package system with offset stacked die Grant 8,018,041 - Do , et al. September 13, 2	2011-09-13
Semiconductor package having through-hole vias on saw streets formed with partial saw Grant 8,017,521 - Do , et al. September 13, 2	2011-09-13
Semiconductor package having through-hole vias on saw streets formed with partial saw Grant 8,017,501 - Do , et al. September 13, 2	2011-09-13
Circuit System With Leads And Method Of Manufacture Thereof App 20110214911 - Chow; Seng Guan ; et al.	2011-09-08
Integrated Circuit Packaging System With Encapsulation And Method Of Manufacture Thereof App 20110210436 - Chow; Seng Guan ; et al.	2011-09-01
Leadless package system having external contacts Grant 7,993,979 - Do , et al. August 9, 2	2011-08-09
Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant Grant 7,993,941 - Huang , et al. August 9, 2	2011-08-09
Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof Grant 7,989,269 - Do , et al. August 2, 2	2011-08-02
Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors Grant 7,989,270 - Huang , et al. August 2, 2	2011-08-02
Integrated Circuit Package-in-package System With Wire-in-film Encapsulant And Method For Manufacturing Thereof App 20110180914 - Do; Byung Tai ; et al.	2011-07-28
Integrated circuit package system with interconnect lock Grant 7,985,628 - Kuan , et al. July 26, 2	2011-07-26
Integrated circuit package on package system Grant 7,986,043 - Merilo , et al. July 26, 2	2011-07-26
Integrated circuit package in package system Grant 7,981,702 - Ho , et al. July 19, 2	2011-07-19
Integrated Circuit Packaging System Having Planar Interconnect And Method For Manufacture Thereof App 20110156275 - Pagaila; Reza Argenty ; et al.	2011-06-30
Integrated circuit package system with supported stacked die Grant 7,968,996 - Do , et al. June 28, 2	2011-06-28
Integrated Circuit Packaging System With Package Stacking And Method Of Manufacture Thereof App 20110147901 - Huang; Rui ; et al.	2011-06-23
Integrated Circuit Packaging System With Stacking Interconnect And Method Of Manufacture Thereof App 20110140259 - Cho; NamJu ; et al.	2011-06-16
Through-hole via on saw streets Grant 7,960,841 - Do , et al. June 14, 2	2011-06-14
Integrated Circuit Package System For Electromagnetic Isolation And Method For Manufacturing Thereof App 20110133316 - Huang; Rui ; et al.	2011-06-09
Integrated Circuit Packaging System With Embedded Circuitry And Post App 20110127678 - Shim; Il Kwon ; et al.	2011-06-02
Integrated Circuit Package System With Warp-free Chip App 20110121466 - Do; Byung Tai ; et al.	2011-05-26
Method of Fabricating Semiconductor Die with Through-Hole Via on Saw Streets and Through-Hole Via in Active Area of Die App 20110124156 - Do; Byung Tai ; et al.	2011-05-26
Integrated circuit package system with lead locking structure Grant 7,948,066 - Do , et al. May 24, 2	2011-05-24
Semiconductor Wafer Having Through-Hole Vias on Saw Streets With Backside Redistribution Layer App 20110111591 - Do; Byung Tai ; et al.	2011-05-12
Wafer level chip scale package system with a thermal dissipation structure Grant 7,939,368 - Chow , et al. May 10, 2	2011-05-10
Integrated circuit package-in-package system with wire-in-film encapsulant Grant 7,923,846 - Do , et al. April 12, 2	2011-04-12
Integrated Circuit Package System For Stackable Devices And Method For Manufacturing Thereof App 20110079891 - Chow; Seng Guan ; et al.	2011-04-07
Integrated circuit packaging system having planar interconnect Grant 7,911,070 - Pagaila , et al. March 22, 2	2011-03-22
