Ku; Shih-Chang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ku; Shih-Chang.The latest application filed is for "semiconductor structure".
- Ku; Shih-Chang - Taipei TW
- KU; SHIH-CHANG - TAIPEI CITY TW
- Ku; Shih-Chang - Hsin-Tien TW
- Ku; Shih-Chang - Hsin Tien City TW
| Patent | Date |
|---|---|
| Package structure Grant 11,282,766 - Ku , et al. March 22, 2 | 2022-03-22 |
| Semiconductor Structure App 20210366805 - WU; CHI-HSI ; et al. | 2021-11-25 |
| Semiconductor structure Grant 11,088,048 - Wu , et al. August 10, 2 | 2021-08-10 |
| Semiconductor Device and Method of Manufacture App 20210233833 - Ku; Shih-Chang ; et al. | 2021-07-29 |
| Semiconductor device methods of manufacture Grant 10,978,373 - Ku , et al. April 13, 2 | 2021-04-13 |
| Package Structure App 20210098333 - Ku; Shih-Chang ; et al. | 2021-04-01 |
| Semiconductor Structure App 20200135610 - WU; CHI-HSI ; et al. | 2020-04-30 |
| Semiconductor structure and manufacturing method thereof Grant 10,515,867 - Wu , et al. Dec | 2019-12-24 |
| Semiconductor Device And Method Of Manufacture App 20190385929 - Ku; Shih-Chang ; et al. | 2019-12-19 |
| Semiconductor Structure And Manufacturing Method Thereof App 20190148261 - WU; CHI-HSI ; et al. | 2019-05-16 |
| Electronic apparatus and thermal dissipating module thereof Grant 7,477,515 - Tsai , et al. January 13, 2 | 2009-01-13 |
| Non-metal mesh cover for metal chassis Grant 7,355,849 - Ku April 8, 2 | 2008-04-08 |
| Non-metal mesh cover for metal chassis App 20070184245 - Ku; Shih-Chang | 2007-08-09 |
| Fan-shaped heat-dissipating device Grant 7,248,477 - Lee , et al. July 24, 2 | 2007-07-24 |
| IC package with an implanted heat-dissipation fin Grant 7,196,904 - Ku March 27, 2 | 2007-03-27 |
| Electronic apparatus and thermal dissipating module thereof App 20070058347 - Tsai; Kuo-Ying ; et al. | 2007-03-15 |
| Heat-dissipating device App 20060104034 - Tsai; Kuo-ying ; et al. | 2006-05-18 |
| Lateral airflow fan-sink for electronic devices App 20060067051 - Ku; Shih-Chang | 2006-03-30 |
| Modular heat-dissipation assembly structure for a PCB App 20050286229 - Ku, Shih-Chang | 2005-12-29 |
| Fan-shaped heat-dissipating device App 20050237718 - Lee, I-Tseng ; et al. | 2005-10-27 |
| Multi-opening heat-dissipation device for high-power electronic components Grant 6,914,782 - Ku July 5, 2 | 2005-07-05 |
| Lateral airflow fan-sink for electronic devices App 20040212962 - Ku, Shih-Chang | 2004-10-28 |
| IC package for a multi-chip module App 20040099945 - Ku, Shih-Chang | 2004-05-27 |
| IC package with an implanted heat-dissipation fin App 20040037043 - Ku, Shih-Chang | 2004-02-26 |
| Multi-opening heat-dissipation device for high-power electronic components App 20030151900 - Ku, Shih-Chang | 2003-08-14 |
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