Krulik, Gerald A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Krulik, Gerald A..The latest application filed is for "reverse osmosis pretreatment using low pressure filtration".

Company Profile

0.19.6

Krulik, Gerald A. - San Clemente CA
Krulik; Gerald A. - San Clementa CA
Krulik; Gerald A. - El Toro CA
Krulik; Gerald A. - Lake Forest CA
Krulik; Gerald A. - Laguna Hills CA
Krulik; Gerald A. - Hoffman Estates IL
Krulik; Gerald A. - Washington WV

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reverse osmosis pretreatment using low pressure filtration App 20040108277 - Krulik, Gerald A.	2004-06-10
Filter cleaning method Grant 6,723,246 - Krulik April 20, 2	2004-04-20
Simultaneous ammonia and fluoride treatment for wastewater Grant 6,652,758 - Krulik November 25, 2	2003-11-25
System and method for removal of fluoride from wastewater using single fluoride sensing electrode Grant 6,645,385 - Krulik , et al. November 11, 2	2003-11-11
Method for simultaneous removal of arsenic and fluoride from aqueous solutions Grant 6,613,230 - Krulik , et al. September 2, 2	2003-09-02
Method of treating industrial waste waters Grant 6,582,605 - Krulik , et al. June 24, 2	2003-06-24
Simultaneous ammonia and fluoride treatment for wastewater App 20020148790 - Krulik, Gerald A.	2002-10-17
Filter cleaning method App 20020121483 - Krulik, Gerald A.	2002-09-05
System and method for removal of fluoride from wastewater using single fluoride sensing electrode App 20020117456 - Krulik, Gerald A. ; et al.	2002-08-29
System and method for simultaneous removal of arsenic and fluoride from aqueous solutions App 20020113023 - Krulik, Gerald A. ; et al.	2002-08-22
Method of treating industrial waste waters App 20020088759 - Krulik, Gerald A. ; et al.	2002-07-11
Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly Grant 6,143,155 - Adams , et al. November 7, 2	2000-11-07
Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly Grant 6,132,586 - Adams , et al. October 17, 2	2000-10-17
Method and apparatus for planarization of metallized semiconductor wafers using a bipolar electrode assembly Grant 6,121,152 - Adams , et al. September 19, 2	2000-09-19
Separation and purification of fluoride from industrial wastes Grant 5,876,685 - Krulik , et al. March 2, 1	1999-03-02
Rinse water recycling method for semiconductor wafer processing equipment Grant 5,855,792 - Adams , et al. January 5, 1	1999-01-05
Method and apparatus for polishing Grant 5,722,875 - Iwashita , et al. March 3, 1	1998-03-03
Slurry recycling in CMP apparatus Grant 5,664,990 - Adams , et al. September 9, 1	1997-09-09
Solder and tin stripper composition Grant 5,512,201 - Singh , et al. April 30, 1	1996-04-30
Electroless silver plating composition Grant 5,322,553 - Mandich , et al. June 21, 1	1994-06-21
Plating rate improvement for electroless silver and gold plating Grant 5,318,621 - Krulik , et al. June 7, 1	1994-06-07
Low corrosivity catalyst for activation of copper for electroless nickel plating Grant 5,212,138 - Krulik , et al. May 18, 1	1993-05-18
Apparatus for bailout elimination and for enhancing plating bath stability in electrosynthesis/electrodialysis electroless copper purification process Grant 4,805,553 - Krulik February 21, 1	1989-02-21
Method for electroless plating on nonconductive substrates using palladium/tin catalyst in aqueous solution containing a hydroxy substituted organic acid Grant 4,182,784 - Krulik January 8, 1	1980-01-08
Reproduction system utilizing ion modular and dielectric imaging surface Grant 3,937,571 - Krulik , et al. February 10, 1	1976-02-10

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