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name:-0.013430118560791
name:-0.011471033096313
name:-0.0005180835723877
Kroninger; Werner Patent Filings

Kroninger; Werner

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kroninger; Werner.The latest application filed is for "method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer".

Company Profile
0.11.12
  • Kroninger; Werner - Albersdorf N/A DE
  • Kroninger; Werner - Regensburg DE
  • Kroninger; Werner - Vilshofen/Albersdorf DE
  • Kroninger; Werner - Neutraubling DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for machining a workpiece on a workpiece support
Grant 8,357,588 - Bradl , et al. January 22, 2
2013-01-22
Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer
Grant RE42,980 - Kroninger , et al. November 29, 2
2011-11-29
Method For Applying A Resist Layer, Uses Of Adhesive Materials, And Adhesive Materials And Resist Layer
App 20110269073 - Kroninger; Werner ;   et al.
2011-11-03
Method For Machining A Workpiece On A Workpiece Support
App 20110232074 - Bradl; Stephen ;   et al.
2011-09-29
Semiconductor device and method
Grant 7,988,794 - Kroninger , et al. August 2, 2
2011-08-02
Method for machining a workpiece on a workpiece support
Grant 7,892,947 - Bradl , et al. February 22, 2
2011-02-22
Work carrier and method of processing a workpiece
Grant 7,708,854 - Kroninger , et al. May 4, 2
2010-05-04
Method of making an integrated circuit including singulating a semiconductor wafer
Grant 7,674,689 - Schneegans , et al. March 9, 2
2010-03-09
Method Of Making An Integrated Circuit Including Singulating A Semiconductor Wafer
App 20090079038 - Schneegans; Manfred ;   et al.
2009-03-26
Method For Applying A Resist Layer, Uses Of Adhesive Materials, And Adhesive Materials And Resist Layer
App 20080305428 - Kroninger; Werner ;   et al.
2008-12-11
Semiconductor device and method
App 20080185715 - Kroninger; Werner ;   et al.
2008-08-07
Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer
Grant 7,351,514 - Kroninger , et al. April 1, 2
2008-04-01
Method for machining a workpiece on a workpiece support
App 20070117351 - Bradl; Stephan ;   et al.
2007-05-24
Device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer
App 20060032587 - Hecht; Franz ;   et al.
2006-02-16
Scratch-resistant coating for a semiconductor component
Grant 6,973,205 - Frank , et al. December 6, 2
2005-12-06
Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer
Grant 6,972,069 - Hecht , et al. December 6, 2
2005-12-06
Method for applying a resist layer, uses of adhesive materials, and adhesive materials and resist layer
App 20050266353 - Kroninger, Werner ;   et al.
2005-12-01
Wafer stabilization device and associated production method
App 20050236693 - Kroninger, Werner ;   et al.
2005-10-27
Method of processing a workpiece, and a work carrier, in particular of porous ceramic
App 20040231793 - Kroninger, Werner ;   et al.
2004-11-25
Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer
App 20030173017 - Hecht, Franz ;   et al.
2003-09-18
Scratch-resistant coating for a semiconductor component
App 20020114496 - Frank, Manfred ;   et al.
2002-08-22
Process for producing very thin semiconductor chips
Grant 6,046,073 - Lang , et al. April 4, 2
2000-04-04

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