Integrated circuit package system for electromagnetic isolation Grant 7,902,644 - Huang , et al. March 8, 2	2011-03-08
Semiconductor die with through-hole via on saw streets and through-hole via in active area of die Grant 7,902,638 - Do , et al. March 8, 2	2011-03-08
Encapsulant Interposer System With Integrated Passive Devices And Manufacturing Method Therefor App 20110049687 - Kuan; Heap Hoe ; et al.	2011-03-03
Method of manufacturing integrated circuit package system with warp-free chip Grant 7,892,894 - Do , et al. February 22, 2	2011-02-22
Integrated Circuit Package System With Image Sensor System App 20110037136 - Chow; Seng Guan ; et al.	2011-02-17
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier App 20110037154 - Shim; Il Kwon ; et al.	2011-02-17
Drop-mold Conformable Material As An Encapsulation For An Integrated Circuit Package System And Method For Manufacturing Thereof App 20110037152 - Do; Byung Tai ; et al.	2011-02-17
Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof Grant 7,888,184 - Shim , et al. February 15, 2	2011-02-15
Semiconductor Device and Method of Mounting Die with TSV in Cavity of Substrate for Electrical Interconnect of FI-POP App 20110024888 - Pagaila; Reza A. ; et al.	2011-02-03
Integrated circuit package system with rigid locking lead Grant 7,872,345 - Chow , et al. January 18, 2	2011-01-18
Integrated circuit package-on-package stacking system Grant 7,868,434 - Merilo , et al. January 11, 2	2011-01-11
Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof Grant 7,863,109 - Chow , et al. January 4, 2	2011-01-04
Integrated circuit package system for stackable devices Grant 7,859,094 - Chow , et al. December 28, 2	2010-12-28
Integrated Circuit Package System With Redistribution Layer And Method For Manufacturing Thereof App 20100320603 - Kuan; Heap Hoe ; et al.	2010-12-23
Encapsulant interposer system with integrated passive devices and manufacturing method therefor Grant 7,843,047 - Kuan , et al. November 30, 2	2010-11-30
Embedded semiconductor die package and method of making the same using metal frame carrier Grant 7,842,542 - Shim , et al. November 30, 2	2010-11-30
Wafer level integration package Grant 7,843,042 - Kuan , et al. November 30, 2	2010-11-30
Integrated circuit package system with image sensor system Grant 7,838,899 - Chow , et al. November 23, 2	2010-11-23
Integrated Circuit Packaging System With Coin Bonded Interconnects And Method Of Manufacture Thereof App 20100289142 - Shim; Il Kwon ; et al.	2010-11-18
Integrated Circuit Packaging System With Reinforced Encapsulant Having Embedded Interconnect And Method Of Manufacture Thereof App 20100289134 - Chow; Seng Guan ; et al.	2010-11-18
Drop-mold conformable material as an encapsulation for an integrated circuit package system Grant 7,834,430 - Do , et al. November 16, 2	2010-11-16
Integrated circuit package system stackable devices Grant 7,829,984 - Do , et al. November 9, 2	2010-11-09
Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer Grant 7,829,998 - Do , et al. November 9, 2	2010-11-09
Integrated Circuit Package System Including Honeycomb Molding App 20100279504 - Kuan; Heap Hoe ; et al.	2010-11-04
Integrated Circuit Package System With Offset Stacking And Anti-flash Structure App 20100270680 - Chow; Seng Guan ; et al.	2010-10-28
Integrated circuit package system with redistribution layer Grant 7,812,449 - Kuan , et al. October 12, 2	2010-10-12
Semiconductor Device and Method of Forming No-Flow Underfill Material Around Vertical Interconnect Structure App 20100244216 - Huang; Rui ; et al.	2010-09-30
