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Method for machining a workpiece on a workpiece support Grant 8,357,588 - Bradl , et al. January 22, 2 | 2013-01-22 |
Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer Grant RE42,980 - Kroninger , et al. November 29, 2 | 2011-11-29 |
Method For Applying A Resist Layer, Uses Of Adhesive Materials, And Adhesive Materials And Resist Layer App 20110269073 - Kroninger; Werner ;   et al. | 2011-11-03 |
Method For Machining A Workpiece On A Workpiece Support App 20110232074 - Bradl; Stephen ;   et al. | 2011-09-29 |
Semiconductor device and method Grant 7,988,794 - Kroninger , et al. August 2, 2 | 2011-08-02 |
Method for machining a workpiece on a workpiece support Grant 7,892,947 - Bradl , et al. February 22, 2 | 2011-02-22 |
Work carrier and method of processing a workpiece Grant 7,708,854 - Kroninger , et al. May 4, 2 | 2010-05-04 |
Method of making an integrated circuit including singulating a semiconductor wafer Grant 7,674,689 - Schneegans , et al. March 9, 2 | 2010-03-09 |
Method Of Making An Integrated Circuit Including Singulating A Semiconductor Wafer App 20090079038 - Schneegans; Manfred ;   et al. | 2009-03-26 |
Method For Applying A Resist Layer, Uses Of Adhesive Materials, And Adhesive Materials And Resist Layer App 20080305428 - Kroninger; Werner ;   et al. | 2008-12-11 |
Semiconductor device and method App 20080185715 - Kroninger; Werner ;   et al. | 2008-08-07 |
Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer Grant 7,351,514 - Kroninger , et al. April 1, 2 | 2008-04-01 |
Method for machining a workpiece on a workpiece support App 20070117351 - Bradl; Stephan ;   et al. | 2007-05-24 |
Device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer App 20060032587 - Hecht; Franz ;   et al. | 2006-02-16 |
Scratch-resistant coating for a semiconductor component Grant 6,973,205 - Frank , et al. December 6, 2 | 2005-12-06 |
Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer Grant 6,972,069 - Hecht , et al. December 6, 2 | 2005-12-06 |
Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer App 20050266353 - Kroninger, Werner ;   et al. | 2005-12-01 |
Wafer stabilization device and associated production method App 20050236693 - Kroninger, Werner ;   et al. | 2005-10-27 |
Method of processing a workpiece, and a work carrier, in particular of porous ceramic App 20040231793 - Kroninger, Werner ;   et al. | 2004-11-25 |
Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer App 20030173017 - Hecht, Franz ;   et al. | 2003-09-18 |
Scratch-resistant coating for a semiconductor component App 20020114496 - Frank, Manfred ;   et al. | 2002-08-22 |
Process for producing very thin semiconductor chips Grant 6,046,073 - Lang , et al. April 4, 2 | 2000-04-04 |