Krusell; Wilbur C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Krusell; Wilbur C..The latest application filed is for "integrated pad and belt for chemical mechanical polishing".

Company Profile

0.20.5

Krusell; Wilbur C. - Palo Alto CA
Krusell; Wilbur C. - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film Grant 6,927,198 - Zhang , et al. August 9, 2	2005-08-09
Integrated pad and belt for chemical mechanical polishing App 20050118936 - Pant, Anil K. ; et al.	2005-06-02
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film App 20040033917 - Zhang, Liming ; et al.	2004-02-19
Integrated pad and belt for chemical mechanical polishing Grant 6,656,025 - Pant , et al. December 2, 2	2003-12-02
Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing Grant 6,621,584 - Pecen , et al. September 16, 2	2003-09-16
Method of transporting a semiconductor wafer in a wafer polishing system Grant 6,517,418 - Engdahl , et al. February 11, 2	2003-02-11
Method and apparatus for in-situ monitoring of thickness during chemical -mechanical polishing App 20020089676 - Pecen, Jiri ; et al.	2002-07-11
System and method for creating and navigating a linear hypermedia resource program App 20020031988 - Pant, Anil K. ; et al.	2002-03-14
Integrated pad and belt for chemical mechanical polishing Grant 6,328,642 - Pant , et al. December 11, 2	2001-12-11
Use of zeta potential during chemical mechanical polishing for end point detection Grant 6,325,706 - Krusell , et al. December 4, 2	2001-12-04
Method of transporting a semiconductor wafer in a wafer polishing system App 20010039168 - Engdahl, Erik H. ; et al.	2001-11-08
Method to remove metals in a scrubber Grant 6,274,059 - Krusell , et al. August 14, 2	2001-08-14
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher Grant 6,261,155 - Jairath , et al. July 17, 2	2001-07-17
Method and apparatus for stabilizing the process temperature during chemical mechanical polishing Grant 6,224,461 - Boehm, Jr. , et al. May 1, 2	2001-05-01
Apparatus and method for performing end point detection on a linear planarization tool Grant 6,186,865 - Thornton , et al. February 13, 2	2001-02-13
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film Grant 6,165,956 - Zhang , et al. December 26, 2	2000-12-26
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film Grant 6,162,301 - Zhang , et al. December 19, 2	2000-12-19
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher Grant 6,146,248 - Jairath , et al. November 14, 2	2000-11-14
Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF) Grant 6,145,148 - Hymes , et al. November 14, 2	2000-11-14
Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing Grant 6,111,634 - Pecen , et al. August 29, 2	2000-08-29
Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing Grant 6,108,091 - Pecen , et al. August 22, 2	2000-08-22
Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF) Grant 5,868,863 - Hymes , et al. February 9, 1	1999-02-09
Method and apparatus for cleaning edges of contaminated substrates Grant 5,861,066 - Moinpour , et al. January 19, 1	1999-01-19
Organic preclean for improving vapor phase wafer etch uniformity Grant 5,762,755 - McNeilly , et al. June 9, 1	1998-06-09
Chemical vapor deposition of silicon dioxide using hexamethyldisilazane Grant 5,304,398 - Krusell , et al. April 19, 1	1994-04-19

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