Integrated Circuit Packaging System With Package Underfill And Method Of Manufacture Thereof App 20100244277 - Huang; Rui ; et al.	2010-09-30
Semiconductor Device and Method of Stacking Same Size Semiconductor Die Electrically Connected Through Conductive Via Formed Around Periphery of the Die App 20100233852 - Do; Byung Tai ; et al.	2010-09-16
Semiconductor Device and Method of Forming Three-Dimensional Vertically Oriented Integrated Capacitors App 20100230806 - Huang; Rui ; et al.	2010-09-16
Integrated Circuit Packaging System With Patterned Substrate And Method Of Manufacture Thereof App 20100224974 - Shim; Il Kwon ; et al.	2010-09-09
Integrated Circuit Packaging System With Flex Tape And Method Of Manufacture Thereof App 20100224978 - Shim; Il Kwon ; et al.	2010-09-09
Stackable Integrated Circuit Package System App 20100219523 - Chow; Seng Guan ; et al.	2010-09-02
Integrated circuit package system with offset stacking and anti-flash structure Grant 7,781,261 - Chow , et al. August 24, 2	2010-08-24
Package-on-Package Using Through-Hole Via Die on Saw Streets App 20100193931 - Do; Byung Tai ; et al.	2010-08-05
Integrated Circuit Package System With Offset Stacked Die App 20100193926 - Do; Byung Tai ; et al.	2010-08-05
Multi-chip package system Grant 7,768,125 - Chow , et al. August 3, 2	2010-08-03
Integrated Circuit Package-on-package Stacking System App 20100176497 - Merilo; Dioscoro A. ; et al.	2010-07-15
Same size die stacked package having through-hole vias formed in organic material Grant 7,750,452 - Do , et al. July 6, 2	2010-07-06
Semiconductor Device and Method of Forming Recessed Conductive Vias in Saw Streets App 20100155922 - Pagaila; Reza A. ; et al.	2010-06-24
Stackable integrated circuit package system Grant 7,741,707 - Chow , et al. June 22, 2	2010-06-22
Integrated Circuit Package System Employing Wafer Level Chip Scale Packaging App 20100148355 - Do; Byung Tai ; et al.	2010-06-17
Extended Redistribution Layers Bumped Wafer App 20100140799 - Do; Byung Tai ; et al.	2010-06-10
Integrated Circuit Packaging System With A Protrusion On An Inner Stacking Module And Method Of Manufacture Thereof App 20100140809 - Chow; Seng Guan ; et al.	2010-06-10
Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant App 20100140771 - Huang; Rui ; et al.	2010-06-10
Semiconductor Device and Method of Forming an IPD Beneath a Semiconductor Die with Direct Connection to External Devices App 20100140780 - Huang; Rui ; et al.	2010-06-10
Semiconductor Device and Method of Forming Conductive Posts Embedded in Photosensitive Encapsulant App 20100144101 - Chow; Seng Guan ; et al.	2010-06-10
Multi-chip package system incorporating an internal stacking module with support protrusions Grant 7,732,252 - Chow , et al. June 8, 2	2010-06-08
Integrated circuit package system with offset stacked die Grant 7,727,816 - Do , et al. June 1, 2	2010-06-01
Encapsulant Interposer System With Integrated Passive Devices And Manufacturing Method Therefor App 20100127361 - Kuan; Heap Hoe ; et al.	2010-05-27
Package-on-package using through-hole via die on saw streets Grant 7,723,159 - Do , et al. May 25, 2	2010-05-25
Integrated circuit package system with image sensor system Grant 7,723,146 - Chow , et al. May 25, 2	2010-05-25
Integrated Circuit Packaging System With Multi Level Contact And Method Of Manufacture Thereof App 20100123251 - Chow; Seng Guan ; et al.	2010-05-20
Integrated circuit package-on-package stacking system and method of manufacture thereof Grant 7,718,472 - Merilo , et al. May 18, 2	2010-05-18
