Kuan; Francis Heap Hoe
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuan; Francis Heap Hoe.The latest application filed is for "structure for bumped wafer test".
- Kuan; Francis Heap Hoe - Singapore SG
| Patent | Date |
|---|---|
| Structure for bumped wafer test Grant 8,203,145 - Kuan , et al. June 19, 2 | 2012-06-19 |
| Semiconductor assembly with component pads attached on die back side Grant 7,952,211 - Chow , et al. May 31, 2 | 2011-05-31 |
| Structure for Bumped Wafer Test App 20110121295 - Kuan; Francis Heap Hoe ; et al. | 2011-05-26 |
| Structure for bumped wafer test Grant 7,901,956 - Kuan , et al. March 8, 2 | 2011-03-08 |
| Leaded stacked packages having elevated die paddle Grant 7,858,442 - Do , et al. December 28, 2 | 2010-12-28 |
| Leaded stacked packages having integrated upper lead Grant 7,667,308 - Do , et al. February 23, 2 | 2010-02-23 |
| Semiconductor Assembly With Component Attached On Die Back Side App 20100032828 - Chow; Seng Guan ; et al. | 2010-02-11 |
| Semiconductor assembly with component attached on die back side Grant 7,622,811 - Chow , et al. November 24, 2 | 2009-11-24 |
| Leaded Stacked Packages Having Elevated Die Paddle App 20090142883 - Do; Byung Tai ; et al. | 2009-06-04 |
| Leaded stacked packages having elevated die paddle Grant 7,495,321 - Do , et al. February 24, 2 | 2009-02-24 |
| Semiconductor assembly with component attached on die back side App 20080067695 - Chow; Seng Guan ; et al. | 2008-03-20 |
| Structure For Bumped Wafer Test App 20080042275 - Kuan; Francis Heap Hoe ; et al. | 2008-02-21 |
| Leaded Stacked Packages Having Elevated Die Paddle App 20080017994 - Do; Byung Tai ; et al. | 2008-01-24 |
| Leaded Stacked Packages Having Integrated Upper Lead App 20080017957 - Do; Byung Tai ; et al. | 2008-01-24 |
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