Kroehnert; Steffen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kroehnert; Steffen.The latest application filed is for "packaging systems and methods".
- Kroehnert; Steffen - Dresden DE
| Patent | Date |
|---|---|
| Semiconductor device with chip mounted on a substrate Grant 8,410,595 - Kroehnert , et al. April 2, 2 | 2013-04-02 |
| Packaging systems and methods Grant 8,004,072 - Hedler , et al. August 23, 2 | 2011-08-23 |
| Packaging Systems and Methods App 20100090322 - Hedler; Harry ; et al. | 2010-04-15 |
| Substrate for an FBGA semiconductor component Grant 7,518,220 - Kroehnert , et al. April 14, 2 | 2009-04-14 |
| Semiconductor Device with Chip Mounted on a Substrate App 20080157330 - Kroehnert; Steffen ; et al. | 2008-07-03 |
| Integrated chip device in a package App 20070090527 - Thomas; Jochen ; et al. | 2007-04-26 |
| Manufacturing method for an electronic component assembly and corresponding electronic component assembly App 20060270109 - Blaszczak; Stephan ; et al. | 2006-11-30 |
| Method and casting mold for producing a protective layer on integrated components App 20060255504 - Kroehnert; Steffen ; et al. | 2006-11-16 |
| Substrate for producing a soldering connection to a second substrate App 20060237855 - Kroehnert; Steffen ; et al. | 2006-10-26 |
| Substrate for an FBGA semiconductor component App 20060180929 - Kroehnert; Steffen ; et al. | 2006-08-17 |
| Method for producing an FBGA component and substrate for carrying out the method App 20060180921 - Kroehnert; Steffen ; et al. | 2006-08-17 |
| Substrate-based IC package Grant 7,030,473 - Reiss , et al. April 18, 2 | 2006-04-18 |
| Substrate-based BGA package, in particular FBGA package App 20060017149 - Reiss; Martin ; et al. | 2006-01-26 |
| Substrate-based die package with BGA or BGA-like components App 20050285247 - Reiss, Martin ; et al. | 2005-12-29 |
| Substrate-based chip package Grant 6,949,820 - Reiss , et al. September 27, 2 | 2005-09-27 |
| Arrangement for improving the reliability of semiconductor modules App 20050093175 - Reiss, Martin ; et al. | 2005-05-05 |
| Substrate-based chip package App 20050006741 - Reiss, Martin ; et al. | 2005-01-13 |
| Substrate-based IC package App 20040256705 - Reiss, Martin ; et al. | 2004-12-23 |
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