Ku; Jung-I
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ku; Jung-I.The latest application filed is for "solder bath with rotatable nozzle".
- Ku; Jung-I - Taipei Hsien TW
| Patent | Date |
|---|---|
| Solder bath with rotatable nozzle Grant 6,742,693 - Wang , et al. June 1, 2 | 2004-06-01 |
| Adjustable nozzle of stannic furnace Grant 6,732,903 - Wang , et al. May 11, 2 | 2004-05-11 |
| Adjustable nozzle of stannic furnace App 20030116607 - Wang, Po-Hung ; et al. | 2003-06-26 |
| Solder bath with rotatable nozzle App 20030116606 - Wang, Po-Hung ; et al. | 2003-06-26 |
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