Krishnapura; Lakshminarasimha

Patent Applications and Registrations

Patent applications and USPTO patent grants for Krishnapura; Lakshminarasimha.The latest application filed is for "biological solids processing".

Company Profile

0.14.14

Krishnapura; Lakshminarasimha - Boca Raton FL
Krishnapura; Lakshminarasimha - Delray Beach FL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Biological Solids Processing App 20220259113 - Anderson; Thomas M. ; et al.	2022-08-18
Biological solids processing Grant 11,358,907 - Anderson , et al. June 14, 2	2022-06-14
Biological Solids Processing App 20210284562 - Anderson; Thomas M. ; et al.	2021-09-16
Method And Apparatus For Separating Solid Impurities From A Fluid App 20170319987 - COOK; Russell L. ; et al.	2017-11-09
Method and apparatus for separating solid impurities from a fluid Grant 9,656,188 - Cook , et al. May 23, 2	2017-05-23
Method And Apparatus For Separating Solid Impurities From A Fluid App 20150108073 - COOK; Russell L. ; et al.	2015-04-23
Method and apparatus for separating solid impurities from a fluid Grant 8,945,401 - Cook , et al. February 3, 2	2015-02-03
Method And Apparatus For Separating Solid Impurities From A Fluid App 20130037494 - Cook; Russell L. ; et al.	2013-02-14
Apparatus for and method of manufacturing a semiconductor die carrier Grant 6,857,173 - Crane, Jr. , et al. February 22, 2	2005-02-22
Electrical connector having staggered hold-down tabs App 20040203281 - Crane, Stanford W. JR. ; et al.	2004-10-14
Open-cavity semiconductor die package Grant 6,709,891 - Crane, Jr. , et al. March 23, 2	2004-03-23
Electrical connector having electrically conductive shielding Grant 6,679,733 - Crane, Jr. , et al. January 20, 2	2004-01-20
Open-cavity semiconductor die package App 20030003626 - Crane, Stanford W. JR. ; et al.	2003-01-02
Multi-chip module having interconnect dies App 20020176238 - Crane, Stanford W. JR. ; et al.	2002-11-28
Female contact pin including flexible contact portion Grant 6,461,197 - Crane, Jr. , et al. October 8, 2	2002-10-08
Electrical connector having staggered hold-down tabs App 20020042225 - Crane, Stanford W. JR. ; et al.	2002-04-11
Integrated connector and semiconductor die package App 20020019174 - Crane, Stanford W. JR. ; et al.	2002-02-14
Open-cavity semiconductor die package App 20020008308 - Crane, Stanford W. JR. ; et al.	2002-01-24
Multi-chip module having interconnect dies App 20010040792 - Crane, Stanford W. JR. ; et al.	2001-11-15
Electrical connector assembly App 20010034164 - Crane, Stanford W. JR. ; et al.	2001-10-25
Open-cavity semiconductor die package Grant 6,307,258 - Crane, Jr. , et al. October 23, 2	2001-10-23
Electrical connector assembly with a female electrical connector having internal flexible contact arm Grant 6,247,972 - Crane, Jr. , et al. June 19, 2	2001-06-19
Electrical connector having staggered hold-down tabs Grant 6,050,850 - Crane, Jr. , et al. April 18, 2	2000-04-18
Cooling system for semiconductor die carrier Grant 6,031,720 - Crane, Jr. , et al. February 29, 2	2000-02-29
Multi-chip module having interconnect dies Grant 6,016,256 - Crane, Jr. , et al. January 18, 2	2000-01-18
Interface optimized computer system architecture Grant 5,951,665 - Crane, Jr. , et al. September 14, 1	1999-09-14

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