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Wafer-level package and method for production thereof Grant 9,647,196 - Bauer , et al. May 9, 2 | 2017-05-09 |
Component and method for producing a component Grant 9,382,110 - Bauer , et al. July 5, 2 | 2016-07-05 |
Method for connecting a plurality of unpackaged substrates Grant 9,165,905 - Krueger , et al. October 20, 2 | 2015-10-20 |
Method and apparatus for producing chip devices, and chip device produced by means of the method Grant 9,114,979 - Gerner , et al. August 25, 2 | 2015-08-25 |
Miniaturized electrical component comprising an MEMS and an ASIC and production method Grant 9,056,760 - Feiertag , et al. June 16, 2 | 2015-06-16 |
Circuit board with flexible region and method for production thereof Grant 9,035,189 - Pahl , et al. May 19, 2 | 2015-05-19 |
MEMS microphone and method for producing the MEMS microphone Grant 8,865,499 - Pahl , et al. October 21, 2 | 2014-10-21 |
Component and Method for Producing a Component App 20140226285 - Bauer; Christian ;   et al. | 2014-08-14 |
Hermetically sealed housing for electronic components and manufacturing method Grant 8,759,677 - Bauer , et al. June 24, 2 | 2014-06-24 |
Wafer-Level Package and Method for Production Thereof App 20140111062 - Bauer; Christian ;   et al. | 2014-04-24 |
Element with optical marking, manufacturing method, and use Grant 8,691,369 - Schmajew , et al. April 8, 2 | 2014-04-08 |
Semiconductor chip arrangement with sensor chip and manufacturing method Grant 8,580,613 - Feiertag , et al. November 12, 2 | 2013-11-12 |
Component and Method for Producing a Component App 20130214405 - Bauer; Christian ;   et al. | 2013-08-22 |
MEMS Microphone And Method For Producing The MEMS Microphone App 20130140656 - Pahl; Wolfgang ;   et al. | 2013-06-06 |
Miniaturized Electrical Component Comprising an MEMS and an ASIC and Production Method App 20130119492 - Feiertag; Gregor ;   et al. | 2013-05-16 |
MEMS package and method for the production thereof Grant 8,432,007 - Leidl , et al. April 30, 2 | 2013-04-30 |
Method for producing a MEMS package Grant 8,404,516 - Bauer , et al. March 26, 2 | 2013-03-26 |
Method for Connecting a Plurality of Unpackaged Substrates App 20120159778 - Krueger; Hans ;   et al. | 2012-06-28 |
MEMS package and method for the production thereof Grant 8,169,041 - Pahl , et al. May 1, 2 | 2012-05-01 |
Method and Apparatus for Producing Chip Devices, and Chip Device Produced by Means of the Method App 20120061778 - Gerner; Michael ;   et al. | 2012-03-15 |
MEMS component and method for production Grant 8,110,962 - Bauer , et al. February 7, 2 | 2012-02-07 |
Component with reduced temperature response, and method for production Grant 8,098,001 - Pahl , et al. January 17, 2 | 2012-01-17 |
Semiconductor Chip Arrangement With Sensor Chip And Manufacturing Method App 20110233690 - Feiertag; Gregor ;   et al. | 2011-09-29 |
Circuit Board with Flexible Region and Method for Production Thereof App 20110214905 - Pahl; Wolfgang ;   et al. | 2011-09-08 |
MEMS Package and Method for the Production Thereof App 20110186943 - Pahl; Wolfgang ;   et al. | 2011-08-04 |
Hermetically Sealed Housing For Electronic Components And Manufacturing Method App 20110114355 - Bauer; Christian ;   et al. | 2011-05-19 |
Component with Reduced Temperature Response, and Method for Production App 20100187949 - Pahl; Wolfgang ;   et al. | 2010-07-29 |
MEMS Component and Method for Production App 20100148285 - Bauer; Christian ;   et al. | 2010-06-17 |
Method for Producing a MEMS Package App 20100127377 - Bauer; Christian ;   et al. | 2010-05-27 |
Flip-chip component production method Grant 7,673,386 - Stelzl , et al. March 9, 2 | 2010-03-09 |
Method for hermetically encapsulating a component Grant 7,552,532 - Stelzl , et al. June 30, 2 | 2009-06-30 |
Encapsulated electrical component and production method Grant 7,544,540 - Bauer , et al. June 9, 2 | 2009-06-09 |
Element with Optical Marking, Manufacturing Method, and Use App 20090104415 - Schmajew; Alexander ;   et al. | 2009-04-23 |
Electric component with a flip-chip construction Grant 7,518,249 - Krueger , et al. April 14, 2 | 2009-04-14 |
Flip-Chip Component and Method for its Production App 20090071710 - Stelzl; Alois ;   et al. | 2009-03-19 |
Mems Package and Method for the Production Thereof App 20090001553 - Pahl; Wolfgang ;   et al. | 2009-01-01 |
Encapsulated electronic component and production method Grant 7,388,281 - Krueger , et al. June 17, 2 | 2008-06-17 |
Electric Component With A Flip-Chip Construction App 20080048317 - Krueger; Hans ;   et al. | 2008-02-28 |
Encapsulated Electrical Component and Production Method App 20070222056 - Bauer; Christian ;   et al. | 2007-09-27 |
Method for the hermetic encapsulation of a component Grant 7,259,041 - Stelzl , et al. August 21, 2 | 2007-08-21 |
Encapsulated electronic component and production method App 20060151203 - Krueger; Hans ;   et al. | 2006-07-13 |
Encapsulated component which is small in terms of height and method for producing the same Grant 6,982,380 - Hoffmann , et al. January 3, 2 | 2006-01-03 |
Method for the hermetic encapsulation of a component App 20050121785 - Stelzl, Alois ;   et al. | 2005-06-09 |
Encapsulated component which is small in terms of height and method for producing the same App 20050034888 - Hoffmann, Christian ;   et al. | 2005-02-17 |
Method for hermetically encapsulating a component App 20040237299 - Stelzl, Alois ;   et al. | 2004-12-02 |
Process for manufacturing an electronic component, in particular a surface-wave component working with acoustic surface waves Grant 6,722,030 - Stelzl , et al. April 20, 2 | 2004-04-20 |
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High-power stripline laser Grant 5,197,079 - Krueger , et al. March 23, 1 | 1993-03-23 |
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