Integrated circuit package system with package integration Grant 7,709,944 - Kuan , et al. May 4, 2	2010-05-04
Semiconductor Package System With Cavity Substrate And Manufacturing Method Therefor App 20100102458 - Chow; Seng Guan ; et al.	2010-04-29
Semiconductor device and method of forming recessed conductive vias in saw streets Grant 7,704,796 - Pagaila , et al. April 27, 2	2010-04-27
Semiconductor Device and Method of Forming Stepped-Down RDL and Recessed THV in Peripheral Region of the Device App 20100096731 - Do; Byung Tai ; et al.	2010-04-22
Integrated circuit package system employing wafer level chip scale packaging Grant 7,700,458 - Do , et al. April 20, 2	2010-04-20
Multi-chip Package System Incorporating An Internal Stacking Module With Support Protrusions App 20100090350 - Chow; Seng Guan ; et al.	2010-04-15
Integrated Circuit Package System With Mounting Structure App 20100078828 - Huang; Rui ; et al.	2010-04-01
Extended redistribution layers bumped wafer Grant 7,687,318 - Do , et al. March 30, 2	2010-03-30
Integrated Circuit Packaging System Having Planar Interconnect App 20100072596 - Pagaila; Reza Argenty ; et al.	2010-03-25
Integrated Circuit Package System For Stackable Devices App 20100072597 - Chow; Seng Guan ; et al.	2010-03-25
Integrated Circuit Package System With Image Sensor System App 20100065936 - Chow; Seng Guan ; et al.	2010-03-18
Leadless Semiconductor Chip Carrier System App 20100059884 - Kuan; Heap Hoe ; et al.	2010-03-11
Integrated Circuit Package System With Redistribution Layer App 20100059885 - Kuan; Heap Hoe ; et al.	2010-03-11
Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device Grant 7,659,145 - Do , et al. February 9, 2	2010-02-09
Semiconductor Device And Method Of Forming Stepped-down Rdl And Recessed Thv In Peripheral Region Of The Device App 20100007029 - Do; Byung Tai ; et al.	2010-01-14
Embedded Semiconductor Die Package and Method of Making the Same Using Metal Frame Carrier App 20100006994 - Shim; Il Kwon ; et al.	2010-01-14
Integrated Circuit Package System With Supported Stacked Die App 20100001391 - Do; Byung Tai ; et al.	2010-01-07
Integrated Circuit Package System Stackable Devices App 20090321899 - Do; Byung Tai ; et al.	2009-12-31
Integrated Circuit Packaging System With Embedded Circuitry And Post, And Method Of Manufacture Thereof App 20090315170 - Shim; Il Kwon ; et al.	2009-12-24
Integrated Circuit Package System With Wire-in-film Encapsulation App 20090315164 - Chow; Seng Guan ; et al.	2009-12-24
Integrated Circuit Package System With Internal Stacking Module App 20090309197 - Chow; Seng Guan ; et al.	2009-12-17
Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference App 20090302435 - Pagaila; Reza A. ; et al.	2009-12-10
Semiconductor device and method of forming recessed conductive vias in saw streets App 20090302478 - Pagaila; Reza A. ; et al.	2009-12-10
Semiconductor Package Having Through-Hole Vias on Saw Streets Formed with Partial Saw App 20090291527 - Do; Byung Tai ; et al.	2009-11-26
Semiconductor Package Having Through-Hole Vias on Saw Streets Formed with Partial Saw App 20090291526 - Do; Byung Tai ; et al.	2009-11-26
Semiconductor Package Having Through-Hole Vias on Saw Streets Formed with Partial Saw App 20090291528 - Do; Byung Tai ; et al.	2009-11-26
Integrated circuit package system with supported stacked die Grant 7,618,848 - Do , et al. November 17, 2	2009-11-17
Through-Hole Via on Saw Streets App 20090267236 - Do; Byung Tai ; et al.	2009-10-29
Wafer Level Integration Package App 20090261460 - Kuan; Heap Hoe ; et al.	2009-10-22
