loadpatents
Patent applications and USPTO patent grants for Krishnapura; Lakshminarasimha.The latest application filed is for "biological solids processing".
Patent | Date |
---|---|
Biological Solids Processing App 20220259113 - Anderson; Thomas M. ;   et al. | 2022-08-18 |
Biological solids processing Grant 11,358,907 - Anderson , et al. June 14, 2 | 2022-06-14 |
Biological Solids Processing App 20210284562 - Anderson; Thomas M. ;   et al. | 2021-09-16 |
Method And Apparatus For Separating Solid Impurities From A Fluid App 20170319987 - COOK; Russell L. ;   et al. | 2017-11-09 |
Method and apparatus for separating solid impurities from a fluid Grant 9,656,188 - Cook , et al. May 23, 2 | 2017-05-23 |
Method And Apparatus For Separating Solid Impurities From A Fluid App 20150108073 - COOK; Russell L. ;   et al. | 2015-04-23 |
Method and apparatus for separating solid impurities from a fluid Grant 8,945,401 - Cook , et al. February 3, 2 | 2015-02-03 |
Method And Apparatus For Separating Solid Impurities From A Fluid App 20130037494 - Cook; Russell L. ;   et al. | 2013-02-14 |
Apparatus for and method of manufacturing a semiconductor die carrier Grant 6,857,173 - Crane, Jr. , et al. February 22, 2 | 2005-02-22 |
Electrical connector having staggered hold-down tabs App 20040203281 - Crane, Stanford W. JR. ;   et al. | 2004-10-14 |
Open-cavity semiconductor die package Grant 6,709,891 - Crane, Jr. , et al. March 23, 2 | 2004-03-23 |
Electrical connector having electrically conductive shielding Grant 6,679,733 - Crane, Jr. , et al. January 20, 2 | 2004-01-20 |
Open-cavity semiconductor die package App 20030003626 - Crane, Stanford W. JR. ;   et al. | 2003-01-02 |
Multi-chip module having interconnect dies App 20020176238 - Crane, Stanford W. JR. ;   et al. | 2002-11-28 |
Female contact pin including flexible contact portion Grant 6,461,197 - Crane, Jr. , et al. October 8, 2 | 2002-10-08 |
Electrical connector having staggered hold-down tabs App 20020042225 - Crane, Stanford W. JR. ;   et al. | 2002-04-11 |
Integrated connector and semiconductor die package App 20020019174 - Crane, Stanford W. JR. ;   et al. | 2002-02-14 |
Open-cavity semiconductor die package App 20020008308 - Crane, Stanford W. JR. ;   et al. | 2002-01-24 |
Multi-chip module having interconnect dies App 20010040792 - Crane, Stanford W. JR. ;   et al. | 2001-11-15 |
Electrical connector assembly App 20010034164 - Crane, Stanford W. JR. ;   et al. | 2001-10-25 |
Open-cavity semiconductor die package Grant 6,307,258 - Crane, Jr. , et al. October 23, 2 | 2001-10-23 |
Electrical connector assembly with a female electrical connector having internal flexible contact arm Grant 6,247,972 - Crane, Jr. , et al. June 19, 2 | 2001-06-19 |
Electrical connector having staggered hold-down tabs Grant 6,050,850 - Crane, Jr. , et al. April 18, 2 | 2000-04-18 |
Cooling system for semiconductor die carrier Grant 6,031,720 - Crane, Jr. , et al. February 29, 2 | 2000-02-29 |
Multi-chip module having interconnect dies Grant 6,016,256 - Crane, Jr. , et al. January 18, 2 | 2000-01-18 |
Interface optimized computer system architecture Grant 5,951,665 - Crane, Jr. , et al. September 14, 1 | 1999-09-14 |
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