Kuah; Teng Hock
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kuah; Teng Hock.The latest application filed is for "dual-sided molding for encapsulating electronic devices".
Company Profile
3.25.31
- Kuah; Teng Hock - Singapore SG
Patent Activity
| Patent | Date |
|---|---|
| Apparatus and method for processing a semiconductor device Grant 11,227,779 - Ding , et al. January 18, 2 | 2022-01-18 |
| Dual-sided Molding For Encapsulating Electronic Devices App 20210351049 - KUAH; Teng Hock ; et al. | 2021-11-11 |
| Apparatus And Method For Removing A Film From A Surface App 20210237422 - HAO; Ji Yuan ; et al. | 2021-08-05 |
| Molding system for applying a uniform clamping pressure onto a substrate Grant 10,960,583 - Ho , et al. March 30, 2 | 2021-03-30 |
| Apparatus And Method For Processing A Semiconductor Device App 20190080939 - DING; Jiapei ; et al. | 2019-03-14 |
| Three-dimensional Integrated Fan-out Wafer Level Package App 20190006339 - LAU; Hon Shing, John ; et al. | 2019-01-03 |
| Method for manufacturing wafer-level semiconductor packages Grant 10,115,579 - Fan , et al. October 30, 2 | 2018-10-30 |
| Method For Manufacturing Wafer-level Semiconductor Packages App 20180151342 - FAN; Chun Ho ; et al. | 2018-05-31 |
| Molding Apparatus Including A Compressible Structure App 20180117813 - HO; Shu Chuen ; et al. | 2018-05-03 |
| Semiconductor encapsulation system comprising a vacuum pump and a reservoir pump Grant 9,947,561 - Kuah , et al. April 17, 2 | 2018-04-17 |
| Molding System For Applying A Uniform Clamping Pressure Onto A Substrate App 20180021993 - HO; Shu Chuen ; et al. | 2018-01-25 |
| Semiconductor Encapsulation System Comprising A Vacuum Pump And A Reservoir Pump App 20170252954 - KUAH; Teng Hock ; et al. | 2017-09-07 |
| Molding press and a platen for a molding press Grant 9,427,893 - Su , et al. August 30, 2 | 2016-08-30 |
| Molding Press And A Platen For A Molding Press App 20160082624 - SU; Jian Xiong ; et al. | 2016-03-24 |
| Feed-through apparatus for a chemical vapour deposition device Grant 9,279,185 - Li , et al. March 8, 2 | 2016-03-08 |
| Substrate carrier for molding electronic devices Grant 9,199,396 - Kuah , et al. December 1, 2 | 2015-12-01 |
| Chemical Vapour Deposition Injector App 20140284404 - KUAH; Teng Hock ; et al. | 2014-09-25 |
| Apparatus for thin-film deposition Grant 8,840,726 - Li , et al. September 23, 2 | 2014-09-23 |
| Feed-through Apparatus For A Chemical Vapour Deposition Device App 20130333620 - LI; Zilan ; et al. | 2013-12-19 |
| Apparatus For Thin-film Deposition App 20120312231 - LI; Zilan ; et al. | 2012-12-13 |
| Substrate Carrier For Molding Electronic Devices App 20120013040 - KUAH; Teng Hock ; et al. | 2012-01-19 |
| Compression molding of an electronic device Grant 8,011,917 - Hao , et al. September 6, 2 | 2011-09-06 |
| Compression Molding Of An Electronic Device App 20080277829 - HAO; Ji Yuan ; et al. | 2008-11-13 |
| Electronic device with high lead density App 20060105501 - Kuah; Teng Hock ; et al. | 2006-05-18 |
| Apparatus and method for reducing substrate warpage Grant 6,988,879 - Ho , et al. January 24, 2 | 2006-01-24 |
| Method of manufacturing an IC package Grant 6,986,197 - Wu , et al. January 17, 2 | 2006-01-17 |
| Method and apparatus for molding a semiconductor device App 20050287236 - Ho, Shu Chuen ; et al. | 2005-12-29 |
| Electronic device with high lead density App 20050248041 - Kuah, Teng Hock ; et al. | 2005-11-10 |
| Pellet feeding system for a molding machine Grant 6,877,933 - Ho , et al. April 12, 2 | 2005-04-12 |
| Molding system for semiconductor packages Grant 6,869,556 - Ho , et al. March 22, 2 | 2005-03-22 |
| Mold for encapsulating a semiconductor chip Grant 6,860,731 - Ho , et al. March 1, 2 | 2005-03-01 |
| Method for encapsulating leadframe-mounted integrated circuits Grant 6,808,661 - Ong , et al. October 26, 2 | 2004-10-26 |
| Cleaning of an electronic device App 20040194803 - Ho, Shu Chuen ; et al. | 2004-10-07 |
| Mold and method for encapsulation of electronic device Grant 6,770,163 - Kuah , et al. August 3, 2 | 2004-08-03 |
| Method of detaching a film of material from a substrate Grant 6,752,896 - Ong , et al. June 22, 2 | 2004-06-22 |
| Mold cleaning apparatus Grant 6,736,627 - Liu , et al. May 18, 2 | 2004-05-18 |
| Apparatus and method for reducing substrate warpage App 20040077130 - Ho, Shu Chuen ; et al. | 2004-04-22 |
| Molding apparatus Grant 6,709,252 - Liu , et al. March 23, 2 | 2004-03-23 |
| Molding system for semiconductor packages App 20040012119 - Ho, Shu Chuen ; et al. | 2004-01-22 |
| Method of manufacturing an IC package App 20040003497 - Wu, Jian ; et al. | 2004-01-08 |
| Mold for a semiconductor chip Grant 6,674,165 - Ho , et al. January 6, 2 | 2004-01-06 |
| Removal of masking tape from lead frames Grant 6,656,320 - Ong , et al. December 2, 2 | 2003-12-02 |
| Methods and apparatus for cleaning an IC encapsulation system App 20030107142 - Ong, See Yap ; et al. | 2003-06-12 |
| Pellet feeding system for a moulding machine App 20030054067 - Ho, Shu Chuen ; et al. | 2003-03-20 |
| Mold App 20030034555 - Ho, Shu Chuen ; et al. | 2003-02-20 |
| Molding apparatus App 20030012836 - Liu, Jie ; et al. | 2003-01-16 |
| Method of detaching a film of material from a substrate App 20030010430 - Ong, See Yap ; et al. | 2003-01-16 |
| Removal of masking tape from lead frames App 20030010444 - Ong, See Yap ; et al. | 2003-01-16 |
| Mold App 20030006529 - Ho, Shu Chuen ; et al. | 2003-01-09 |
| Mold cleaning apparatus App 20030008027 - Liu, Jie ; et al. | 2003-01-09 |
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