Integrated Circuit Package System With Rigid Locking Lead App 20090243077 - Chow; Seng Guan ; et al.	2009-10-01
Integrated Circuit Package System With Non-symmetrical Support Structures App 20090243068 - Kuan; Heap Hoe ; et al.	2009-10-01
Semiconductor Package with Penetrable Encapsulant Joining Semiconductor Die and Method Thereof App 20090230531 - Do; Byung Tai ; et al.	2009-09-17
Semiconductor Package Having Semiconductor Die with Internal Vertical Interconnect Structure and Method Therefor App 20090224402 - Do; Byung Tai ; et al.	2009-09-10
Semiconductor package having through-hole via on saw streets formed with partial saw Grant 7,585,750 - Do , et al. September 8, 2	2009-09-08
Package System For Shielding Semiconductor Dies From Electromagnetic Interference App 20090212401 - Do; Byung Tai ; et al.	2009-08-27
Integrated Circuit Package System With Penetrable Film Adhesive App 20090212442 - Chow; Seng Guan ; et al.	2009-08-27
Semiconductor Device and Method of Supporting a Wafer During Backgrinding and Reflow of Solder Bumps App 20090212429 - Do; Byung Tai ; et al.	2009-08-27
Through-hole via on saw streets Grant 7,569,421 - Do , et al. August 4, 2	2009-08-04
Integrated circuit package-on-package system with anti-mold flash feature Grant 7,566,966 - Chow , et al. July 28, 2	2009-07-28
Integrated Circuit Package-on-package Stacking System App 20090179312 - Merilo; Dioscoro A. ; et al.	2009-07-16
Leadless Package System Having External Contacts App 20090166824 - Do; Byung Tai ; et al.	2009-07-02
Integrated Circuit Package System With Lead Locking Structure App 20090166823 - Do; Byung Tai ; et al.	2009-07-02
Method of making a wafer level integration package Grant 7,553,752 - Kuan , et al. June 30, 2	2009-06-30
Integrated Circuit Package System For Shielding Electromagnetic Interference App 20090152688 - Do; Byung Tai ; et al.	2009-06-18
Mountable Integrated Circuit Package System With Mountable Integrated Circuit Die App 20090152700 - Kuan; Heap Hoe ; et al.	2009-06-18
Integrated Circuit Package System With Package Integration App 20090152701 - Kuan; Heap Hoe ; et al.	2009-06-18
Integrated Circuit Package System With Interconnect Lock App 20090152706 - Kuan; Heap Hoe ; et al.	2009-06-18
Integrated Circuit Package System With Offset Stacking App 20090152692 - Chow; Seng Guan ; et al.	2009-06-18
Integrated Circuit Package System With Offset Stacking And Anti-flash Structure App 20090155960 - Chow; Seng Guan ; et al.	2009-06-18
Integrated Circuit Package System With Shield App 20090146269 - Chow; Seng Guan ; et al.	2009-06-11
Integrated Circuit Package System For Electromagnetic Isolation App 20090146268 - Huang; Rui ; et al.	2009-06-11
Integrated Circuit Package-on-package System With Anti-mold Flash Feature App 20090140407 - Chow; Seng Guan ; et al.	2009-06-04
Integrated Circuit Package-in-package System With Wire-in-film Encapsulant App 20090127680 - Do; Byung Tai ; et al.	2009-05-21
Integrated Circuit Package System With Insulator App 20090127683 - Do; Byung Tai ; et al.	2009-05-21
Drop-mold Conformable Material As An Encapsulation For An Integrated Circuit Package System App 20090127720 - Do; Byung Tai ; et al.	2009-05-21
Integrated circuit package-on-package stacking system Grant 7,535,086 - Merilo , et al. May 19, 2	2009-05-19
Mountable Integrated Circuit Package System With Mounting Interconnects App 20090115043 - Chow; Seng Guan ; et al.	2009-05-07
Integrated Circuit Package System With Warp-free Chip App 20090079049 - Do; Byung Tai ; et al.	2009-03-26
