Krug; J. Paul
Patent Applications and Registrations
Patent applications and USPTO patent grants for Krug; J. Paul.The latest application filed is for "wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith".
- Krug; J. Paul - Middletown CT
| Patent | Date |
|---|---|
| Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith Grant 7,109,061 - Crane , et al. September 19, 2 | 2006-09-19 |
| Fluxing underfill compositions Grant 7,009,009 - Crane , et al. March 7, 2 | 2006-03-07 |
| Method of bonding die chip with underfill fluxing composition Grant 6,667,194 - Crane , et al. December 23, 2 | 2003-12-23 |
| Fluxing underfill compositions Grant 6,458,472 - Konarski , et al. October 1, 2 | 2002-10-01 |
| Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith App 20020089067 - Crane, Lawrence N. ; et al. | 2002-07-11 |
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