Integrated Circuit Package-on-package System With Anti-mold Flash Feature App 20090057863 - Chow; Seng Guan ; et al.	2009-03-05
Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution App 20090032975 - Do; Byung Tai ; et al.	2009-02-05
Wafer Level Integration Package App 20080315372 - Kuan; Heap Hoe ; et al.	2008-12-25
Integrated Circuit Package System Employing Resilient Member Mold System Technology App 20080284066 - Kuan; Heap Hoe ; et al.	2008-11-20
Through-Hole Via On Saw Streets App 20080272476 - DO; Byung Tai ; et al.	2008-11-06
System For Implementing Hard-metal Wire Bonds App 20080272487 - Shim; Il Kwon ; et al.	2008-11-06
Semiconductor Wafer Having Through-Hole Vias on Saw Streets with Backside Redistribution Layer App 20080272464 - DO; Byung Tai ; et al.	2008-11-06
Semiconductor Die with Through-Hole Via on Saw Streets and Through-Hole Via in Active Area of Die App 20080272465 - DO; Byung Tai ; et al.	2008-11-06
Semiconductor Package Having Through-Hole Via on Saw Streets Formed with Partial Saw App 20080274603 - DO; Byung Tai ; et al.	2008-11-06
Same Size Through-Hole Via Die Stacked Package App 20080272470 - DO; Byung Tai ; et al.	2008-11-06
Package-on-Package Using Through-Hole Via Die on Saw Streets App 20080272477 - DO; Byung Tai ; et al.	2008-11-06
Extended Redistribution Layers Bumped Wafer App 20080272368 - DO; Byung Tai ; et al.	2008-11-06
Package-in-Package Using Through-Hole via Die on Saw Streets App 20080272504 - DO; Byung Tai ; et al.	2008-11-06
Stackable Integrated Circuit Package System With Multiple Interconnect Interface App 20080203549 - Chow; Seng Guan ; et al.	2008-08-28
Stackable integrated circuit package system with multiple interconnect interface Grant 7,385,299 - Chow , et al. June 10, 2	2008-06-10
Integrated Circuit Package System With Supported Stacked Die App 20080036052 - Do; Byung Tai ; et al.	2008-02-14
Integrated Circuit Package-on-package Stacking System App 20080029858 - Merilo; Dioscoro A. ; et al.	2008-02-07
Integrated Circuit Package System Employing Wafer Level Chip Scale Packaging App 20080029859 - Do; Byung Tai ; et al.	2008-02-07
Integrated Circuit Package System With Offset Stacked Die App 20080017955 - Do; Byung Tai ; et al.	2008-01-24
Integrated Circuit Package System Employing An Exposed Thermally Conductive Coating App 20080012098 - Chow; Seng Guan ; et al.	2008-01-17
Integrated Circuit Leaded Stacked Package System App 20070209834 - Kuan; Heap Hoe ; et al.	2007-09-13
Integrated Circuit Package In Package System App 20070210424 - Ho; Tsz Yin ; et al.	2007-09-13
Integrated Circuit Package On Package System App 20070210443 - Merilo; Dioscoro A. ; et al.	2007-09-13
Wafer Level Chip Scale Package System With A Thermal Dissipation Structure App 20070212812 - Chow; Seng Guan ; et al.	2007-09-13
Stackable Integrated Circuit Package System App 20070200230 - Chow; Seng Guan ; et al.	2007-08-30
Stackable Integrated Circuit Package System With Multiple Interconnect Interface App 20070200257 - Chow; Seng Guan ; et al.	2007-08-30
Integrated circuit package system with image sensor system App 20070166867 - Chow; Seng Guan ; et al.	2007-07-19
Multi-chip package system App 20070158809 - Chow; Seng Guan ; et al.	2007-07-12
Wafer Level Laser Marking System For Ultra-thin Wafers Using Support Tape App 20070080450 - Kuan; Heap Hoe ; et al.	2007-04-12
Ultra-thin Wafer System App 20070075421 - Kuan; Heap Hoe ; et al.	2007-04-05
Wafer Strength Reinforcement System For Ultra Thin Wafer Thinning App 20060219351 - Kuan; Heap Hoe ; et al.	2006-10-05